Patents Assigned to The Micromanipulator Company, Inc.
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Publication number: 20070290703Abstract: A method and system for probing with electrical test signals on an integrated circuit specimen using a high resolution microscope positioned for observing a surface of the specimen exposing electrically conductive terminals thereon. A housing is provided with a carrier therein for supporting the specimen in relation to the microscope and a probe assembly is positionable on the surface of the specimen for conveying and acquiring electrical test signals to and from the specimen. A drive system is provided for shifting at least one of the probe and the carrier to a predetermined test position. In one form the system has a heat shield for protecting one of the probe assembly and the carrier from heat energy generated upon operation of the drive system, and in another form, the system has an environmental control for maintaining a desired temperature within the housing so that accurate measurements may be taken from the specimen.Type: ApplicationFiled: February 16, 2007Publication date: December 20, 2007Applicant: THE MICROMANIPULATOR COMPANY, INC.Inventor: Kenneth Hollman
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Patent number: 6917195Abstract: The invention relates to a chuck apparatus for a wafer probe station in which the central conductive surface supports a device-under-test (DUT) over a conductive lower chuck portion. An insulator positions the center conductor surface of the chuck above the lower chuck portion and also positions an electrically isolated conductor along its periphery. A laterally extending shielding element is provided for shielding electromagnetic interference (EMI) from the center conductor surface and the lower chuck portion. The electrically isolated conductor and the conductive lower chuck portion may cooperate to form a line-of-sight electrical barrier between the center conductor surface and the laterally extending shielding element. The invention further relates to methods of manufacturing the chuck apparatus and using the apparatus to accomplish low current and voltage tests in a probe station.Type: GrantFiled: March 5, 2004Date of Patent: July 12, 2005Assignee: The Micromanipulator Company, Inc.Inventor: Kenneth F. Hollman
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Patent number: 6838895Abstract: A method and system for probing with electrical test signals on an integrated circuit specimen using a scanning electron microscope (SEM) positioned for observing a surface of the specimen exposing electrically conductive terminals on the specimen. A carrier is provided for supporting the specimen in relation to the scanning electron microscope while a computer acquires an image identifying conductive path indicia of the surface of the specimen from the scanning electron microscope. A motorized manipulator remotely controlled by the computer manipulates a plurality of probes position able on the surface of the specimen for conveying electrical test signals inside a vacuum chamber inner enclosure which houses the scanning electron microscope, the carrier, the motorized manipulator and the plurality of probes for analyzing the specimen in a vacuum. A feed through on the vacuum chamber couples electrical signals from the computer to the motorized manipulator and the plurality of probes.Type: GrantFiled: September 15, 2003Date of Patent: January 4, 2005Assignee: The Micromanipulator Company, Inc.Inventor: Kenneth F. Hollman
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Publication number: 20040227505Abstract: The invention relates to a chuck apparatus for a wafer probe station in which the central conductive surface supports a device-under-test (DUT) over a conductive lower chuck portion. An insulator positions the center conductor surface of the chuck above the lower chuck portion and also positions an electrically isolated conductor along its periphery. A laterally extending shielding element is provided for shielding electromagnetic interference (EMI) from the center conductor surface and the lower chuck portion. The electrically isolated conductor and the conductive lower chuck portion may cooperate to form a line-of-sight electrical barrier between the center conductor surface and the laterally extending shielding element. The invention further relates to methods of manufacturing the chuck apparatus and using the apparatus to accomplish low current and voltage tests in a probe station.Type: ApplicationFiled: March 5, 2004Publication date: November 18, 2004Applicant: The Micromanipulator Company, Inc.Inventor: Kenneth F. Hollman
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Publication number: 20040207424Abstract: A method and system for probing with electrical test signals on an integrated circuit specimen using a high resolution microscope positioned for observing a surface of the specimen exposing electrically conductive terminals thereon. A housing is provided with a carrier therein for supporting the specimen in relation to the microscope and a probe assembly is positionable on the surface of the specimen for conveying and acquiring electrical test signals to and from the specimen. A drive system is provided for shifting at least one of the probe and the carrier to a predetermined test position. In one form the system has a heat shield for protecting one of the probe assembly and the carrier from heat energy generated upon operation of the drive system, and in another form, the system has an environmental control for maintaining a desired temperature within the housing so that accurate measurements may be taken from the specimen.Type: ApplicationFiled: April 1, 2004Publication date: October 21, 2004Applicant: The Micromanipulator Company, Inc.Inventor: Kenneth F. Hollman
