Abstract: An electrical connection defect simulation test method is provided. The electrical connection state simulation test method includes the steps as follows. A device under test is provided, wherein the device under test includes a plurality of pin groups each having a plurality of signal pins. A zero-frequency signal is transmitted from a signal-feeding device to each of the signal pins to simulate an open condition. An open test is performed on each of the signal pins. The signal pins of the device under test are connected to a relay matrix. The relay matrix is controlled to make any two of the signal pins in one of the pin groups electrically connected to simulate a short condition. A short test is performed on any two of the electrically connected signal pins. An electrical connection state simulation test system is disclosed herein as well.

Abstract: A fixture for performing functional test is provided. The fixture comprises an interface module and a test control module. The interface module is connected to an under-test module. The test control module controls the interface module to communicate with a self-test unit of the under-test module to activate a test flow and to determine whether the under-test module is under a passive test mode or an active test mode. When the under-test module is under the passive test mode, the test control module transmits at least one test command to the self-test unit to perform tests. When the under-test module is under the active test mode, the test control module receives a control command and/or a test result from the self-test unit passively to perform tests on the under-test module by controlling the interface module according to the control command and/or analyze the test result.

Abstract: A device for performing timing analysis used in a programmable logic array system is provided. The device comprises first and second basic I/O terminals, a channel multiplexer, high-speed I/O terminals, a sampling module and a timing analysis module. The first basic I/O terminals receive under-test signals from an under-test unit. The channel multiplexer receives the under-test signals from the first basic I/O terminals to select at least a group of the under-test signals to be outputted to the second basic I/O terminals. The high-speed I/O terminals has a logic level analyzing speed higher than that of the first and second basic I/O terminals. The sampling module receives the group of under-test signals from the high-speed I/O terminals and samples the group of under-test signals to generate a sample result. The timing analysis module performs timing analysis and measurement according to the sample result.

Abstract: A signal transition detection circuit is provided. The signal transition detection circuit comprises a counter module, a DAC, a comparator and a digital sampling module. The counter module generates a digital step signal. The DAC converts the digital step signal into an analog input signal and transmits it to an under-test circuit such that the under-test circuit generates an output signal transiting from a first stable level to a second stable level, wherein a transition section is located between the first and the second stable level. The comparator receives and compares the output signal with a default value to generate a normalized output signal. The digital sampling module samples the normalized output signal to retrieve impulses such that when the number of the impulses is accumulated to be larger than a reference value, a corresponding step of the digital step signal is determined to be a transition point.

Abstract: A three-dimensional image measuring apparatus includes a measurement platform, a movable optical head, a three-dimensional calculator module, a moving module and a calibration controlling module. The movable optical head includes a beam splitter unit, a projecting module, an image-capturing module and an indicator module. The measurement platform supports an object under measurement. The projecting module generates a structure light of parallel sinusoid strips pattern to the object under measurement. The image-capturing module includes image-capturing units facing the object under measurement from different directions or angles. Each image-capturing unit is configured to capture a reflection image which is formed from the structure light of parallel sinusoid strips pattern reflected by the object under measurement. The indicator module projects an alignment beam onto the object under measurement for forming an alignment mark.

Abstract: A three-dimensional measurement system includes a measurement platform, a projection module, an image-capturing module, and a control unit. The measurement platform carries a test object. The projection module includes a light-emitting unit, a light-shielding rotary disc, a grating unit, and an optical-reflective ring structure. The light-emitting unit generates a light beam. An aperture formed in the light-shielding rotary disc is located at different rotational positions time-sequentially while the light-shielding rotary disc rotates, and the light beam passes through the aperture to form light beam segments. The grating unit transforms the light beam segments into stripe-patterned structure-light beams. The optical-reflective ring structure reflects the stripe-patterned structure-light beams onto the test object. The image-capturing module captures stripe-patterned images formed after reflection of the stripe-patterned structure-light beams from the test object.

