Patents Assigned to Tanaka Kikinzoku Kogyo K.K.
  • Patent number: 12245498
    Abstract: The present invention relates to an organoiridium complex for an organic electroluminescent element in which a C—N ligand and an ancillary ligand are coordinated with iridium. This organoiridium complex contains a 2-(dibenzo[b,d]thiophen-4-yl)quinolinate ligand having at least one methyl group introduced thereinto coordinated as the C—N ligand, and is represented by the following Formula. The present inventive organoiridium complex is suitable as a red emitting phosphorescent material for an OLED, has high photoluminescence quantum yield ?PL, and is excellent in color purity. (In the aforementioned Formula, R1, R2, R3, R4, R5, R6, and R7 are each a methyl group or a hydrogen atom, provided that at least one of R1, R2, R3, R4 is a methyl group; and X—Y is the ancillary ligand.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: March 4, 2025
    Assignees: TANAKA KIKINZOKU KOGYO K.K., UNIVERSITY PUBLIC CORPORATION OSAKA
    Inventors: Yasushi Masahiro, Junichi Taniuchi, Shigeyuki Yagi
  • Publication number: 20250059642
    Abstract: The present invention is drawn to a raw material for chemical deposition for producing a ruthenium thin film or a ruthenium compound thin film by a chemical deposition method, containing an organoruthenium compound represented by the following formula 1, and further containing ?-diketone that is the same as a ligand of the organoruthenium compound. The raw material for chemical deposition of the present invention is inhibited in discoloration/precipitation even when heated at a high temperature, and enables to form a stable ruthenium thin film or ruthenium compound thin film. wherein substituents R1 and R2 are each hydrogen, or a linear or branched alkyl group.
    Type: Application
    Filed: November 5, 2024
    Publication date: February 20, 2025
    Applicant: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Kazuharu SUZUKI, Yuki Mori, Subhabrata Das, Hirofumi Nakagawa, Shunichi Nabeya
  • Patent number: 12230485
    Abstract: A sputtering target for a magnetic recording medium, comprises: a metal phase containing Pt and at least one or more selected from Mn and V, with the balance being Co and incidental impurities; and an oxide phase containing at least B and O.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: February 18, 2025
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Tomonari Kamada, Ryousuke Kushikibi
  • Publication number: 20250051909
    Abstract: A raw material for chemical deposition for producing a manganese thin film or a manganese compound thin film by chemical deposition method, including an organomanganese compound represented Chemical Formula 1 in which a cyclopentadienyl ligand and an isocyanide ligand are coordinated to manganese, which has basic characteristics as a raw material for chemical deposition and enables formation of a manganese thin film with a reducing gas such as hydrogen used as a reaction gas.
    Type: Application
    Filed: September 26, 2024
    Publication date: February 13, 2025
    Applicant: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Ryosuke HARADA, Tomohiro Tsugawa, Toshiyuki Shigetomi, Seung-Joon Lee, Ketan Baban Katkar
  • Patent number: 12163034
    Abstract: A silver ink including silver particles and a protective agent containing at least one amine compound dispersed in a dispersion medium containing, as a main solvent, a solvent having a vapor pressure at 20° C. of 40 mmHg or less and a vapor pressure at 70° C. of 0.09 mmHg or more, in an amount of 80% or more on a mass basis relative to the total dispersion medium. The amine compound has a mass average molecular weight of 115 or less, and the total amount of the amine compound is 1 part by weight or more and 14 parts by weight or less per 100 parts by weight of the silver particles. The silver ink has a moisture content of 500 ppm or more and 50,000 ppm or less and enables a practical metal film to be formed even through calcination at a low temperature of 70° C. or less.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: December 10, 2024
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Yuusuke Ohshima, Yuichi Makita, Hiroki Sato, Noriaki Nakamura, Kenjiro Koshiji, Masato Kasuga, Hitoshi Kubo
  • Patent number: 12157170
