Abstract: A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.

Abstract: An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined.

Abstract: A probe pin material including a Ag—Pd—Cu-based alloy essentially including Ag, Pd and Cu, B as a first additive element, and at least any element of Zn, Bi and Sn, as a second additive element. A concentration of the first additive element is 0.1 mass % or more and 1.5 mass % or less, and a concentration of the second additive element is 0.1 mass % or more and 1.0 mass % or less. A Ag concentration, a Pd concentration and a Cu concentration in the Ag—Pd—Cu-based alloy are required as follows: a Ag concentration (SAg), a Pd concentration (SPd) and a Cu concentration (SCu) converted as given that a Ag—Pd—Cu ternary alloy is formed from only such three elements all fall within a predetermined range in a Ag—Pd—Cu ternary system phase diagram. The probe pin material is excellent in resistance value and hardness/wear resistance, and also is enhanced in bending resistance.

Abstract: The present invention is drawn to a medical Pt alloy wire, made of a Pt—W alloy containing 10% by mass or more and 15% by mass or less of W, a balance of Pt, and inevitable impurities. The Pt alloy wire has Vickers hardness of 400 Hv or more and 600 Hv or less, and has hardness and strength superior to those of a conventional Pt alloy wire having the same composition. The Pt alloy wire of the present invention has properties preferable as a coil applied to an embolic coil or a guide wire or the like, and is also good in workability in secondary processing for producing such a medical tool.

Abstract: The present invention relates to a ruthenium thin film-forming method for forming a ruthenium thin film using a ruthenium precursor, in which tricarbonyl (?4-methylene-1,3-propanediyl) ruthenium ((CO)3Ru-TMM)) having a structure represented by the following formula 1 is used as the ruthenium precursor, and the method includes a stage of forming a ruthenium thin film by an atomic layer deposition at a temperature ranging from 200° C. to 350° C. using this ruthenium precursor and a reaction gas. As the reaction gas, one or more selected from the group consisting of oxygen, hydrogen, water and ammonia are preferably applied.

Abstract: The present invention relates to a metal wiring, to be formed on a flexible substrate, including a sintered body of silver particles. The sintered body constituting the metal wiring has a volume resistivity of 20 ??·cm or less, hardness of 0.38 GPa or less, and a Young's modulus of 7.0 GPa or less. A conductive sheet provided with the metal wiring can be produced by applying/calcinating, on a substrate, a metal paste containing, as a solid content, silver particles having prescribed particle size and particle size distribution, and further containing, as a conditioner, an ethyl cellulose having a number average molecular weight of 10,000 or more and 90,000 or less. The metal wiring of the present invention is excellent in bending resistance with change in electrical characteristics suppressed even through repetitive bending deformation.

Abstract: An in-plane magnetized film for use as a hard bias layer of a magnetoresistive effect element contains metal Co, metal Pt, and an oxide and has a thickness of 20 nm or more and 80 nm or less, wherein: the in-plane magnetized film contains the metal Co in an amount of 45 at% or more and 80 at% or less and the metal Pt in an amount of 20 at% or more and 55 at% or less relative to a total of metal components of the in-plane magnetized film; the in-plane magnetized film contains the oxide in an amount of 3 vol% or more and 25 vol% or less relative to a whole amount of the in-plane magnetized film; and the in-plane direction average grain diameter of magnetic crystal grains of the in-plane magnetized film is 15 nm or more and 30 nm or less.

Abstract: The present invention relates to a methane combustion catalyst including platinum and iridium supported on a tin oxide carrier for combusting methane in a combustion exhaust gas containing sulfur oxide. In the methane combustion catalyst, a ratio RTO of platinum oxides to metal platinum is 8.00 or more, wherein the ratio RTO is based on existence percentages of the metal platinum (Pt) and the platinum oxides (PtO and PtO2) obtained from a platinum 4f spectrum analyzed and measured by X-ray photoelectron spectroscopy (XPS) and calculated in accordance with the following expression. In the following expression, RPt is an existence percentage of the metal platinum (Pt), RPto is an existence percentage of PtO, and RPto2 is an existence percentage of PtO2.

Abstract: An in-plane magnetized film multilayer structure for use as a hard bias layer of a magnetoresistive effect element contains a plurality of in-plane magnetized films and a nonmagnetic intermediate layer. The nonmagnetic intermediate layer is disposed between the in-plane magnetized films, and the in-plane magnetized films adjacent across the nonmagnetic intermediate layer are coupled by a ferromagnetic coupling. Each of the in-plane magnetized films contains metal Co and metal Pt, and contains the metal Co in an amount of 45 at % or more and 80 at % or less and the metal Pt in an amount of 20 at % or more and 55 at % or less relative to a total of metal components of the each of the in-plane magnetized films. A total thickness of the plurality of in-plane magnetized films is 30 nm or more.

Abstract: The present invention is an embolization coil having an optimum morphological stability. The embolization coil includes a wire material made of an Au—Pt alloy. The wire material constituting the embolization coil has such a composition that a Pt concentration is 24 mass % or more and less than 34 mass %, with the balance being Au. The wire material has such a material structure that a Pt-rich phase of an Au—Pt alloy having a Pt concentration of 1.2 to 3.8 times a Pt concentration of an ? phase is distributed in an ? phase matrix. The wire material has a bulk susceptibility of ?13 ppm or more and ?5 ppm or less. In a material structure of a transverse cross-section of the wire material, an average value of two or more average crystal particle diameters measured by a linear intercept method is 0.20 ?m or more and 0.35 ?m or less.

