Patents Assigned to Technologies AG
  • Patent number: 12030816
    Abstract: Mineral binder compositions with accelerated setting and/or curing including a mineral binder, at least one free-radical initiator, and at least one catalyst for the at least one free-radical initiator. The mineral binder compositions accelerated setting and hardening and are especially useful for applications at low temperatures and even below 0° C.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: July 9, 2024
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Flaviane Alves Dos Santos, Mohamed Cader, Andrea Lucero
  • Patent number: 12034256
    Abstract: A circuitry is disclosed having one or more circuits and a connector portion coupled that is to the one or more circuits. The connector portion includes a plurality of pins, at least some of the pins having assigned functionality, and wherein at least one first pin is to activate a mechanism to bring the one or more circuits into an electrically safe state. The circuitry is configured, in case the connector portion is coupled with a first connector in a first orientation, to allow the one or more circuits to operate properly via the connector portion. The circuitry is also configured so that in a case where the connector portion is coupled with a second connector in a second orientation different from the first orientation, the at least one first pin of the plurality of pins receives a reference potential that triggers activation of a safety mechanism.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: July 9, 2024
    Assignee: Infineon Technologies AG
    Inventors: Albrecht Mayer, Patrik Eder
  • Patent number: 12033972
    Abstract: A method of forming an electrical contact is provided. The method may include depositing, by atomic layer deposition, a passivation layer over at least a region of a metal surface, wherein the passivation layer may include aluminum oxide, and electrically contacting the region of the metal surface with a metal contact structure, wherein the metal contact structure may include copper.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: July 9, 2024
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille, Michael Huettinger, Werner Kanert, Heinrich Koerner, Brigitte Ruehle, Francisco Javier Santos Rodriguez, Antonio Vellei
  • Patent number: 12032960
    Abstract: A non-volatile memory (NVM) integrated circuit device includes a processing device and an NVM array of memory cells partitioned into a first physical region and a second physical region. The NVM integrated circuit device also includes a plurality of routing circuits, a first decoder associated with a first routing circuit, and a second decoder associated with a second routing circuit. The NVM integrated circuit device also includes a first programmable register coupled to the plurality of routing circuits, wherein the first programmable register is to store a first multi-bit value, the first multi-bit value programmed by the processing device to configure a first address range associated with the first decoder.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: July 9, 2024
    Assignee: Infineon Technologies AG
    Inventors: Sandeep Vangipuram, Glenn Ashley Farrall
  • Patent number: 12030450
    Abstract: A sensor device includes a sensor which is configured to detect a physical quantity generated by an impact event and to generate first measurement data based on the impact event. The sensor device also includes a MEMS microphone configured to detect sound waves generated by the impact event and to generate second measurement data based on the impact event. The sensor device is configured to provide the first measurement data and the second measurement data to a logic unit. The logic unit is configured to detect the impact event based on a combination of the first measurement data and the second measurement data.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: July 9, 2024
    Assignee: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Horst Theuss
  • Publication number: 20240217477
    Abstract: The present disclosure relates to a computerized method of seatbelt verification in a vehicle is presented. The method comprises generating, based on an image showing a seat of the vehicle, at least one heatmap representing probabilities of a seatbelt being present in regions of the image, determining a routing of the seatbelt in the image based on the values of the heatmap, and determining whether the seatbelt is worn correctly based on the routing.
    Type: Application
    Filed: December 20, 2023
    Publication date: July 4, 2024
    Applicant: Aptiv Technologies AG
    Inventors: David SCHIEBENER, Alexander Barth
  • Publication number: 20240217431
    Abstract: This document describes an integrated vehicle antenna and indicator system. As one example, a recognizable feature of an antenna housing (e.g., a ridge on a shark fin antenna housing) is replaced with an indicator element and transparent cover that are shaped and contoured to preserve the original shape of that recognizable feature of the antenna housing before being replaced. With an indicator element integrated in an antenna housing this way, visual notifications can be output from a highly visible and recognizable indicator mounting position on the vehicle. By outputting a light pattern near a recognizable feature of an external device, such as a shark fin antenna, a visible notification to convey information is provided in a way that does not detract from aesthetics of a vehicle design and is easily recognizable from outside the vehicle.