    Abstract: A bonding method in which applied is a prescribed conductive bonding material, which contains a molded article of a metal powder. The metal powder is one or more selected from the group consisting of a gold powder, a silver powder, a platinum powder, and a palladium powder, and has a purity of 99.9% by mass or more, and an average particle size of 0.005 ?m to 1.0 ?m, and the conductive bonding material has a compressive deformation rate M, represented by the following expression, of 5% or more and 30% or less when compressed with a compression pressure of 5 MPa. [Expression 1] M={(h1?h2)/h1}×100, wherein h1 represents an average thickness of the conductive bonding material before compression, and h2 represents an average thickness of the conductive bonding material after the compression.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: December 3, 2024
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Toshinori Ogashiwa, Kazuo Ueda
  • Patent number: 12152300
    Abstract: A raw material for chemical deposition for producing a manganese thin film or a manganese compound thin film by chemical deposition method, including an organomanganese compound represented Chemical Formula 1 in which a cyclopentadienyl ligand and an isocyanide ligand are coordinated to manganese, which has basic characteristics as a raw material for chemical deposition and enables formation of a manganese thin film with a reducing gas such as hydrogen used as a reaction gas.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: November 26, 2024
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Ryosuke Harada, Tomohiro Tsugawa, Toshiyuki Shigetomi, Seung-Joon Lee, Ketan Baban Katkar
  • Publication number: 20240382908
    Abstract: A hydrogen permeable membrane that includes a PdCu alloy and can be used for hydrogen purification. The hydrogen permeable membrane includes 38.75 mass % or more and 39.5 mass % or less of Cu with the balance being Pd and inevitable impurities as the PdCu alloy, and the area percentage of a ? phase on an arbitrary cross section is 95% or more. The hydrogen permeable membrane of the present invention has a hydrogen permeability coefficient ? of 2.0×10?8 mol/m·S·Pa1/2 or more at any temperature in a temperature range of 150° C. or higher and 350°° C. or lower. This value exceeds the hydrogen permeability coefficient of a PdCu alloy membrane containing Cu concentration of 40 mass %, which has been thus far considered to be optimal, demonstrating that the present invention is excellent in terms of hydrogen permeability.
    Type: Application
    Filed: August 22, 2022
    Publication date: November 21, 2024
    Applicant: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Daisuke HORIKAWA, Toru MATSUMURA, Masato EBISUGI, Shuichi KUBOTA
  • Publication number: 20240363873
    Abstract: A catalyst for an oxygen reduction reaction containing catalyst particles having a shell-core structure containing a PtCo alloy or a PtCoMn alloy as a core, and platinum as a shell layer. A specific plane of a face-centered cubic lattice is formed by a plurality of platinum atoms contained in the shell layer, and a lattice constant of the plane of the face-centered cubic lattice on the catalyst particle surface is 3.70 ? or more and 4.05 ? or less (in a PtCo alloy), or 3.870 ? or more and 4.10 ? or less (in a PtCoMn alloy). A catalyst design method includes a step of calculating, with respect to an orientation plane such as the plane formed by platinum atoms of the shell layer, adsorption energies for an oxygen molecule, an OH group and a water molecule by first-principles calculation based on density functional theory.
    Type: Application
    Filed: July 9, 2024
    Publication date: October 31, 2024
    Applicants: TANAKA KIKINZOKU KOGYO K.K., NATIONAL INSTITUTE OF TECHNOLOGY
    Inventors: Minoru ISHIDA, Koichi MATSUTANI, Hiroshi NAKANISHI, Hideaki KASAI, Bhume CHANTARAMOLEE, Susan Menez ASPERA
  • Publication number: 20240336763
    Abstract: The present invention relates to a metal paste for forming a metal wiring containing a solid content of a silver particle and kneaded with a solvent. The solid content of the metal paste contains a silver particle having prescribed particle size distribution and average particle size, and using an amine compound as a protective agent. The solvent is a mixed solvent in which two organic solvents of a solvent A and a solvent B are mixed. The solvent A is dihydroterpineol or terpineol, and the solvent B is at least one organic solvent having a boiling point of 240° C. or more. The mixed solvent has a Hansen solubility parameter distance Ra from dihydroterpineol of 3.0 MPa1/2 or less. The metal paste further contains a high molecular weight ethyl cellulose as a first additive, and a polyvinyl acetal resin as a second additive.
