Abstract: A bearing, in particular to a self-aligning roller bearing, with a fastener of a sealing disc, which fastener increases the load-bearing strength. The bearing includes a bearing ring with an annular sealing disc which is connected to one of the two bearing ring end surfaces by a fastener which have a shank and a head, which has an enlarged diameter with respect to the shank, and the respective shanks reach through the bores which are made in the respective end surface. Here, the annular surfaces have a cylindrical contour, with the result that the other annular surface provides a raceway, wherein the raceway has a spherical contour, and the bore center axis of each bore in the bearing ring and in the sealing disc has an engaged profile which converges onto the cylindrical contour of the one annular surface.

Abstract: A capacitive sensor includes a first conductive structure and a second conductive structure that form a first capacitor having a first capacitance that changes in response to an external force acting thereon and includes a MEMS output configured to output a first sense signal representative of the first capacitance; a second capacitor coupled to the MEMS output and configured to output a second sense signal based on the first sense signal; an amplifier comprising an amplifier input and configured to output an amplified signal based on the second sense signal; and a diagnostic circuit configured to receive two measurement signals, generate an offset measurement based on the two measurement signals, and detect a fault on a condition that the offset measurement is outside of a threshold range.

Abstract: A semiconductor device includes a composite layer having a first and second opposing surfaces. The composite layer includes a mesa and a first insulating layer. The mesa has top and bottom surfaces and side faces. The side faces are embedded in the first insulating layer. The mesa includes a Group III nitride-based multilayer structure providing a Group III nitride based device having first and second electrodes arranged on the mesa top surface. First and second outer contacts are positioned on the second surface of the composite layer. A first conductive via extends through the first insulating layer and is electrically coupled to the first electrode on the mesa top surface and to the first outer contact. A second conductive via extends through the first insulating layer and is electrically coupled to the second electrode on the mesa top surface and to the second outer contact.

Abstract: A pressure sensor device includes a semiconductor die having a die surface that includes a pressure sensitive area; and a bond wire bonded to a first peripheral region of the die surface and extends over the die surface to a second peripheral region of the die surface, wherein the pressure sensitive area is interposed between the second peripheral region and the first peripheral region, wherein the bond wire comprises a crossing portion that overlaps an area of the die surface, and wherein the crossing portion extends over the pressure sensitive area that is interposed between the first and the second peripheral regions.

Abstract: A device may include a test signal generator and a receive antenna input. The device may include a switchable impedance matching circuit, coupled to the test signal generator and to a receive chain, to cause an impedance matching between the test signal generator and a component of the receive chain to be increased during a monitoring phase. The impedance matching during the monitoring phase enables one or more measurements based on a test signal generated by the test signal generator. The switchable impedance matching circuit may cause a partial impedance mismatching between the test signal generator and the component of the receive chain during a verification phase associated with verifying a return of the switchable impedance matching circuit to an impedance matching caused during the operational phase. The device may include a control circuit to verify operation of the returning of the switchable impedance matching circuit in the verification phase.

Abstract: A molded semiconductor package includes: a semiconductor die attached to a substrate, the semiconductor die having a bond pad at a first side of the semiconductor die which faces away from the substrate and an insulating layer covering the first side; an electrical conductor attached to a part of the bond pad exposed by an opening in the insulating layer; a mold compound encasing the semiconductor die; and an electrically insulative material filling the opening in the insulating layer and sealing the part of the bond pad exposed by the opening in the insulating layer. The electrically insulative material separates the mold compound from the part of the bond pad exposed by the opening in the insulating layer. A corresponding method of producing the molded semiconductor package also is described.

Abstract: A semiconductor device includes a conductive can include a flat portion and at least one peripheral rim portion extending from an edge of the flat portion, a semiconductor die comprising a first main face and a second main face opposite to the first main face, a first contact pad disposed on the first main face and a second contact pad disposed on the second main face, wherein the first contact pad is electrically connected to the flat portion of the can, an electrical interconnector connected with the second contact pad, and an encapsulant disposed under the semiconductor die so as to surround the electrical interconnector, wherein an external surface of the electrical interconnector is recessed from an external surface of the encapsulant.

Abstract: The present disclosure relates to authenticity and data security for bus-based communication networks in a vehicle. The present disclosure teaches a protocol frame, a sender on data link layer, and a receiver on data link layer providing such authenticity and data security as well as a communication network in a vehicle employing the protocol frame, the sender and the receiver according to the present disclosure.

Abstract: A drive assembly including a primary inertia plate and clutch. The primary inertia plate is configured to be rotationally driven via a crankshaft. The clutch plate includes a body with a rotational axis (X). The clutch plate is configured to be rotationally driven by the primary inertia plate. The clutch plate includes at least one imbalance feature such that a center of gravity of the clutch plate is positioned away from the rotational axis (X). The imbalance feature generates a centrifugal force that counteracts or prevents rattling from being imparted to the clutch plate via engine vibrations through the primary inertia plate.

Abstract: A semiconductor device comprises a semiconductor chip comprising a radio frequency (RF) circuit, a feedline structure coupled to the RF circuit, and an antenna structure comprising a main body stretching along a direction orthogonal to at least one side of a front side and a backside of the semiconductor device, wherein the antenna structure is coupled to the RF circuit through the feedline structure.

