Patents Assigned to THE CO., LTD.
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Publication number: 20230413630Abstract: Parasitic capacitance of a wiring in a display device is decreased. A display device having both a high definition and a high frame frequency is provided. A high-resolution display device is provided. A semiconductor device used in the display device includes a first resin layer between a first wiring and a transistor, a first insulating layer between the first resin layer and the transistor, a second resin layer between the transistor and a second wiring, and a second insulating layer between the second resin layer and the transistor. The first insulating layer and the second insulating layer include an inorganic insulating film containing nitrogen. Furthermore, the first resin layer and the second resin layer have lower permittivities than the first insulating layer and the second insulating layer, respectively, and are greater than or equal to five times and less than or equal to 100 times as thick as the first insulating layer and the second insulating layer, respectively.Type: ApplicationFiled: November 2, 2021Publication date: December 21, 2023Applicant: Semiconductor Energy Laboratory Co., Ltd.Inventors: Shunpei YAMAZAKI, Kenichi OKAZAKI
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Publication number: 20230413664Abstract: Provided are a compound that further improves the performance of an organic EL element, an organic electroluminescent element having further improved element performance, and an electronic device including the organic electroluminescent element. A compound represented by the following formula (1): wherein each of the symbols in the formula (1) is defined in the description; an organic electroluminescent element including the compound; and an electronic device including the organic electroluminescent element.Type: ApplicationFiled: November 26, 2021Publication date: December 21, 2023Applicant: IDEMITSU KOSAN CO.,LTD.Inventors: Tasuku HAKETA, Takuto FUKAMI, Shota TANAKA, Yusuke TAKAHASHI, Tsukasa SAWATO
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Publication number: 20230411277Abstract: Capacitors and interconnect structures that couple transistors to one another include parallel stacked metal lines separated by dielectric layers. When capacitors and interconnect structures are combined, each top metal capacitor plate can be coupled to the nearest upper metal line by a through-via, while each bottom metal capacitor plate can be coupled directly to the nearest lower metal line without a via. When a back end of line (BEOL) cell includes multiple capacitors, and design rules require shrinking the cell dimensions, substituting an alternative design that has fewer through-vias can facilitate compaction of the BEOL cell. Similarly, placing capacitors in close proximity so that they can share through-vias can allow even further compaction.Type: ApplicationFiled: June 17, 2022Publication date: December 21, 2023Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Meng-Hsien Lin, Hsing-Chih Lin, Ke Chun Liu, Min-Feng Kao, Kuan-Hua Lin
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Publication number: 20230411411Abstract: A display substrate, a manufacturing method thereof and a display device. The display substrate includes a base substrate and a plurality of subpixels arranged in an array form on the base substrate. Each subpixel includes a voltage stabilizing electrode, and a subpixel driving circuitry including a driving transistor, and a first transistor, a first electrode of which is coupled to a second electrode of the driving transistor, and a second electrode of which is coupled to a gate electrode of the driving transistor. An active layer of the first transistor includes a first semiconductor portion and a second semiconductor portion spaced apart from each other, and a conductor portion coupled to thereto. An orthogonal projection of the conductor portion onto the base substrate overlaps an orthogonal projection of voltage stabilizing electrode of a previous subpixel in the first direction onto the base substrate.Type: ApplicationFiled: August 2, 2023Publication date: December 21, 2023Applicants: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Mengqi WANG, Siyu WANG, Huijun LI
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Publication number: 20230411498Abstract: A method for fabricating semiconductor device may include forming a source/drain pattern on a fin-type pattern, forming an etch stop film and an interlayer insulating film on the source/drain pattern, forming a contact hole in the interlayer insulating film, forming a sacrificial liner along a sidewall and a bottom surface of the contact hole, performing an ion implantation process while the sacrificial liner is present, removing the sacrificial liner and forming a contact liner along the sidewall of the contact hole, and forming a source/drain contact on the contact liner. The ion implantation process may include implant impurities into the source/drain pattern. The source/drain contact may be connected to the source/drain pattern.Type: ApplicationFiled: February 28, 2023Publication date: December 21, 2023Applicant: Samsung Electronics Co., Ltd.Inventors: Kyu-Hee HAN, Bong Kwan BAEK, Sang Shin JANG, Koung Min RYU, Jong Min BAEK, Jung Hoo SHIN, Jun Hyuk LIM, Jung Hwan CHUN
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Publication number: 20230413599Abstract: A flip-chip light emitting diode includes a light-emitting epitaxial laminated layer having a first surface, and a second surface opposing the first surface, and including a first semiconductor layer, an active layer, and a second semiconductor layer, wherein the first surface is a roughened surface; a transparent bonding medium layer over the first surface of the light-emitting epitaxial laminated layer and bonded with a transparent substrate; and a first electrode and a second electrode respectively over a first electrode region and a second electrode region over the second surface of the light-emitting epitaxial laminated layer.Type: ApplicationFiled: September 6, 2023Publication date: December 21, 2023Applicant: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.Inventors: Wei-ping XIONG, Shu-Fan YANG, Chun-Yi WU, Chaoyu WU
