Patents Assigned to TDK Electronics
  • Capacitor and electronics module assembly with low-inductance connection features
    Patent number: 10998132
    Abstract: A capacitor includes an electrically insulating housing that encloses an interior volume, first and second conductive connection pads that are each configured as externally accessible points of electrical contact to internal electrodes of the capacitor that are disposed within the housing, and an active capacitor dielectric material disposed within the housing and being configured as a dielectric medium between the internal electrodes, the first conductive connection pad having a first planar contact surface that is substantially parallel to a first sidewall of the housing, the second conductive connection pad having a second planar contact surface that is substantially parallel to the first sidewall, the first and second planar contact surfaces being offset from one another in a direction that is orthogonal to the first sidewall.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: May 4, 2021
    Assignees: Infineon Technologies AG, TDK Electronics AG
    Inventors: Tomas Manuel Reiter, Karl Niklas
  • Core Component
    Publication number: 20210098179
    Abstract: In an embodiment a core component includes a base plate, a plurality of members arranged on corners of the base plate and delimiting an inner region of the core component and a center piece located in the inner region and having an oval basic shape.
    Type: Application
    Filed: September 16, 2020
    Publication date: April 1, 2021
    Applicant: TDK Electronics AG
    Inventor: Michael Rottner
  • Ceramic material, component, and method for producing the component
    Patent number: 10961159
    Abstract: A ceramic material, a component, and a method for producing a component are disclosed. In an embodiment a ceramic material includes a structure based on a system selected from the group consisting of Ni—Co—Mn—O, Ni—Mn—O and Co—Mn—O, and at least one dopant selected from lanthanides, wherein the ceramic material has a negative temperature coefficient of an electrical resistance.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: March 30, 2021
    Assignee: TDK Electronics AG
    Inventors: Christl Lisa Mead, Cornelia Treul
  • Film Capacitor
    Publication number: 20210079179
    Abstract: A film capacitor is disclosed. In an embodiment a film capacitor includes a film comprising a blend of polypropylene and cyclo-olefin copolymer, wherein the blend includes an amount of at least two thirds by weight of polypropylene, and wherein the cyclo-olefin copolymer includes ethylene in a range of 23 weight % to 27 weight % inclusive and norbornene in a range of 73 weight % to 77 weight % inclusive.
    Type: Application
    Filed: May 15, 2018
    Publication date: March 18, 2021
    Applicants: TDK Electronics AG, TDK Electronics AG
    Inventors: Carlos Alba, David Pelaez, Lucia Cabo, Anna-Lena Majer
  • Machines Having Power-Electronic Energy Converters and Leakage Current Compensation and System
    Publication number: 20210057983
    Abstract: A device includes an EMC (electromagnetic compatibility) filter, a frequency converter coupled to the EMC filter, and a motor coupled to the frequency converter via a motor cable. A leakage current compensator includes a leakage current detector and a compensation current generator configured to generate a compensation current that is directed against the leakage current and is overlaid on the leakage current in such a way that the leakage current is reduced.
    Type: Application
    Filed: January 21, 2019
    Publication date: February 25, 2021
    Applicant: TDK Electronics AG
    Inventor: Yasin KARINCA
  • Coil Arrangement And Wireless Power Transfer System Comprising A Coil Arrangement
    Publication number: 20200357569
    Abstract: A coil arrangement with reduced core losses is provided. The coil arrangement has a first coil and a second coil and a ferrite layer below the coils. A perpendicular recess in the ferrite layer is provided to reduce magnetic flux density in a center conduction path.
