Patents Assigned to Technologies AG
  • Publication number: 20240058949
    Abstract: A drive unit for a robot, having an input shaft, an input shaft drive motor and a strain wave gear mechanism for transmission to an output shaft. The strain wave gear mechanism has a wave generator which is operatively connected to the input shaft, a flexible ring and a toothed ring are connectable to the output shaft, a first sensor for detecting an angular position of the input shaft and a second sensor for detecting the angular position of the output shaft. In order to allow the drive unit to precisely adjust the angular position of the output shaft to each setpoint angular position, the drive unit has a third sensor for detecting an expansion of the flexible ring. A robot having such a drive unit and a method for precisely adjusting the angular position of the output shaft are also provided.
    Type: Application
    Filed: November 26, 2021
    Publication date: February 22, 2024
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventor: Daisuke KIRIHARA
  • Publication number: 20240063676
    Abstract: A high-voltage terminal for a stator, including: —three bus bars for electrically connecting the HV terminal to power electronics; and —a star bar; wherein each of the three bus bars has a current input element and at least n parallel current output elements, and the star bar has at least 3n current input elements, n being greater than or equal to 4, and wherein, within the HV terminal, the bars are stacked one on top of the other to form a bar stack and are arranged such that they are electrically insulated from one another by at least one plastics element, more particularly are electrically insulated from one another in a plastics element, and preferably are embedded therein.
    Type: Application
    Filed: January 12, 2022
    Publication date: February 22, 2024
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Andreas RUPPERT, Rebecca RUPPERT
  • Publication number: 20240060536
    Abstract: A bearing assembly includes an inner bearing ring, an outer bearing ring and rolling bodies located between the inner bearing ring and the outer bearing ring. A gap is defined by a radially outer surface of the inner bearing ring and a radially inner surface of the outer bearing ring. The radially inner surface of the outer bearing ring includes a first radial surface portion that is offset a greater distance from a center of the bearing than a second radial surface portion. The first and second radial surface portions are connected by a sloped surface. A sealing arrangement located in the gap. The sealing arrangement includes a first annular body including an elastomeric sealing protrusion to contact the sloped surface of the outer bearing ring.
    Type: Application
    Filed: August 22, 2022
    Publication date: February 22, 2024
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Christian Mock, Marco Krapf, Darius Dlugai, Andreas Kaiser
  • Publication number: 20240063643
    Abstract: The disclosure relates to a charging system (1) for an electric vehicle comprising a first battery system (2) and a second battery system (3) interconnected to each other by a switch box (4) interconnected to a charging device (8) during charging Each battery system (2, 3) comprising at least one battery (21) and at least one thereto connected electrical load (22). The switch box (4) interconnects the first battery system (2) and the second battery system (3) with the charging device (8) in a parallel mode in a parallel manner or in a serial mode in a serial manner.
    Type: Application
    Filed: January 5, 2022
    Publication date: February 22, 2024
    Applicant: DESIGNWERK TECHNOLOGIES AG
    Inventor: Frank LOACKER
  • Publication number: 20240060531
    Abstract: A method for producing a rolling bearing component includes providing a rolling bearing component formed from a rolling bearing steel, heating the rolling bearing component to form an austenitic microstructure, and cooling the rolling bearing component in a warm salt bath to a temperature below a martensite start temperature of the rolling bearing steel. The rolling bearing component has a wall thickness or a diameter of at least 85 mm at at least one point and includes a martensitic microstructure in an edge layer region and a microstructure consisting of pearlite or upper bainite in a core region after the cooling. A rolling bearing component produced by the method and a rolling bearing comprising the rolling bearing component are also disclosed.
    Type: Application
    Filed: December 14, 2021
    Publication date: February 22, 2024
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Werner Trojahn, Markus Dinkel, Johannes Moeller
  • Patent number: 11905862
    Abstract: The invention relates to a gear device for a motor vehicle, as is used, for example, for adjusting a camshaft in a combustion engine in order to influence the phase angle between crankshaft and camshaft. Such gear devices have to be constructed compactly and also have to have high resistance to wear, in particular upon reaching end stops during adjustment of the phase angle. For this purpose, the gear device has hydraulic end stop damping by the drive unit and the output unit having communicating cavities.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: February 20, 2024
    Assignee: Schaeffler Technologies AG & CO. KG
    Inventors: Juergen Weber, Rainer Ottersbach, Resat Aras
  • Patent number: 11907581
    Abstract: A data storage device comprises a plurality of storage elements, each storage element configured for storing a piece of information. The plurality of storage elements is accessible as a plurality of word sets, each word set comprising a set of storage elements, and is accessible as a plurality of slice sets, each slice set comprising a set of storage elements. Each storage element is a part of a word set and a part of a slice set. The device further comprises a control unit configured for obtaining word information and slice information and for executing a write operation to parallelly write the word information into a first word set of the plurality of word sets and the slice information into a first slice set of the plurality of slice sets, wherein the first word set and the first slice set comprise a common storage element defined by an overlap of the first word set and the first slice set in a layout of the plurality of storage elements.
