Patents Assigned to Technic, Inc.
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Patent number: 6562220Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.Type: GrantFiled: May 21, 2001Date of Patent: May 13, 2003Assignee: Technic, Inc.Inventors: Hyman D. Gillman, Brenda Fernandes, Kazimierz Wikiel
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Patent number: 6558782Abstract: Flexible graphite article of manufacture made by compressing a mixture of expanded graphite particle and a fluoro-resin including ethylene-tetrafluoroethylene (ETFE) copolymers after additional heat treatment. An article of manufacture of a gasket material made shows enhanced mechanical properties especially after oil immersion and reduced leakage.Type: GrantFiled: April 18, 2000Date of Patent: May 6, 2003Assignee: SGL Technic, Inc.Inventors: Anatoliy S. Bakman, Akira Kubo
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Patent number: 6558750Abstract: A method of processing a wafer or other articles by horizontally transporting vertically oriented wafers into one or more process cells. A carrier is rotated from a substantially horizontal orientation to a substantially vertical orientation. A cathode assembly secures the wafer onto the carrier and electrically couples the wafer to a power supply.Type: GrantFiled: July 16, 2001Date of Patent: May 6, 2003Assignee: Technic Inc.Inventors: Daniel J. Gramarossa, Gary C. Downes
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Patent number: 6555223Abstract: An article of manufacture including a graphite sheet having a texturized surface. The article of manufacture comprises, in one embodiment, about 90 to 99 percent vermicular graphite and about 1 to 10 percent of a filler (e.g., talc or mica). The article of manufacture may also include an insert in the form of a sheet of, for example, stainless steel, polyester film, or fiberglass fabric. Also, a method including combining an article having a surface texture with a graphite sheet, and imparting the surface texture to a surface of the graphite sheet.Type: GrantFiled: March 8, 2000Date of Patent: April 29, 2003Assignee: SGL Technic, Inc.Inventor: Akira Kubo
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Patent number: 6524463Abstract: A method of processing wafers or other articles within a processing cell, entailing transporting a carrier supporting a vertically-oriented wafer horizontally through an inlet opening of a process cell, processing the vertically-oriented wafer within the process cell, and then transporting the carrier out of the process cell horizontally through an outlet opening of the process cell. In one exemplary implementation, the process performed within the cell is a pre-or post- treatment where the wafer is subjected to an acid solution treatment and/or a rinsing with de-ionized water treatment. In another exemplary implementation, the process performed within the process cell is an electroplating of the plating surface of the wafer. Additionally, a method of processing an empty carrier entailing transporting the carrier horizontally through an inlet opening of a process cell, processing the carrier within the process cell, and transporting the carrier out of the process cell horizontally through an outlet opening.Type: GrantFiled: July 16, 2001Date of Patent: February 25, 2003Assignee: Technic, Inc.Inventors: Daniel J. Gramarossa, Gary C. Downes
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Patent number: 6512442Abstract: A fuse cutout switch (12) attached to electrical distribution equipment mounted on poles of electrical distribution systems operable with hooksticks (16) in which a connection assembly (28) detachably engages a first distal end of a fuse body (20) that is pivotably and detachably engaged at a second distal end to a hinge (22). A grab member (32) attached to the fuse body (20) near the first distal end includes a receptacle (36) for selectively receiving the hookstick (16) for disengaging the fuse body (20) from the connection assembly (28). A restoring member (40) attached to the fuse body (20) near a second distal end has a receptacle (42) for selectively receiving the hookstick (16) for pivoting the fuse body (20) about the hinge (22) and engaging the fuse body (20) to the connection assembly (28). Various embodiments of the grab member and the restoring member are disclosed, together with methods of modifying existing fuse cutout switches and of operating a fuse cutout switch.Type: GrantFiled: September 14, 2000Date of Patent: January 28, 2003Assignee: Taylor Maddox Technical, Inc.Inventor: David G. Taylor
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Patent number: 6483060Abstract: A transitional member for attaching between an elongate member and a tip that selectively engages operational catches on electrical distribution equipment mounted on poles of an electrical distribution system, in which the transitional member has a body with a connecter for engaging a distal end of the elongate member at a first angle relative to a longitudinal axis of the elongate member and a portion of the body opposing the connector defines a second connector for engaging a tip at a second angle relative to the longitudinal axis of the elongate member, so that the tip, being engaged at the second angle in the operational catch on electrical distribution equipment, operates the electrical distribution equipment by selective movement of the elongate member. A light source is operatively associated with the transition member. A method of operating a catch on remote electrical distribution equipment is disclosed.Type: GrantFiled: June 20, 2001Date of Patent: November 19, 2002Assignee: Taylor-Maddox Technical, Inc.Inventor: David G. Taylor