    Type: Application
    Filed: January 19, 2018
    Publication date: November 12, 2020
    Applicant: TDK Electronics AG
    Inventor: Thomas LOHMANN
  • Active compensation circuit and system
    Patent number: 10819214
    Abstract: An active compensation circuit is disclosed. In an embodiment a circuit includes a first compensation stage and at least one other compensation stage, wherein each of the first compensation stage and the at least one other compensation stage includes a sensor configured to provide a sensor signal being representative of a current flowing in one or more phases, a controlled current sink configured to supply a compensation current as a function of the sensor signal and an active amplifier element configured to provide a frequency response of an open circuit voltage amplification and/or is to supply a maximal output current, wherein the frequency response differs from a frequency response of at least one other active amplifier and/or wherein the maximal output current differs from a maximal output current of at least one other active amplifier.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: October 27, 2020
    Assignee: TDK Electronics AG
    Inventors: Yasin Karinca, Michael Vornkahl
  • Electrical device with soldered joint
    Patent number: 10770204
    Abstract: An electrical device with a soldered joint is disclosed. In an embodiment, an electrical device includes at least one soldered joint having a first wire soldered at one end to the device, wherein the first wire bears with a bearing surface on the device, and wherein the first wire has at least one bend in a region of the bearing surface of the first wire on the device.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: September 8, 2020
    Assignee: TDK Electronics AG
    Inventors: Gerald Kloiber, Heinz Strallhofer
  • Arrester
    Patent number: 10770867
    Abstract: An arrester is disclosed. In an embodiment an arrester includes at least one first and one second electrode, a ceramic body for electrical isolation of the electrodes, wherein the electrodes are spaced by a distance from one another in a direction of a transverse axis of the arrester, and wherein the distance between the electrodes varies along a longitudinal axis of the arrester.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: September 8, 2020
    Assignee: TDK Electronics AG
    Inventors: Torsten Klinger, Zhipeng Fang, Frank Werner
  • Microphone array
    Patent number: 10720893
    Abstract: A microphone array is disclosed. In an embodiment a microphone array includes a power supply circuit arrangement, at least one microphone circuit and a voltage detector. The power supply arrangement includes a switched-mode power supply circuit configured to generate at least two different levels of output voltage. The at least one microphone circuit includes a microphone transducer, and audio amplifier, a switchable voltage regulator circuit supplying the amplifier. The voltage detector is configured to switch the output voltage of the voltage regulator circuit depending on the voltage supplied by the switched-mode power supply circuit.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: July 21, 2020
    Assignee: TDK Electronics AG
    Inventors: Lei Zou, Henning Petersen, Gino Rocca
  • Multi-LED system
    Patent number: 10714458
    Abstract: A multi-LED system includes a carrier; and a plurality of light-emitting diodes arranged on the carrier, wherein the carrier has a main body, and a plurality of electrical components are embedded in the main body.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: July 14, 2020
    Assignee: TDK Electronics AG
    Inventors: Thomas Feichtinger, Franz Rinner
  • Filter component for filtering an interference signal
    Patent number: 10692655
    Abstract: A filter component for filtering an interference signal. The filter component includes at least one multilayer ceramic capacitor having a main body, in which multiple ceramic layers and internal electrodes are stacked one above another, and connection contacts are arranged at the main body. The ceramic layers include a lead lanthanum zirconate titanate ceramic, for example.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: June 23, 2020
    Assignee: TDK Electronics AG
    Inventors: Fabian Beck, Florian Böhm, Jürgen Konrad, Markus Koini
  • Contact Temperature Sensor
    Publication number: 20200149974
    Abstract: A contact temperature sensor is disclosed. In an embodiment a contact temperature sensor includes a contact body including a bottom wall configured to apply the contact temperature sensor on a test body and a carrier ceramics configured to thermally directly couple the contact temperature sensor to the test body, wherein the carrier ceramics is arranged on a side of the bottom wall facing the test body, and wherein the carrier ceramics includes a metallization on a side facing the test body. The contact temperature sensor further includes a temperature sensor element thermally coupled to the carrier ceramics.
    Type: Application
    Filed: July 5, 2018
    Publication date: May 14, 2020
    Applicant: TDK Electronics AG
    Inventors: Thomas Hand, Michael Schmidt
  • Ceramic Material, Component, and Method for Producing the Component
    Publication number: 20200131091
    Abstract: A ceramic material, a component, and a method for producing a component are disclosed. In an embodiment a ceramic material includes a structure based on a system selected from the group consisting of Ni—Co—Mn—O, Ni—Mn—O and Co—Mn—O, and at least one dopant selected from lanthanides, wherein the ceramic material has a negative temperature coefficient of an electrical resistance.