Abstract: A three-dimensional measurement system includes a measurement carrier, first and second projection modules, an image-capturing module, and a control unit. The measurement carrier carries a test object on a measurement plane. The first projection module projects a first patterned structure light onto the test object along a first optical axis that forms a first incident angle relative to the measurement plane, and the second projection module projects a second patterned structure light onto the test object along a second optical axis that forms a second incident angle different from the first incident angle. The image-capturing module captures first and second patterned images formed after reflection of the first and second patterned structure lights from the test object. The control unit controls the first and second projection modules, and measures a three-dimensional shape of the test object according to the first and second patterned images.

Abstract: A signal transition detection circuit is provided. The signal transition detection circuit comprises a counter module, a DAC, a comparator and a digital sampling module. The counter module generates a digital step signal. The DAC converts the digital step signal into an analog input signal and transmits it to an under-test circuit such that the under-test circuit generates an output signal transiting from a first stable level to a second stable level, wherein a transition section is located between the first and the second stable level. The comparator receives and compares the output signal with a default value to generate a normalized output signal. The digital sampling module samples the normalized output signal to retrieve impulses such that when the number of the impulses is accumulated to be larger than a reference value, a corresponding step of the digital step signal is determined to be a transition point.

Abstract: An electrical connection defect detection system to detect whether an electrical connection between an under-test pin of an under-test device and a signal line of a circuit board is normal is provided. The electrical connection defect detection system comprises a signal provider providing a test signal to the under-test pin through the signal line, a detection module, an electrode board and a plurality of grounding paths. The electrode board comprises a detection surface to be adapted to a surface of the under-test device opposite to the under-test pin to make the detection module detect a capacitance value associated with the electrode board, the under-test pin and the signal line larger than a threshold value when their connection is normal. The grounding paths are connected to one of not-under-test pin groups respectively to further connect to the ground potential. An electrical connection defect detection method is disclosed herein as well.

Abstract: An electrical connection defect detection device to detect whether an electrical connection between an under-test pin of an under-test device and a signal line of a circuit board is normal is provided. The electrical connection defect detection device comprises a signal provider providing a test signal to the under-test pin through the signal line, a detection module and an electrode board comprising a detection surface and at least one array of through holes. The detection surface contacts a surface of the under-test device to make the detection module detect a capacitance value associated with the electrode board, the under-test pin and the signal line larger than a threshold value when their connection is normal. The through holes are placed along the edges of the electronic board and are electrically connected to a ground potential to perform a capacitive shielding.

Abstract: An electrical connection defect simulation test method is provided. The electrical connection state simulation test method includes the steps as follows. A device under test is provided, wherein the device under test includes a plurality of pin groups each having a plurality of signal pins. A zero-frequency signal is transmitted from a signal-feeding device to each of the signal pins to simulate an open condition. An open test is performed on each of the signal pins. The signal pins of the device under test are connected to a relay matrix. The relay matrix is controlled to make any two of the signal pins in one of the pin groups electrically connected to simulate a short condition. A short test is performed on any two of the electrically connected signal pins. An electrical connection state simulation test system is disclosed herein as well.

Abstract: A discharge device and a test system having the same are provided. The test system comprises at least one power supply module, a test instrument and a discharge device. The power supply module supplies power to a device under test. The test instrument is connected to the device under test. The test instrument performs a plurality of on-power test procedures on the device under test. The discharge device comprises at least one first constant current discharge unit disposed in the test instrument, at least one second constant current discharge unit disposed in the power supply module and a control module. The control module controls the first and the second constant current discharge units to drain a constant current from the device under test and the power supply module to perform a discharge process when each one of the on-power test procedures is finished.

Abstract: An apparatus comprises a sensor, a power supply and a measurer. The sensor is placed over the electronic component. The power supply can supply electric power to the printed circuit; thereby the printed circuit is powered on. The measurer can measure a sensing signal through the sensor when the printed circuit is powered on.