    Type: Application
    Filed: October 4, 2022
    Publication date: October 10, 2024
    Applicant: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Hiroki SATO, Yuki FUJITA, Teruhisa IWAI, Yuusuke OHSHIMA, Shuntaro TAKAHASHI, Shigeyuki OOTAKE
  • Patent number: 12104236
    Abstract: The present invention provides a shape-memory alloy including a Au—Cu—Al alloy having 20 at % or more and 40 at % or less Cu and 15 at % or more and 30 at % or less Al, with the balance being Au and inevitable impurities. The shape-memory alloy has a Vickers hardness of 360 Hv or less. The Au—Cu—Al alloy of the present invention is an alloy capable of developing both biocompatibility and a shape-memory effect, and further capable of achieving artifactlessness in a magnetic environment. The Au—Cu—Al alloy can be produced by heat-treating a clad material formed of a combination of a hollow material made of a Au—Cu alloy and a core material made of metallic Al at 500° C. or more and 700° C. or less.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: October 1, 2024
    Assignees: TOKYO INSTITUTE OF TECHNOLOGY and, TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Hideki Hosoda, Akira Umise, Kenji Goto
  • Publication number: 20240321705
    Abstract: The interposer substrate is joined in an overlapping state to one or more members having a connection part at one place or more, and electrically connected to the member. The interposer substrate includes a base material having one or more connection regions corresponding to connection parts of the member to be joined. A plurality of through-holes are formed in the connection region. A segment as one unit for electrical connection is constituted by forming the plurality of through-holes adjacent to each other. One or more segments are formed in the connection region. In the through-hole are formed a through electrode and a bump with a wide width formed at an end of the through electrode. The through electrode and bump are composed of a metal powder sintered body formed by sintering a metal powder including gold or the like having a predetermined purity and average particle size.
    Type: Application
    Filed: December 13, 2021
    Publication date: September 26, 2024
    Applicant: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Koichi SAKAIRI, Toshinori OGASHIWA, Mitsutomo NISHIZAWA
  • Publication number: 20240313137
    Abstract: A photoelectric conversion element including a thin film composed of a transition metal dichalcogenide and formed on a base material. In the present invention, a surface of the thin film composed of the transition metal dichalcogenide is modified with at least any nanorod particles of Au nanorod particles composed of Au and Ag nanorod particles composed of Ag. An average aspect ratio of the Au nanorod particles is 3.0 or more and 12.0 or less, and an average aspect ratio of the Ag nanorod particles is 3.0 or more and 13.0 or less. In the invention, the sensitivity to light having wavelengths in the near-infrared region improves by a sensitizing action attributed to localized surface plasmon resonance that is developed by the Au and Ag nanorod particles. The photoelectric conversion element exhibits sensitivity even to light having wavelengths in the near-infrared region near a wavelength range of 1600 nm.
    Type: Application
    Filed: October 4, 2021
    Publication date: September 19, 2024
    Applicants: TANAKA KIKINZOKU KOGYO K.K., University Industry Foundation, Yonsei University
    Inventors: Tatsuya NAKAZAWA, Shinichi KATO, Hyung Jun KIM, Dong Hyun KIM
  • Patent number: 12091748
    Abstract: The present invention relates to a ruthenium thin film-forming method for forming a ruthenium thin film using a ruthenium precursor, in which tricarbonyl (?4-methylene-1,3-propanediyl) ruthenium ((CO)3Ru-TMM)) having a structure represented by the following formula 1 is used as the ruthenium precursor, and the method includes a stage of forming a ruthenium thin film by an atomic layer deposition at a temperature ranging from 200° C. to 350° C. using this ruthenium precursor and a reaction gas. As the reaction gas, one or more selected from the group consisting of oxygen, hydrogen, water and ammonia are preferably applied.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: September 17, 2024
    Assignees: RESEARCH COOPERATION FOUNDATION OF YEUNGNAM UNIVERSITY, TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Soo-Hyun Kim, Yohei Kotsugi
  • Patent number: 12062796
    Abstract: A catalyst for an oxygen reduction reaction containing catalyst particles having a shell-core structure containing a PtCo alloy or a PtCoMn alloy as a core, and platinum as a shell layer. A specific plane of a face-centered cubic lattice is formed by a plurality of platinum atoms contained in the shell layer, and a lattice constant of the plane of the face-centered cubic lattice on the catalyst particle surface is 3.70 ? or more and 4.05 ? or less (in a PtCo alloy), or 3.870 ? or more and 4.10 ? or less (in a PtCoMn alloy). A catalyst design method includes a step of calculating, with respect to an orientation plane such as the plane formed by platinum atoms of the shell layer, adsorption energies for an oxygen molecule, an OH group and a water molecule by first-principles calculation based on density functional theory.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: August 13, 2024