    Type: Grant
    Filed: March 8, 2022
    Date of Patent: February 20, 2024
    Assignee: Infineon Technologies AG
    Inventors: Martin Schlaeffer, Osama Amin, Elif Bilge Kavun
  • Patent number: 11905119
    Abstract: A conveyor bowl for a vibratory conveyor device includes a main body made of stainless steel and manufactured by primary shaping. The main body has an interface section for coupling to a vibration unit, and a conveyor section for conveying conveyed parts. The main body may be designed as a cast part. The main body may be a precision cast part or an investment cast part. The main body may be made of austenite. The interface section and the conveyor section may be formed in one piece or formed integrally with the main body.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: February 20, 2024
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Jörg Hausecker, Marc Schleicher, Georg Spiess, Norbert Staudigel, Robert Burkard, Klaus Schindler
  • Patent number: 11909405
    Abstract: A digital phase-locked loop (DPLL) circuit includes: a first time-to-digital converter (TDC) and a first digital loop filter (DLF) that are configured to be coupled between a reference clock source and a digitally controlled oscillator (DCO), where the first TDC is configured to, during an acquisition mode, generate a phase error by: receiving a reference clock signal from the reference clock source; receiving a clock signal that is based on an output of the DCO divided by a dividing factor, computing a phase error using the reference clock signal and the clock signal; detecting cycle slipping in the computed phase error; and in response to detecting the cycle slipping, modifying the computed phase error to reduce the impact of cycle slipping on the DPLL circuit; and a first frequency divider circuit configured to generate the clock signal by dividing the output of the DCO by the dividing factor.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: February 20, 2024
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Luigi Grimaldi, Thomas Bauernfeind, Dmytro Cherniak, Fabio Versolatto, Andrew Wightwick, Fabio Padovan, Giovanni Boi
  • Patent number: 11908694
    Abstract: In an example, a substrate is oriented to a target axis, wherein a residual angular misalignment between the target axis and a preselected crystal channel direction in the substrate is within an angular tolerance interval. Dopant ions are implanted into the substrate using an ion beam that propagates along an ion beam axis. The dopant ions are implanted at implant angles between the ion beam axis and the target axis. The implant angles are within an implant angle range. A channel acceptance width is effective for the preselected crystal channel direction. The implant angle range is greater than 80% of a sum of the channel acceptance width and twofold the angular tolerance interval. The implant angle range is smaller than 500% of the sum of the channel acceptance width and twofold the angular tolerance interval.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: February 20, 2024
    Assignee: Infineon Technologies AG
    Inventors: Moriz Jelinek, Michael Hell, Caspar Leendertz, Kristijan Luka Mletschnig, Hans-Joachim Schulze
  • Patent number: 11908830
    Abstract: A method for fabricating a semiconductor device includes providing a semiconductor die, arranging an electrical connector over the semiconductor die, the electrical connector including a conductive core, an absorbing feature arranged on a first side of the conductive core, and a solder layer arranged on a second side of the conductive core, opposite the first side and facing the semiconductor die, and soldering the electrical connector onto the semiconductor die by heating the solder layer with a laser, wherein the laser irradiates the absorbing feature and absorbed energy is transferred from the absorbing feature through the conductive core to the solder layer.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: February 20, 2024
    Assignee: Infineon Technologies AG
    Inventors: Richard Knipper, Alexander Heinrich, Thorsten Scharf, Stefan Schwab
  • Patent number: 11906652
    Abstract: A Signal Processing Unit (SPU) having a thresholding circuit configured to detect a peak cell of a radar data cube, and to output an identification of the peak cell and energy values of the peak cell and its adjacent cells; and an interpolation circuit coupled to the thresholding circuit, and configured to determine and transmit from the SPU to a Digital Signal Processor (DSP), a relative position of the peak cell between the adjacent cells based on the energy values.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: February 20, 2024
    Assignee: Infineon Technologies AG
    Inventors: Andre Roger, Markus Bichl, Farhan Bin Khalid
  • Patent number: 11906618
    Abstract: The present disclosure relates to a hybrid multiple-input multiple-output (MIMO) radar concept. Via a first subset of a plurality of transmit channels and during a first time interval, first frequency-modulated continuous-wave (FMCW) radar signals are con-currently transmitted with different phase offsets among different transmit channels of the first subset in accordance with a first predefined code division multiplexing scheme. Via a second subset of the transmit channels and during a second time interval subsequent to the first time interval, second FMCW radar signals are concurrently transmitted with different phase offsets among different transmit channels of the second subset in accordance with a second predefined code division multiplexing scheme.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: February 20, 2024