Abstract: A method for measuring the thickness of a first absorbing material in the presence of a second absorbing material is provided. The method comprises the steps as follow. The thickness (tS) of the first absorbing material is fixed and the thickness of the second absorbing material is varied to obtain a calibration standard. The intensity of the transmissive energy passing through the calibration standard is detected by acquiring multiple pairs of image data comprising a foreground value (logn(Ic+s)) and a background value (logn(Ic)). The thickness (tSi) of the first absorbing material is changed and the above steps are repeated to obtain sets of image data. A fitting constant Id is determined to describe each set of the intensity data as ? s ? ? t S = log n ? ( I c + I d ) - log n ? ( I c + s + I d ) .

Abstract: A method for measuring the thickness of a first absorbing material in the presence of a second absorbing material is provided. The method comprises the steps as follow. The thickness (tS) of the first absorbing material is fixed and the thickness of the second absorbing material is varied to obtain a calibration standard. The intensity of the transmissive energy passing through the calibration standard is detected by acquiring multiple pairs of image data comprising a foreground value (logn(Ic+s)) and a background value (logn(Ic)). The thickness (tSi) of the first absorbing material is changed and the above steps are repeated to obtain sets of image data. A fitting constant Id is determined to describe each set of the intensity data as ? s ? ? t S = log n ? ( I c + I d ) - log n ? ( I c + s + I d ) .

Abstract: The invention provides a testing system and method suitable for determining whether the pins of the socket are properly connected to a printed circuit board. The testing system includes a testing signal source, a socket, a signal sensing unit, a fixing element, and an analysis unit. The signal sensing unit comprises a sensor board, a probe, and an operation amplifier. The sensor board is electrically coupled to the socket, and the sensor board has a probing point. The probe is selectively contacted with the probing point of the sensor board for receiving and outputting a sensing signal. The operation amplifier is electrically connected to the probe for receiving, amplifying and outputting the sensing signal. The fixing element is used for fixing the sensor board between the socket and the fixing element.

Abstract: The invention provides a testing system and method suitable for determining whether a pin-out of an electrical component is properly connected to a PCB. The testing system includes a testing signal source, a signal detector, a signal processor, an analysis unit and an integrated circuit having boundary-scan test function to provide testing signals to the device under test (DUT) whose signal traces are passing through inner layer of PCB in order to detect whether the sensed signal is an error signal.

Abstract: The invention discloses a testing system and method suitable for determining the connection state of an electronic component in an electronic device assembly. In an embodiment, the testing system comprises a signal sensing unit configured to provide a sensed signal induced by capacitive coupling in response to the output of a testing signal passing through a tested pin, a signal processor unit configured to filter and over-sample the sensed signal to obtain a digital signal, and an analyzer unit configured to compute the digital signal for determining a connection state of the test pin.

Abstract: The invention provides a testing system and method suitable for determining whether the pins of the socket are properly connected to a printed circuit board. The testing system includes a testing signal source, a socket, a signal sensing unit, a fixing element, and an analysis unit. The signal sensing unit comprises a sensor board, a probe, and an operation amplifier. The sensor board is electrically coupled to the socket, and the sensor board has a probing point. The probe is selectively contacted with the probing point of the sensor board for receiving and outputting a sensing signal. The operation amplifier is electrically connected to the probe for receiving, amplifying and outputting the sensing signal. The fixing element is used for fixing the sensor board between the socket and the fixing element.

Abstract: A laminography inspection system comprises an irradiation source, a plurality of linear image detectors defining an image plane, a fixed table for placement of a test object in a stationary position between the irradiation source and the image detectors, and a computing device for processing a plurality of images of the test object acquired from the image detectors. The irradiation source and the image detectors perform a plurality of parallel linear scanning passes across the area of the test object to acquire images of the test object under different viewing angles. Based on the acquired image data, the computing device determines a warp compensation and generates a cross-sectional image of a selected section within the test object.