Abstract: Provided is a printed circuit board which can be improved in plating adhesiveness to give high reliability and productivity by reducing development residues in opening portions such as a minute pad formed in a predetermined region of an alkali development type solder resist layer, and a manufacturing method thereof. An alkali development type solder resist layer containing a carboxyl group-containing urethane (meth)acrylate compound as a carboxyl group-containing resin is formed on a substrate surface with a conductor pattern formed thereon, and the alkali development type solder resist layer is exposed in a predetermined opening pattern, developed in a dilute aqueous alkaline solution, washed with water containing 30 to 1,000 ppm of divalent metal ions, and then thermally cured to form an opening portion at a predetermined position of the alkali development type solder resist layer.

Abstract: An adhesive pattern (4) is formed by applying a photocurable and thermosetting adhesive comprising as indispensable ingredients (A) a carboxyl group-containing photosensitive prepolymer having both a carboxyl group and an ethylenically unsaturated bond in its molecule and an acid value in the range of 30 to 160 mg KOH/g, (B) an epoxy resin, and (C) a photopolymerization initiator onto a surface of a substrate (1) as a member to be bonded to form a coating film; selectively exposing the coating film to an active energy ray through a photomask (3) according to a predetermined pattern, thereafter removing an unexposed portion by development with an aqueous alkaline solution. Then, a sheet member (5) as a joining member is pressed onto the adhesive pattern mentioned above, and the adhesive pattern is thermally cured to obtain a laminated structure.

Abstract: A photocuring composition includes black particles (A), black particles (B), an organic binder (C), a photopolymerizable monomer (D), and a photopolymerization initiator (E). The black particles (B) have a volume resistivity lower than the volume resistivity of the black particles (A) and an average diameter larger than the average diameter of the black particles (A).

Abstract: An actinic energy ray-curable resin is obtained by reacting an unsaturated monocarboxylic acid (c) with a terminal epoxy group of an epoxy resin having an unsaturated group and a hydroxyl group in its side chains and an epoxy group in its terminal and further reacting a polybasic acid anhydride (d) with the hydroxyl group of the above-mentioned epoxy resin, wherein the above-mentioned epoxy resin is a product of the polyaddition reaction of a reaction product (I) of a polybasic acid anhydride (a) and a compound (b) having at least one unsaturated double bond and one alcoholic hydroxyl group in its molecule, a compound (II) having at least two carboxyl groups in its molecule, and a bifunctional epoxy compound (III), wherein at least either one of the carboxyl group-containing compound (II) and the bifunctional epoxy compound (III) is a compound containing no aromatic ring.

Abstract: A thermosetting resin composition comprising (A) a thermoplastic resin having a structure represented by the following general formula (a) and/or a structure represented by the following general formula (b) in which 5 to 99 mol % of hydroxyl groups of polyhydroxyether are esterified, and (B) a thermosetting resin: wherein R1 represents C1-18 aliphatic or aromatic-ring-containing alkylene group or —SO2—, 5 to 99 mol % of R2 represent a straight chain or cyclic carbonyl group or aromatic carbonyl group having 1 to 20 carbon atoms, the residue 95 to 1 mol % represent a hydrogen atom, and R3 represents a hydrogen atom or a methyl group, with a proviso that a plurality of R3's may be the same or different.

Abstract: A photosensitive conductive composition including a silver powder having an X-ray diffraction pattern in which a half width of a silver (111) peak is at least about 0.15°, an organic binder, a photopolymerizable monomer, a photopolymerization initiator and a lead-free glass.

Abstract: A solid electrolytic capacitor includes an anode body formed with a dielectric oxide film, a laminate cathode provided on the dielectric oxide film, a cathode lead frame provided on the cathode, and an anode lead frame attached to a lead portion of the anode body. The laminate cathode includes a solid electrolyte layer, and a mixture layer of a mixture of silver flake particles and carbon particles provided directly on an outer surface of the solid electrolyte layer.

Abstract: A photocurable and thermosetting composition for an ink jet system comprises (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in its molecule, (B) a photoreactive diluent having a weight-average molecular weight of not more than 700 other than the component (A) mentioned above, and (C) a photopolymerization initiator and has a viscosity of not more than 150 mPa.s at 25° C. A solder resist pattern is directly drawn on a printed circuit board by means of an ink jet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy ray and then further cured by heating.

Abstract: A solid electrolytic capacitor includes an anode body formed with a dielectric oxide film, a laminate cathode provided on the dielectric oxide film, a cathode lead frame provided on the cathode, and an anode lead frame attached to a lead portion of the anode body. The laminate cathode includes a solid electrolyte layer, and a mixture layer of a mixture of silver flake particles and carbon particles provided directly on an outer surface of the solid electrolyte layer.

Abstract: A photosensitive conductive composition including a silver powder having an X-ray diffraction pattern in which a half width of a silver (111) peak is at least about 0.15°, an organic binder, a photopolymerizable monomer, a photopolymerization initiator and a lead-free glass.