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Patent number: 6448881Abstract: An actuating device (22) operated by a hookstick (12) is attached to a manually operated fused cutout switch (10) or a oil circuit recloser switch (22). The device (22) is readily clamped to a ring (14) of the switch with a locking member (30) and a cantilever (24), each defining a boss or raised portion (34) and (60, 64, selectively for the cantilever), which bosses are disposed within the ring (14) to bear against an inner surface of the ring. A fastener (40) secures the locking member (30) and the cantilever (24) together. The hookstick (12), being engaged in the receptacle (48, 50), moves the actuating device (22) to alternatively open or close the switch. An alternate embodiment of the cantilever and a method of actuating a manually operated switch are disclosed.Type: GrantFiled: August 31, 2000Date of Patent: September 10, 2002Assignee: Taylor-Maddox Technical, Inc.Inventor: David G. Taylor
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Patent number: 6419805Abstract: A plating apparatus is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. With regard to improving the uniformity of the plating deposition, the plating apparatus and method effectuate random horizontal fluid flow within the bath to reduce the occurrence of relatively long horizontal fluid flow that causes non-uniform plating deposition across the surface of the wafer.Type: GrantFiled: August 15, 2000Date of Patent: July 16, 2002Assignee: Technic Inc.Inventors: Robert Kaufman, Gary C. Downes
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Patent number: 6361669Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.Type: GrantFiled: August 15, 2000Date of Patent: March 26, 2002Assignee: Technic Inc.Inventors: Robert Kaufman, Gary C. Downes
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Patent number: 6350958Abstract: An actuating device (60) operated by a hookstick (4) is attached to a manually operated fused cutout switch (2) or a oil circuit recloser switch (14). The device (60) comprises a cantilever (62) with a pair of opposing hook-shaped receptacles (70, 72) for receiving a hookstick (4) that is used to alternatively open or close the switch. A method of actuating a manually operated switch is disclosed.Type: GrantFiled: August 31, 2000Date of Patent: February 26, 2002Assignee: Taylor-Maddox Technical, Inc.Inventor: David G. Taylor
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Patent number: 6322313Abstract: An apparatus and method for inserting and removing a wafer into and from a plating apparatus, includes an elongated primary arm having a wafer seat for supporting the wafer, an elongated secondary arm for supporting the primary arm, and a mounting surface for supporting the secondary arm. The apparatus further includes a drive band mechanically coupled to the primary arm for causing the movement thereof. The drive band includes a portion wound around a drum that is driven by a motor. The motor, in rotating the drum, causes the drive band to move the primary arm along an axis between a retracted position wherein the primary arm, the secondary arm, and the mounting surface are in a stacked relationship, and an extended position wherein the secondary arm protrudes from the mounting surface along the axis, and the primary arm protrudes from the secondary arm along the axis.Type: GrantFiled: July 6, 2000Date of Patent: November 27, 2001Assignee: Technic Inc.Inventors: Robert Kaufman, Gary C. Downes
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Patent number: 6299751Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.Type: GrantFiled: August 15, 2000Date of Patent: October 9, 2001Assignee: Technic Inc.Inventors: Robert Kaufman, Gary C. Downes
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Patent number: 6296753Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.Type: GrantFiled: August 15, 2000Date of Patent: October 2, 2001Assignee: Technic Inc.Inventors: Robert Kaufman, Gary C. Downes, Daniel J. Gramarossa
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Patent number: 6287443Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.Type: GrantFiled: August 15, 2000Date of Patent: September 11, 2001Assignee: Technic Inc.Inventors: Robert Kaufman, Gary C. Downes, Daniel J. Gramarossa
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Patent number: 6277260Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.Type: GrantFiled: August 15, 2000Date of Patent: August 21, 2001Assignee: Technic Inc.Inventors: Robert Kaufman, Gary C. Downes
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Patent number: 6277374Abstract: A method for producing a novel yeast and mold inhibiting products (FIC) from a Lactobacillus, particularly a Lactobacillus casei having the yeast and mold producing characteristics of Lactobacillus casei var. rhamnosus NRRL-B-15972 is described. The products (FIC) are particularly useful in retarding yeast and mold growth in foods and other materials in need thereof.Type: GrantFiled: May 19, 1999Date of Patent: August 21, 2001Assignee: Microlife Technics, Inc.Inventors: Peter A. Vandenbergh, Stephen W. King
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Patent number: 6274023Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformnity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.Type: GrantFiled: August 15, 2000Date of Patent: August 14, 2001Assignee: Technic Inc.Inventors: Robert Kaufman, Gary C. Downes
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Patent number: 6274024Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.Type: GrantFiled: August 15, 2000Date of Patent: August 14, 2001Assignee: Technic Inc.Inventors: Robert Kaufman, Gary C. Downes
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Patent number: 6267862Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.Type: GrantFiled: August 15, 2000Date of Patent: July 31, 2001Assignee: Technic Inc.Inventors: Robert Kaufman, Gary C. Downes