Abstract: A method of controlling a vehicle headlamp that includes a plurality of LEDs may comprise receiving video images at a first frame rate; storing the video images in a memory at the first frame rate; receiving offset data associated with the video images; defining sub-images based on the offset data and the video images; and driving the plurality of LEDs to present the sub-images at a second frame rate, wherein the second frame rate is faster than the first frame rate.

Abstract: In accordance with an embodiment, a method for digital-to-analog conversion includes: mapping a uniformly distributed input code to a non-uniformly distributed input code of a switched capacitor digital-to-analog converter (DAC), the non-uniformly distributed input code including a most significant code (MSC) and a least significant code (LSC); transferring a first charge from a set of DAC capacitors to a charge accumulator based on the MSC; forming a second charge based on the LSC; and transferring the second charge from the set of DAC capacitors to the charge accumulator, where each capacitor of the set of DAC capacitors is used for each value of the non-uniformly distributed input code, each capacitor of the set of DAC capacitors provides a same corresponding nominal charge within each value of the non-uniformly distributed input code, and where the same nominal charge is proportional to a value of the non-uniformly distributed input code.

Abstract: The disclosure relates to a drive train for a motor vehicle containing an internal combustion engine, a transmission connected downstream thereof, drive wheels and a differential arranged between the drive wheels and the transmission. In order to eliminate or at least reduce the vibrational eigenmodes behind the transmission, a centrifugal pendulum is assigned adjacent to the differential.

Abstract: An integrated circuit is provided. The integrated circuit includes a transistor, a first metallization layer above the transistor and electrically connected to the transistor, and a phase change switch. At least a part of the phase change switch is provided below the first metallization layer. The first metallization layer is provided laterally adjacent to the phase change switch. Moreover, a method is provided for manufacturing an integrated circuit. Further provided is a wafer for manufacturing an integrated circuit, and a method for manufacturing a wafer for manufacturing an integrated circuit.

Abstract: Voltage converter inlay modules are provided for embedding within a package substrate, and are configured to supply power to a processor, or similar digital circuit, which is mounted to the package substrate. The package substrate is typically mounted to a circuit board, or similar. The circuit board provides high-voltage, low-current power to the voltage converter module which, in turn, provides low-voltage high-current power to the processor. The voltage converter inlay provides largely vertical current conduction from the circuit board to the processor, thereby reducing conduction losses incurred by lateral current conduction. The location of the voltage converter inlay between the circuit board and the microprocessor minimizes radiation of electromagnetic interference. The number of terminals allocated for providing power to the package substrate may be minimized due to the voltage converter inlay inputting fairly low levels of current.

Abstract: A method of fabricating a chain tensioner includes bending a sheet metal blank to form a connector portion perpendicular to a flat base. The connector portion has an arm extending beyond the base. The method further includes stamping an end of the arm to curl the end into a hollow cylinder having an axis perpendicular the flat base. Curling the end into a hollow cylinder may be performed in a series of stamping operations. The blank may define a gap which extends around a narrower portion of the arm after the end is curled into the hollow cylinder.

Abstract: The described techniques address issues associated with coreless current sensors by implementing a current sensor solution that may use as few as two, two-dimensional (2D) linear sensors. The discussed techniques provide a coreless current sensor solution that is independent of the sensor position with respect to a current-carrying conductor. An algorithm is also described for auto-calibration of sensor position with respect to a current-carrying conductor to calculate the current flowing through the conductor. The calculation of current may be performed independent of the position of the current-carrying conductor with respect to the sensor, and thus the disclosed techniques provide additional advantages regarding installation flexibility without sacrificing measurement accuracy.

Abstract: A semiconductor package is disclosed. In one example, the semiconductor package comprises a package body and a second die pad at least partially encapsulated in the package body. A first semiconductor die is at least partially encapsulated in the package body and arranged on the first die pad. A further device at least partially encapsulated in the package body and arranged on the second die pad. At least one first lead is connected with the first contact pad of the first semiconductor die. At least one second lead is connected with the second contact pad of the further device. An electrical conductor is connected between the at least one first lead and the at least one second lead, the electrical conductor being completely encapsulated in the package body.

Abstract: The disclosure relates to a linear actuator, the housing of which encloses a pushrod which is guided displaceably along a longitudinal axis. The linear actuator includes a linear travel sensor intended for determining a position of the pushrod. A housing-side position receiver of the linear travel sensor includes a receiver section extending along the longitudinal axis, and a pushrod-side position transmitter that interacts contactlessly with the position receiver. The position transmitter is made from an electrically conductive material, and a transmitter contour of the linear travel sensor is curved about at least one dimensional axis.

Abstract: A centrifugal pendulum for a motor vehicle drivetrain includes a carrier, a pendulum mass, mounting for pivoting relative to the carrier, and a roller body. The carrier has a carrier roller track and the pendulum mass has a pendulum mass roller track. The roller body has a first rolling region arranged in the carrier roller track and a second rolling region arranged in the pendulum mass roller track. The carrier roller track is formed at least partially by an axially formed sheet-metal portion having a free edge, and the free edge faces away from the pendulum mass.