    Assignee: Infineon Technologies AG
    Inventors: Byung Kwon Park, Sang Ho Nam
  • Patent number: 11904718
    Abstract: A method of intelligently allocating power to one or more devices connected to a power delivery system includes detecting an event related to an allocation of power between the one or more connected devices. The method further includes maximizing an initial non-power delivery (non-PD) power provided to at least one of the connected devices based on an available shared capacity (ASC) associated with at least one connected device and also includes allocating power to the at least one connected device using PD protocols.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: February 20, 2024
    Assignee: Aptiv Technologies AG
    Inventors: Shyambabu Yeda, Mohamad Elghrawi, Luke Berry, Andrew Burchett, Chris Cooke
  • Patent number: 11905861
    Abstract: A camshaft phaser arrangement configured for adjusting a phase between a first camshaft element and a second camshaft element is disclosed. The arrangement includes a rotor configured to be drivably connected to the first camshaft element. The rotor is configured to be selectively rotationally driven via hydraulic fluid such that rotation of the rotor phases the first camshaft element. A phasing adjuster is configured to pivot based on rotation of the rotor. The phasing adjuster includes a first engagement element configured to engage with a second engagement element on the second camshaft element, such that rotation of the rotor is configured to phase the second camshaft via the phasing adjuster.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: February 20, 2024
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventor: Brian Lee
  • Patent number: 11908763
    Abstract: An apparatus includes a semiconductor-based substrate with a functional structure that is formed in or on the semiconductor-based substrate. The apparatus includes a frame structure surrounding the functional structure and includes a coating that covers the functional structure and is delimited by the frame structure.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: February 20, 2024
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Prashanth Makaram, John Cooper, Joerg Ortner, Stephan Pindl, Caterina Travan, Alexander Zoepfl
  • Patent number: 11910154
    Abstract: A MEMS device includes a package for providing an inner volume, a MEMS microphone arranged in the inner volume, a sound port through the package to the inner volume, and a passive acoustic attenuation filter acoustically coupled to the sound port.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: February 20, 2024
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Daniel Neumaier, Niccoló De Milleri
  • Patent number: 11908771
    Abstract: A molded semiconductor package includes: a semiconductor die; a substrate attached to a first side of the semiconductor die; a plurality of leads electrically connected to a pad at a second side of the semiconductor die opposite the first side; a heat sink clip thermally coupled to the pad; and a molding compound encapsulating the semiconductor die, part of the leads, part of the heat sink clip, and at least part of the substrate. The molding compound has a first main side, a second main side opposite the first main side and at which the substrate is disposed, and an edge extending between the first main side and the second main side. The leads protrude from opposing first and second faces of the edge of the molding compound. The heat sink clip protrudes from opposing third and fourth faces of the edge of the molding compound.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: February 20, 2024
    Assignee: Infineon Technologies AG
    Inventors: Jayaganasan Narayanasamy, Angel Enverga, Chii Shang Hong, Chee Ming Lam, Sanjay Kumar Murugan, Subaramaniym Senivasan
  • Patent number: 11906427
    Abstract: A method for determining a reflectivity value indicating a reflectivity of an object is provided. The method includes performing a Time-of-Flight (ToF) measurement using a ToF sensor. A correlation function of the ToF measurement increases over distance within a measurement range of the ToF sensor such that an output value of the ToF sensor for the ToF measurement is independent of the distance between the ToF sensor and the object. The method further includes determining the reflectivity value based on the output value of the ToF sensor for the ToF measurement.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: February 20, 2024
    Assignee: Infineon Technologies AG
    Inventors: Armin Josef Schoenlieb, Caterina Nahler, Hannes Plank
  • Patent number: 11908760
    Abstract: A package is disclosed. In one example, the package comprises a carrier comprising a thermally conductive and electrically insulating layer, a laminate comprising a plurality of connected laminate layers, an electronic component mounted between the carrier and the laminate. An encapsulant is at least partially arranged between the carrier and the laminate and encapsulating at least part of the electronic component.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: February 20, 2024
    Assignee: Infineon Technologies AG
    Inventor: Andreas Grassmann