    Assignees: TANAKA KIKINZOKU KOGYO K.K., NATIONAL INSTITUTE OF TECHNOLOGY
    Inventors: Minoru Ishida, Koichi Matsutani, Hiroshi Nakanishi, Hideaki Kasai, Bhume Chantaramolee, Susan Menez Aspera
  • Patent number: 12054417
    Abstract: A bushing for producing glass fibers, including: a plurality of nozzles made of platinum or the like to discharge molten glass; and a base plate made of platinum or the like. A coating layer is preferentially formed on an outer circumferential face on a tip part on the side of glass discharge of the nozzle, and a width of the coating layer is 5% or more and 95% or less with respect to the entire length of the nozzle. The base plate includes a non-coating area. Areas of the nozzles and the base plate not provided with the coating layer act as a sacrificial metal for protecting the nozzle tip parts. In consideration of the sacrificial metal, a coverage rate P of the coating layer on the nozzle tip parts calculated with a prescribed equation is preferably 5% or more and 350% or less.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: August 6, 2024
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Hideo Segawa, Jumpei Suzuki, Shigekazu Onozumi
  • Publication number: 20240258446
    Abstract: The present invention relates to a thin film containing a chalcogenide of Ir or Ru of a platinum group metal. This thin film is formed on a prescribed substrate, contains a platinum group metal chalcogenide, and the platinum group metal chalcogenide contains any one of Ir2S3, IrS2, RuS2, and RuSe2. A thickness of the thin film is 0.5 nm or more and 500 nm or less. The present invention has revealed, through an experimental method and simulation using first-principles calculation based on density functional theory (DFT), that a thin film containing Ir2S3, IrS2, RuS2 or RuSe2 can exhibit a photoelectric effect by near infrared light irradiation. The present invention is drawn to a thin film that is characterized by sensitivity to light with a wavelength in a near infrared region in particular, and contains a platinum group metal chalcogenide having a constitution previously unknown.
    Type: Application
    Filed: March 10, 2022
    Publication date: August 1, 2024
    Applicants: TANAKA KIKINZOKU KOGYO K.K., UNIVERSITY INDUSTRY FOUNDATION, YONSEI UNIVERSITY
    Inventors: Tatsuya NAKAZAWA, Hyung Jun KIM, Dong Hyun KIM
  • Patent number: 12031196
    Abstract: The aim of the present invention is to provide a metal powder for an electroconductive paste with which a low-resistance electrode film can be formed. One embodiment of the present invention relates to a platinum-containing or platinum-alloy-containing metal powder for an electroconductive paste, the metal powder including a metal element or metal elements other than Pt, wherein the metal elements other than Pt include at least Ca, and may further include Al and Zr, and the total content of the Ca, Al and Zr among the metal elements other than Pt is 10-900 mass ppm.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: July 9, 2024
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Takuya Hosoi, Akio Nagaoka, Keisuke Maeto
  • Patent number: 12035470
    Abstract: An electroconductive substrate including a base material and a metal wiring made of at least either of silver and copper, and the electroconductive substrate has an antireflection region formed on part or all of the metal wiring surface. This antireflection region is composed of roughened particles made of at least either of silver and copper and blackened particles finer than the roughened particles and embedded between the roughened particles. The blackened particles are made of silver or a silver compound, copper or a copper compound, or carbon or an organic substance having a carbon content of 25 wt % or more. The antireflection region has a surface with a center line average roughness of 15 nm or more and 70 nm or less. The electroconductive substrate is formed from metal wiring from a metal ink that forms roughened particles, followed by application of a blackening ink containing blackened particles.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: July 9, 2024
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Kenjiro Koshiji, Yuichi Makita, Noriaki Nakamura, Masato Kasuga, Yuusuke Ohshima, Hiroki Sato, Hitoshi Kubo
  • Patent number: 12015161
    Abstract: The present invention relates to a catalyst for solid polymer fuel cells in which catalyst particles containing Pt as an essential catalyst metal are supported on a carbon powder carrier. The catalyst has good initial activity and good durability. When the catalyst is analyzed by X-ray photoelectron spectroscopy after potential holding at 1.2 V (vs. RHE) for 10 minutes in a perchloric acid solution, a ratio of zero-valent Pt to total Pt is 75% or more and 95% or less. The present inventive catalyst metal is preferably one obtained by alloying Pt with one of Co, Ni and Fe, and further with one of Mn, Ti, Zr and Sn. In addition, it is preferable that a fluorine compound having a C—F bond is supported on at least the surfaces of catalyst particles in an amount of 3 to 20 mass % based on the total mass of the catalyst.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: June 18, 2024
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventor: Minoru Ishida