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Patent number: 6803756Abstract: The invention relates to a chuck apparatus for a wafer probe station in which the central conductive surface supports a device-under-test (DUT) over a conductive lower chuck portion. An insulator positions the center conductor surface of the chuck above the lower chuck portion and also positions an electrically isolated conductor along its periphery. A laterally extending shielding element is provided for shielding electromagnetic interference (EMI) from the center conductor surface and the lower chuck portion. The electrically isolated conductor and the conductive lower chuck portion may cooperate to form a line-of-sight electrical barrier between the center conductor surface and the laterally extending shielding element. The invention further relates to methods of manufacturing the chuck apparatus and using the apparatus to accomplish low current and voltage tests in a probe station.Type: GrantFiled: April 29, 2002Date of Patent: October 12, 2004Assignee: The Micromanipulator Company, Inc.Inventors: Kenneth F. Hollman, Daniel L. Harrison
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Patent number: 6744268Abstract: A specimen probing apparatus in provided including a vacuum chamber within which a carrier for the specimen to be probed and a probe assembly are positioned. The housing for the chamber is preferably constructed to allow a variety of options for electrically isolating the test environment in the chamber. Also, unique drive or shift assemblies for the carrier and probe assembly are disclosed for allowing precision movements thereof in the vacuum chamber.Type: GrantFiled: April 8, 2002Date of Patent: June 1, 2004Assignee: The Micromanipulator Company, Inc.Inventor: Kenneth F. Hollman
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Publication number: 20040056672Abstract: A method and system for probing with electrical test signals on an integrated circuit specimen using a scanning electron microscope (SEM) positioned for observing a surface of the specimen exposing electrically conductive terminals on the specimen. A carrier is provided for supporting the specimen in relation to the scanning electron microscope while a computer acquires an image identifying conductive path indicia of the surface of the specimen from the scanning electron microscope. A motorized manipulator remotely controlled by the computer manipulates a plurality of probes positionable on the surface of the specimen for conveying electrical test signals inside a vacuum chamber inner enclosure which houses the scanning electron microscope, the carrier, the motorized manipulator and the plurality of probes for analyzing the specimen in a vacuum. A feedthrough on the vacuum chamber couples electrical signals from the computer to the motorized manipulator and the plurality of probes.Type: ApplicationFiled: September 15, 2003Publication date: March 25, 2004Applicant: The Micromanipulator Company, Inc.Inventor: Kenneth F. Hollman
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Patent number: 6700397Abstract: The invention relates to a probe assembly for a wafer probe station having a probe holder and a replaceable probe tip. The probe holder is triaxially configured with a laterally extending center signal conductor, an intermediate guard conductor extending along the length of the center conductor and spaced radially therefrom by a tubular insulator member, and an outer shield member extending along a portion of the guard conductor and spaced radially therefrom by a second tubular insulator member. A coaxially configured probe tip has a center conductor extending to a probe point and a guard conductor radially spaced from the center conductor by an intermediate insulator. A releasable connection provides a rigid attachment between the probe tip and the probe holder and provides electrical interfaces between the center and guard conductors thereof.Type: GrantFiled: March 23, 2001Date of Patent: March 2, 2004Assignee: The Micromanipulator Company, Inc.Inventors: Kenneth Hollman, Robert Hancock, Daniel Smith
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Patent number: 6621282Abstract: A method and system for probing with electrical test signals on an integrated circuit specimen using a scanning electron microscope (SEM) positioned for observing a surface of the specimen exposing electrically conductive terminals on the specimen. A carrier is provided for supporting the specimen in relation to the scanning electron microscope while a computer acquires an image identifying conductive path indicia of the surface of the specimen from the scanning electron microscope. A motorized manipulator remotely controlled by the computer manipulates a plurality of probes positionable on the surface of the specimen for conveying electrical test signals inside a vacuum chamber inner enclosure which houses the scanning electron microscope, the carrier, the motorized manipulator and the plurality of probes for analyzing the specimen in a vacuum. A feedthrough on the vacuum chamber couples electrical signals from the computer to the motorized manipulator and the plurality of probes.Type: GrantFiled: January 30, 2001Date of Patent: September 16, 2003Assignee: The Micromanipulator Company, Inc.Inventor: Kenneth F. Hollman
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Publication number: 20020118009Abstract: The invention relates to a chuck apparatus for a wafer probe station in which the central conductive surface supports a device-under-test (DUT) over a conductive lower chuck portion. An insulator positions the center conductor surface of the chuck above the lower chuck portion and also positions an electrically isolated conductor along its periphery. A laterally extending shielding element is provided for shielding electromagnetic interference (ENI) from the center conductor surface and the lower chuck portion. The electrically isolated conductor and the conductive lower chuck portion max cooperate to form a line-of-sight electrical barrier between the center conductor surface and the laterally extending shielding element. The invention further relates to methods of manufacturing the chuck apparatus and using the apparatus to accomplish low current and voltage tests in a probe station.Type: ApplicationFiled: April 29, 2002Publication date: August 29, 2002Applicant: The Micromanipulator Company, Inc.Inventors: Kenneth F. Hollman, Daniel L. Harrison