    Type: Application
    Filed: December 23, 2023
    Publication date: July 4, 2024
    Applicant: Aptiv Technologies AG
    Inventor: Timothy Alan SUDA
  • Publication number: 20240222234
    Abstract: A method of manufacturing a package is disclosed. In one example, the method comprises providing a carrier with at least one component mounting region for mounting at least one electronic component. The carrier is pre-warped in accordance with an initial curvature direction. At least one electronic component is provided, the at least one electronic component comprises at least one first electrode on a first surface and at least one second electrode on a second surface, wherein the second surface is opposite to the first surface. The at least one electronic component is mounted with the second surface on the at least one component mounting region by a solder structure. Ambient conditions are applied to the carrier and to the at least one electronic component during mounting so that the carrier is re-warped to thereby at least partially reduce warpage of the carrier in a mounting plane.
    Type: Application
    Filed: December 20, 2023
    Publication date: July 4, 2024
    Applicant: Infineon Technologies AG
    Inventors: Abdul Rahman MOHAMED, Shin Tieng LIEW, Chiong Yong TAY, Lee Shuang WANG, Edmund Jr. Banogon SELORIO, Ingrid MAUS
  • Publication number: 20240217463
    Abstract: An active discharge circuit for a vehicle discharge device for discharging a vehicle intermediate circuit, includes a connector for connection to an intermediate circuit element of the vehicle intermediate circuit; a circuit arrangement parallel-connected to the connector and having a discharge element and a switching element, the switching element being designed to electrically contact the discharge element to the connector in a closed switching state and not to electrically contact the discharge element to the connector in an open switching state; and a discrete discharge circuit being designed to adjust the switching states in the switching element by pulse width modulation during discharging of the at least one intermediate circuit element.
    Type: Application
    Filed: May 17, 2022
    Publication date: July 4, 2024
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Daniel Eckstein, Patrick Augustin, Fabian Bögner
  • Publication number: 20240218910
    Abstract: The invention relates to a wet disk brake with external oiling of a friction surface (34), having a circumference. To improve the cooling of the disk brake with external oiling and to minimize drag losses, the friction surface (34) has a zigzag-shaped or undulating groove running around the circumference or a groove (2) running tangentially around the circumference.
    Type: Application
    Filed: August 4, 2021
    Publication date: July 4, 2024
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Christian Denda, Benjamin Baerwald
  • Publication number: 20240218219
    Abstract: A 2-component type urethane-based adhesive composition that exhibits excellent workability, excellent mechanical discharge properties and excellent heat-resistant adhesive properties. This 2-component type urethane-based adhesive composition contains: a main agent, which contains a urethane prepolymer (A) having an isocyanate group at a terminal, a compound (B) having an isocyanurate ring, and a silane coupling agent (C); and a curing agent, which contains a compound having two or more active hydrogen-containing groups per molecule. The main agent or the curing agent also contains a hollow body (E) having a pressure resistance strength of 10 MPa or more.
    Type: Application
    Filed: April 26, 2022
    Publication date: July 4, 2024
    Applicants: SIKA TECHNOLOGY AG, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Megumi ABE, Yuichi MATSUKI, Yasuyuki SUZUKI
  • Patent number: 12027481
    Abstract: A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a second semiconductor chip including a first face, wherein a first contact pad is arranged over the first face, wherein the first semiconductor chip and the second semiconductor chip are arranged such that the first face of the first semiconductor chip faces in a first direction and the first face of the second semiconductor chip faces in a second direction opposite to the first direction. The first semiconductor chip is located laterally outside of an outline of the second semiconductor chip.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: July 2, 2024
    Assignee: Infineon Technologies AG
    Inventors: Petteri Palm, Thorsten Scharf
  • Patent number: 12024191
    Abstract: A driver assistance system for a vehicle having a decision engine and a plurality of active object-detection sensors including two radar sensors mounted at opposed locations on the vehicle relative to a longitudinal centerline of the vehicle. A field of view of each radar sensor is directed away from the centerline and forward of the vehicle and overlaps with the field of view of the other radar sensor in a region of overlap crossing the centerline forward of the vehicle. The decision engine receives signals from the sensors and determines the presence of an object in the regions of overlap on the basis of signals from only each of the two radar sensors among the active object-detection sensors of the system. The decision engine is thus able to command vehicle functions such as braking or acceleration on the basis of the determination.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: July 2, 2024
    Assignee: APTIV TECHNOLOGIES AG
    Inventor: Henrik Clasen
  • Patent number: 12024419
    Abstract: A device includes a readout circuit coupled between an input node and an output node; a microelectromechanical systems (MEMS) device coupled to the input node; and a first charge controlled clamp circuit coupled between the input node and a first bias node.