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Publication number: 20230411605Abstract: The present invention relates to a positive electrode active material, and a lithium secondary battery using a positive electrode including the same. More particularly, the present invention relates to a positive electrode active material that has increased efficiency in the diffusion of lithium ions and/or charges and increased structural stability by locally forming regions with different concentrations of an arbitrary transition metal in a primary particle, and a lithium secondary battery using a positive electrode including the same.Type: ApplicationFiled: April 20, 2023Publication date: December 21, 2023Applicant: ECOPRO BM CO., LTD.Inventors: Min Su JO, Moon Ho CHOI, Jun Won SUH, Bo Hyun KONG
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Publication number: 20230408914Abstract: Provided are a more reliable display panel, in which decomposition is performed using a photoinitiator having a radical-forming functional group with weak binding affinity, it is decomposed at a lower temperature and the thus-formed pattern not only releases a smaller amount of outgas, but also forms a pattern with high sensitivity.Type: ApplicationFiled: October 4, 2021Publication date: December 21, 2023Applicant: DUK SAN NEOLUX CO., LTD.Inventors: Changmin LEE, Yun Jong KO, Jun BAE, Jun Ki KIM, Jaehyun LIM, Seo Jeong JEON, Soung Yun MUN
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Publication number: 20230406996Abstract: Provided is a technique that provides high durability and high flexibility at low temperatures. A polyurethane resin composition is produced by chain-extending, using polyamine, a reaction product between a polyol including at least one polyether polyol of polytetramethylene ether glycol or polypropylene glycol, 1,10-decanediol, and a polyol including an anionic hydrophilic group, and polyisocyanate.Type: ApplicationFiled: January 31, 2022Publication date: December 21, 2023Applicant: DKS Co. Ltd.Inventors: Fumiya KANEKO, Takuma NISHIMURA, Shinya MIZUKAMI
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Publication number: 20230408471Abstract: A gas measuring apparatus (100), including: a gas collecting device (102), including two gas entrapping compartments (1021, 1022); a fixing frame (103), which is rotatably connected with the gas collecting device (102); positioning holders (104, 105), each of which is located below a corresponding one of the two gas entrapping compartments (1021, 1022) and is configured to limit the rotation angle of the gas collecting device (102) by colliding with an edge of the corresponding one of the gas entrapping compartments (1021, 1022); a chamber (101), which accommodates the gas collecting device (102), the fixing frame (103), the positioning holders (104, 105) and a liquid medium; and a gas inlet (106), which is located below the gas collecting device (102). The apparatus (100) solves the problem of relatively low accuracy of measurement results.Type: ApplicationFiled: November 3, 2021Publication date: December 21, 2023Applicant: Nova Skantek Instruments (Beijing) Co, Ltd.Inventors: Chao Li, Hanguang Xue
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Publication number: 20230405432Abstract: The present invention is related to a device and method for sensing motion of sphere moving on plane using single-camera, and device and method for sensing motion of golf ball moving on putting mat that a low-cost single-camera is used for sensing a sports sphere moving on a plane as a target object, and the sports sphere can be detected without a separate dedicated lighting and a space in which the sphere moves can be recognized, so it can be used regardless of location with a simple configuration, away from the limitation that the installation position of the camera must be fixed.Type: ApplicationFiled: October 5, 2021Publication date: December 21, 2023Applicant: GOLFZON CO., LTD.Inventors: Soo Ho CHANG, Yeong Kwang PARK, Jae Hong KIM, Tae Suk KO
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Publication number: 20230409010Abstract: The present disclosure discloses an industrial Internet of things with a sensor network platform in a front sub platform type, comprising: a user platform, a service platform, a management platform, a sensor network platform, and an object platform which are interacted sequentially. The sensor network platform adopts front sub platform layout, which can process data for different target objects, and then summarize data, so as to reduce the data processing capacity of entire sensor network platform. The management platform is arranged independently to form multiple independent data processing channels of the same or different. The gateway on each communication network shares part of the calculation for the management platform, effectively reducing the calculation pressure of the management platform, and ensuring that the data is transmitted according to a specific path or processed by a specific server, so as to ensure the safety and independence of the data.Type: ApplicationFiled: June 20, 2022Publication date: December 21, 2023Applicant: CHENGDU QINCHUAN IOT TECHNOLOGY CO., LTD.Inventors: Zehua SHAO, Yong LI, Bin LIU, Yaqiang QUAN, Xiaojun WEI
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Publication number: 20230411268Abstract: A semiconductor package substrate including a substrate; a first protective layer disposed on the substrate and including a through hole; and a second protective layer disposed inside the through hole of the first protective layer and spaced apart from the first protective layer, wherein a first edge of the first protective layer faces a first edge of the second protective layer, wherein a space between the first edge of the first protective layer and the first edge of the second protective layer includes at least a first separation region and a second separation region, and wherein a first width of the space in the first separation region is different than a second width of the space in the second separation region.Type: ApplicationFiled: April 24, 2023Publication date: December 21, 2023Applicant: LG INNOTEK CO., LTD.Inventors: Hodol YOO, Seongun EOM, Yongsoo LEE