Abstract: A silver brazing material containing silver, copper, zinc, manganese, nickel, and tin as indispensable constituent elements. The silver brazing material includes 35 mass % or more and 45 mass % or less silver, 18 mass % or more and 28 mass % or less zinc, 2 mass % or more and 6 mass % or less manganese, 1.5 mass % or more and 6 mass % or less nickel, and 0.5 mass % or more and 5 mass % or less tin, with the balance being copper impurities. Within these compositional ranges, a predetermined relation is set between the manganese content and the nickel content, whereby the silver brazing material can be provided with excellent characteristics also in terms of processability or wettability. In the silver brazing material of the present invention, the silver content is reduced, and also melting point reduction and the narrowing of the temperature difference between solidus temperature and liquidus temperature are attempted.

Abstract: A gold sputtering target is made of gold and inevitable impurities, and has a surface to be sputtered. In the gold sputtering target, an average value of Vickers hardness is 40 or more and 60 or less, and an average crystal grain size is 15 ?m or more and 200 ?m or less. A {110} plane of gold is preferentially oriented at the surface to be sputtered.

Abstract: The present invention relates to a medical Au-Pt-Pd alloy including Au, Pt,Pd, and inevitable impurities. The Au-Pt-Pd alloy has an alloy compositioninside a polygon (A1-A2-A3-A4) surrounded by straight lines connected at pointA1 (Au: 53 atom%, Pt: 4 atom%, and Pd: 43 atom%), point A2 (Au: 70 atom%,Pt: 4 atom%, and Pd: 26 atom%), point A3 (Au: 69.9 atom%, Pt: 30 atom%, and Pd: 0.1 atom%), and point A4 (Au: 49.9 atom%, Pt: 50 atom%, and Pd: 0.1 atom%) in a Au-Pt-Pd ternary state diagram. In a metal structure of the alloy, at least one of a Au-rich phase and a Pt-rich phase is distributed, and the total of the area ratio of the Au-rich phase and the area ratio of the Pt-rich phase is 1.5% or more and 25.4% or less.

Abstract: A sealing structure including: a set of base members forming a sealed space; a through-hole which is formed in at least one of the base members, and communicates with the sealed space; and a sealing member that seals the through-hole. An underlying metal film including a bulk-like metal such as gold is provided on a surface of the base member provided with the through-hole. The sealing member seals the through-hole while being bonded to the underlying metal film, and includes: a sealing material which is bonded to the underlying metal film, and includes a compressed product of a metal powder of gold or the like, the metal powder having a purity of 99.9% by mass or more; and a lid-like metal film which is bonded to the sealing material, and includes a bulk-like metal such as gold. Further, the sealing material includes: an outer periphery-side densified region being in contact with an underlying metal film; and a center-side porous region being in contact with the through-hole.

Abstract: The present invention relates to a raw material of an organoruthenium compound for producing a ruthenium thin film or a ruthenium compound thin film by a chemical deposition method. This organoruthenium compound is an organoruthenium compound represented by the following Formula 1 and including a trimethylenemethane-based ligand (L1) and three carbonyl ligands coordinated to divalent ruthenium. In Formula 1, the trimethylenemethane-based ligand L1 is represented by the following Formula 2: wherein a substituent R of the ligand L1 is hydrogen, or any one of an alkyl group, a cyclic alkyl group, an alkenyl group, an alkynyl group, and an amino group having a predetermined number of carbon atoms.

Abstract: The present invention relates to a medical Pt—W alloy, containing 10 mass % or more and 15 mass % or less of W, with the balance being Pt and inevitable impurities, in which a Zr content is 1000 ppm or less. Limiting the Zr content can improve workability, particularly workability at the stage of hot working. Regarding impurity control, further limiting a Ca content to 250 ppm or less can provide more suitable workability. The present invention is good in workability in processing into a wire included in an embolic coil, a guide wire or the like.

Abstract: The present invention is drawn to a medical Pt alloy wire, made of a Pt—W alloy containing 10% by mass or more and 15% by mass or less of W, a balance of Pt, and inevitable impurities. The Pt alloy wire has Vickers hardness of 400 Hv or more and 600 Hv or less, and has hardness and strength superior to those of a conventional Pt alloy wire having the same composition. The Pt alloy wire of the present invention has properties preferable as a coil applied to an embolic coil or a guide wire or the like, and is also good in workability in secondary processing for producing such a medical tool.

Abstract: A bonding method in which applied is a prescribed conductive bonding material, which contains a molded article of a metal powder. The metal powder is one or more selected from the group consisting of a gold powder, a silver powder, a platinum powder, and a palladium powder, and has a purity of 99.9% by mass or more, and an average particle size of 0.005 µm to 1.0 µm, and the conductive bonding material has a compressive deformation rate M, represented by the following expression, of 5 % or more and 30% or less when compressed with a compression pressure of 5 MPa. [Expression 1] M = {(h1 - h2)/h1} x 100, wherein h1 represents an average thickness of the conductive bonding material before compression, and h2 represents an average thickness of the conductive bonding material after the compression.

Abstract: A gold sputtering target is made of gold and inevitable impurities, and has a surface to be sputtered. In the gold sputtering target, an average value of Vickers hardness is 40 or more and 60 or less, and an average crystal grain size is 15 ?m or more and 200 ?m or less. A {110} plane of gold is preferentially oriented at the surface to be sputtered.

Abstract: According to an immunochromatographic device for detecting a substance to be detected contained in a detection target in an analyte which is characterized in that a nitrous acid compound containing member having a part containing a nitrous acid compound; a labeling substance retaining member having a labeling substance containing part; an acid anhydride containing member having a part containing an acid anhydride having vapor pressure at 25° C. of 5×10?2 Pa or less; and a chromatography medium member having a detection part are arranged in a manner that a sample develops in the members in this order, the storage stability can be improved; detection with high sensitivity is possible; and the complexity of production can be reduced.