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Patent number: 6424141Abstract: The invention relates to a chuck apparatus for a wafer probe station in which the central conductive surface supports a device-under-test (DUT) over a conductive lower chuck portion. An insulator positions the center conductor surface of the chuck above the lower chuck portion and also positions an electrically isolated conductor along its periphery. A laterally extending shielding element is provided for shielding electromagnetic interference (EMI) from the center conductor surface and the lower chuck portion. The electrically isolated conductor and the conductive lower chuck portion may cooperate to form a line-of-sight electrical barrier between the center conductor surface and the laterally extending shielding element The invention further relates to methods of manufacturing the chuck apparatus and using the apparatus to accomplish low current and voltage tests in a probe station.Type: GrantFiled: July 13, 2000Date of Patent: July 23, 2002Assignee: The Micromanipulator Company, Inc.Inventors: Kenneth F. Hollman, Daniel L. Harrison
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Publication number: 20020075027Abstract: The invention relates to a probe assembly for a wafer probe station having a probe holder and a replaceable probe tip. The probe holder is triaxially configured with a laterally extending center signal conductor, an intermediate guard conductor extending along the length of the center conductor and spaced radially therefrom by a tubular insulator member, and an outer shield member extending along a portion of the guard conductor and spaced radially therefrom by a second tubular insulator member. A coaxially configured probe tip has a center conductor extending to a probe point and a guard conductor radially spaced from the center conductor by an intermediate insulator. A releasable connection provides a rigid attachment between the probe tip and the probe holder and provides electrical interfaces between the center and guard conductors thereof.Type: ApplicationFiled: March 23, 2001Publication date: June 20, 2002Applicant: The Micromanipulator Company, Inc.Inventors: Kenneth Hollman, Robert Hancock, Daniel Smith
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Publication number: 20020000819Abstract: A method and system for probing with electrical test signals on an integrated circuit specimen using a scanning electron microscope (SEM) positioned for observing a surface of the specimen exposing electrically conductive terminals on the specimen. A carrier is provided for supporting the specimen in relation to the scanning electron microscope while a computer acquires an image identifying conductive path indicia of the surface of the specimen from the scanning electron microscope. A motorized manipulator remotely controlled by the computer manipulates a plurality of probes positionable on the surface of the specimen for conveying electrical test signals inside a vacuum chamber inner enclosure which houses the scanning electron microscope, the carrier, the motorized manipulator and the plurality of probes for analyzing the specimen in a vacuum. A feedthrough on the vacuum chamber couples electrical signals from the computer to the motorized manipulator and the plurality of probes.Type: ApplicationFiled: January 30, 2001Publication date: January 3, 2002Applicant: The Micromanipulator Company, Inc.Inventor: Kenneth F. Hollman
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Patent number: 6198299Abstract: A method and system for probing with electrical test signals on an integrated circuit specimen using a scanning electron microscope (SEM) positioned for observing a surface of the specimen exposing electrically conductive terminals on the specimen. A carrier is provided for supporting the specimen in relation to the scanning electron microscope while a computer acquires an image identifying conductive path indicia of the surface of the specimen from the scanning electron microscope. A motorized manipulator remotely controlled by the computer manipulates a plurality of probes positionable on the surface of the specimen for conveying electrical test signals inside a vacuum chamber inner enclosure which houses the scanning electron microscope, the carrier, the motorized manipulator and the plurality of probes for analyzing the specimen in a vacuum. A feedthrough on the vacuum chamber couples electrical signals from the computer to the motorized manipulator and the plurality of probes.Type: GrantFiled: August 27, 1998Date of Patent: March 6, 2001Assignee: The Micromanipulator Company, Inc.Inventor: Kenneth F. Hollman
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Patent number: 6191598Abstract: A method and system for probing with electrical test signals on an integrated circuit specimen using a scanning electron microscope (SEM) positioned for observing a surface of the specimen exposing electrically conductive terminals on the specimen. A carrier is provided for supporting the specimen in relation to the scanning electron microscope while a computer acquires an image identifying conductive path indicia of the surface of the specimen from the scanning electron microscope. A motorized manipulator remotely controlled by the computer manipulates a plurality of probes positionable on the surface of the specimen for conveying electrical test signals inside a vacuum chamber inner enclosure which houses the scanning electron microscope, the carrier, the motorized manipulator and the plurality of probes for analyzing the specimen in a vacuum. A feedthrough on the vacuum chamber couples electrical signals from the computer to the motorized manipulator and the plurality of probes.Type: GrantFiled: March 17, 2000Date of Patent: February 20, 2001Assignee: The Micromanipulator Company, Inc.Inventor: Kenneth F. Hollman
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Patent number: 4893914Abstract: A test station for use in evaluating semiconductor chips and the like. The test station has improved components for supporting and adjusting the positions of a microscope and stage relative to a base surface which supports a plurality of probes.Type: GrantFiled: October 12, 1988Date of Patent: January 16, 1990Assignee: The Micromanipulator Company, Inc.Inventors: Robert D. Hancock, Kenneth F. Hollman, Gene A. Porter