    Type: Application
    Filed: August 21, 2017
    Publication date: April 30, 2020
    Applicants: TDK Electronics AG, TDK Electronics AG
    Inventors: Christl Lisa Mead, Cornelia Treul
  • Hybrid Power Supply Circuit, Use of a Hybrid Power Supply Circuit and Method for Producing a Hybrid Power Supply Circuit
    Publication number: 20200136219
    Abstract: A hybrid power supply circuit, a method using a hybrid power supply circuit and method for producing a hybrid power supply circuit are disclosed. In an embodiment a hybrid power-supply circuit includes a first energy-storage device and a second energy-storage device, wherein the first and second energy-storage devices are combined in a module and electrically interconnected, and wherein the first energy-storage device is a solid-state accumulator.
    Type: Application
    Filed: May 29, 2018
    Publication date: April 30, 2020
    Applicant: TDK Electronics AG
    Inventors: Stefan Koestner, Masahiro Oishi
  • Film Resistor and Thin-Film Sensor
    Publication number: 20200118721
    Abstract: A film resistor and a film sensor are disclosed. In an embodiment a film resistor includes a piezoresistive layer comprising a M1+nAXn phase, wherein M comprises at least one transition metal, A comprises a main-group element, and X comprises carbon and/or nitrogen, and wherein n=1, 2 or 3.
    Type: Application
    Filed: April 12, 2018
    Publication date: April 16, 2020
    Applicant: TDK Electronics AG
    Inventors: Bettina Milke, Bernhard Ostrick
  • Film Resistor and Thin-Film Sensor
    Publication number: 20200118719
    Abstract: A film resistor and a thin-film sensor are disclosed. In an embodiment a film resistor includes a piezoresistive layer including a first transition metal carbide.
    Type: Application
    Filed: June 18, 2018
    Publication date: April 16, 2020
    Applicants: TDK Electronics AG, TDK Electronics AG
    Inventors: Bettina Milke, Bernhard Ostrick
  • Crimp Interconnect Device, Crimped Arrangement and Method for Making a Crimped Arrangement
    Publication number: 20200091623
    Abstract: A crimp interconnect device, a crimped arrangement and a method for making a crimped arrangement are disclosed. In an embodiment a crimp interconnect device includes a deformable barrel body having an inner side and an outer side and a first material, and a second material that is softer than the first material, wherein the second material is arranged on the inner side.
    Type: Application
    Filed: September 28, 2018
    Publication date: March 19, 2020
    Applicant: TDK Electronics AG
    Inventor: Szabolcs Zseli
  • Spark gap arrangement
    Patent number: 10554041
    Abstract: A spark gap arrangement includes a triggerable spark gap and a trigger circuit. The spark gap arrangement also includes a first and a second charge storage device, a voltage limiting component, a trigger diode, a triggerable arresting element, and a transformer. The voltage limiting component and the trigger diode are designed to relay an input pulse in a specified voltage range and charge the first charge storage device. Furthermore, the trigger circuit is designed such that the triggerable arresting element is connected via the first charge storage device dependent on the voltage and discharges the second charge storage device via a primary side of the transformer.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: February 4, 2020
    Assignee: TDK Electronics AG
    Inventors: Peter Bobert, Eduard Dorsch, Frank Werner
  • Contact Temperature Sensor
    Publication number: 20190226918
    Abstract: A contact temperature sensor is disclosed. In an embodiment a contact temperature sensor has a contact body including a bottom wall configured to bring the contact temperature sensor in contact with a test piece, a heat-conducting metal sheet arranged on a side of the bottom wall facing towards the test piece, wherein the heat-conducting metal sheet is configured to conform to a surface shape of the test piece when the contact body is brought in contact with the test piece, a temperature sensor element and a heat-conducting pad arranged to thermally couple the temperature sensor element and the heat-conducting metal sheet, wherein the heat-conducting pad is in each case directly thermally coupled to the heat-conducting metal sheet and the temperature sensor element.
    Type: Application
    Filed: September 13, 2017
    Publication date: July 25, 2019
    Applicants: TDK Electronics AG, TDK Electronics AG
    Inventor: Thomas Hand