    Type: Grant
    Filed: February 24, 2023
    Date of Patent: July 2, 2024
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Hong Chen, Michael Reinhold, Juergen Roeber, Andreas Wiesbauer
  • Patent number: 12026043
    Abstract: The present disclosure concerns a method to train, on a computing device, a machine-learning model adapted to determine a dysfunction of a monitored vehicle electronic control unit (ECU) or vehicle embedded computer. In aspects, the computing device stores, in a memory, historical data from a plurality of ECUs having a dysfunction. The historical data may include usage values over a period of time of at least one ECU resource by applications running on the ECUs. Further, the computing device may process the historical data to obtain two-dimensional training files. In implementations, each usage value may be linked with a specific application in a first dimension and a specific time in a second dimension. Still further, the computing device may train a machine-learning model with the training files.
    Type: Grant
    Filed: April 22, 2022
    Date of Patent: July 2, 2024
    Assignee: Aptiv Technologies AG
    Inventors: Michal Iwaniec, Grzegorz Jablonski
  • Patent number: 12027436
    Abstract: A package and method of manufacturing is disclosed. In one example, the package which comprises a carrier with at least one component mounted on the carrier. A clip is arranged above the carrier and having a through hole. At least part of at least one of the at least one component and/or at least part of an electrically conductive connection element electrically connecting the at least one component is at least partially positioned inside the through hole.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: July 2, 2024
    Assignee: Infineon Technologies AG
    Inventors: Angela Kessler, Kok Yau Chua, Josef Hoeglauer, Chiah Chin Lim, Mei Qi Tay
  • Patent number: 12025183
    Abstract: A bearing assembly includes an inner bearing ring, an outer bearing ring and rolling bodies located between the inner bearing ring and the outer bearing ring. A gap is defined by a radially outer surface of the inner bearing ring and a radially inner surface of the outer bearing ring. The radially inner surface of the outer bearing ring includes a first radial surface portion that is offset a greater distance from a center of the bearing than a second radial surface portion. The first and second radial surface portions are connected by a sloped surface. A sealing arrangement located in the gap. The sealing arrangement includes a first annular body including an elastomeric sealing protrusion to contact the sloped surface of the outer bearing ring.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: July 2, 2024
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Christian Mock, Marco Krapf, Darius Dlugai, Andreas Kaiser
  • Patent number: 12024162
    Abstract: Techniques are described that enable automatic emergency braking (AEB) for a path-crossing target when a collision between a host vehicle and the target that is deemed imminent. Based on whether an acceleration of the host vehicle is above a threshold. Based on the acceleration, and, optionally, a location of the target relative to a crossing path (e.g., whether a portion of the target is within a suppression zone), an AEB system of the host vehicle is either activated or not activated, for example, suppressed. This suppression of the AEB system may include gating or nulling an AEB activation signal to prevent an emergency braking event. By managing the AEB system in a path-crossing scenario, many common false-positive AEB events (warnings, alerts, and/or braking) may be avoided. Furthermore, intentional vehicle maneuvers that comply with normal driving etiquette or rules can still be allowed for operator and passenger comfort, without risking safety.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: July 2, 2024
    Assignee: Aptiv Technologies AG
    Inventors: Wen-Yu Kuo, Yu Han
  • Patent number: 12023762
    Abstract: A layer structure includes a first layer including at least one material selected from a first group consisting of nickel, copper, gold, silver, palladium, tin, zinc, platinum, and an alloy of any of these materials; a third layer including at least one material selected from a second group consisting of nickel, copper, gold, palladium, tin, silver, zinc, platinum, and an alloy of any of these materials; and a second layer between the first layer and the third layer. The second layer consists of or essentially consists of nickel and tin. The second layer includes an intermetallic phase of nickel and tin.
    Type: Grant
    Filed: December 23, 2022
    Date of Patent: July 2, 2024
    Assignee: Infineon Technologies AG
    Inventors: Alexander Heinrich, Alexander Roth, Catharina Wille
  • Patent number: RE50036
    Abstract: A sensor may determine, based on two or more synchronization signals provided by a control device, an expected time for receiving an upcoming synchronization signal. The sensor may perform a measurement of a sensor signal at a point in time such that sensor data, corresponding to the measurement of the sensor signal at the point in time, is available at a selectable time interval prior to reception of the upcoming synchronization signal.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: July 9, 2024
    Assignee: Infineon Technologies AG
    Inventors: Leo Aichriedler, Christof Michenthaler