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Publication number: 20230412728Abstract: A call test system sets up a call between a calling terminal and a called terminal. The call test system generates an original signal in a first format and converts it to a second format which can be stored in a memory of the calling terminal. The calling terminal sends the signal in the second format over the channel to the called terminal. The called terminal stores the received signal in the second format and sends it to the call test system. The call test system converts the received signal in the second format to the first format and compares it with the original signal in the first format. The comparison may be in the time domain and/or the frequency domain.Type: ApplicationFiled: August 25, 2022Publication date: December 21, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventor: Hui XU
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Publication number: 20230410891Abstract: A method for using a high bandwidth memory controller includes providing a clock signal having a first clock frequency, providing a write strobe signal having a second clock frequency, providing a write command/address signal based on the clock signal, and providing a write data signal based on the write strobe signal. The first clock frequency is half of the second clock frequency, the write strobe signal has two cycles of pre-amble before the write data signal, and the write strobe signal has two cycles of post-amble after the write data signal.Type: ApplicationFiled: August 30, 2023Publication date: December 21, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byongmo MOON, Jihye KIM, Je Min RYU, Beomyong KIL, Sungoh AHN
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Publication number: 20230411532Abstract: A thin film transistor (TFT) device is provided. The TFT device includes a substrate, a semiconductor channel layer, an ohmic contact layer, and a source-drain layer that are sequentially arranged on one side of the substrate. In the channel region, a compensation pattern is disposed on a surface of the semiconductor channel layer away from the substrate. The compensation pattern and the semiconductor channel layer are different types of semiconductors. By disposing the compensation pattern on the surface of the semiconductor channel layer away from the substrate, the compensation pattern and the semiconductor channel layer are different types of semiconductors, the compensation pattern can further improve a conductivity of a PNP structure, or the compensation pattern can further reduce a leakage current of a NPN structure.Type: ApplicationFiled: July 24, 2022Publication date: December 21, 2023Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventor: Qunfang Liang
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Publication number: 20230405452Abstract: A method for controlling game display includes: providing an attachment point on the target virtual three-dimensional model; in response to a first touch operation on the graphical user interface, adjusting a default viewing angle for shooting the three-dimensional game scene with the virtual camera to a current viewing angle, and updating a first coordinate of the attachment point in a camera space of the virtual camera; determining a second coordinate of the attachment point in a screen space according to the updated first coordinate of the attachment point in the camera space; determining an anchor point coordinate in the screen space of an anchor point of a two-dimensional UI control associated with the target virtual three-dimensional model according to the second coordinate of the attachment point in the screen space; and displaying the two-dimensional UI control in the graphical user interface according to the anchor point coordinate.Type: ApplicationFiled: December 2, 2021Publication date: December 21, 2023Applicant: NETEASE (HANGZHOU) NETWORK CO., LTD.Inventors: Shihan HU, Yiming FENG
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Publication number: 20230408759Abstract: A multicore fiber includes: a plurality of core portions made of glass; and a cladding portion made of glass and configured to surround outer periphery of the plurality of core portions. The cladding portion has tensile stress of 20 MPa or lower in a region on outer periphery side than a core portion that is closest to outer periphery of the cladding portion in the plurality of core portions.Type: ApplicationFiled: September 5, 2023Publication date: December 21, 2023Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Masanori TAKAHASHI, Koichi MAEDA, Ryuichi SUGIZAKI
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Publication number: 20230413438Abstract: Disclosed is an electronic device including an upper housing and a lower housing, a first circuit board, a second circuit board, and a supporting member connected between the first circuit board and the second circuit board being provided between the upper housing and the lower housing. The supporting member has a first installation surface, a second installation surface, and a bending portion connected between the first installation surface and the second installation surface. The first installation surface is located below the second installation surface and the first circuit board is provided on the first installation surface. A connecting part is provided on the first circuit board, the first circuit board is fixed to the first installation surface by the connecting part, the second circuit board is fixed to the second installation surface, the lower housing is connected with the connecting part.Type: ApplicationFiled: August 7, 2023Publication date: December 21, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Peiyu CHEN, Wenri LIU
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Publication number: 20230408118Abstract: The humidifier includes a humidifying member, a storage water tank, a circulating water tank, a residual water tank, a supply pump configured to supply water accommodated in the storage water tank to the circulating water tank, a circulating pump configured to supply water accommodated in the circulating water tank to the humidifying member. A fan configured to blow air toward the humidifying member and thereby cause water evaporated to be discharged outside the humidifier, an internal pipe configured to form a flow passage through which water not evaporated by the humidifying member is recovered to the circulating water tank, a drainage member configured to selectively discharge water accommodated in the circulating water tank to the residual water tank, and a controller configured to operate the humidifier in humidity mode based on the water level in the storage water tank.Type: ApplicationFiled: September 1, 2023Publication date: December 21, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sanghoon LEE, Changmin SEOK, Seojeong KIM, Beomseok SEO