Abstract: An antenna includes excitation terminals responsive to an RF source to supply an RF electromagnetic field to a plasma that processes a workpiece in a vacuum chamber. The coil includes a transformer having a primary winding coupled to the excitation terminals and a multi-turn plasma excitation secondary winding connected in series with a capacitor.

Abstract: Systems and methods for providing device and/or device type fingerprinting based on properties of network traffic originating from a device to be identified. In one implementation, the method includes capturing packets routed through a network at an intermediate node between the originating device to be identified and destination, measuring properties of the captured traffic, including packet inter-arrival time, and generating a signature based on the measured properties that includes identifying information about the hardware and/or software architecture of the device. Various implementations do not require deep packet inspection, do not require a managed device-side client, are protocol and packet payload agnostic, and effective for MAC or IP-level encrypted streams. Also, various implementations can provide wired-side detection of wireless devices and device types and can detect both previously detected and unknown devices.

Abstract: A group of tertiary amine azides are useful as hypergolic fuels for hypergolic bipropellant mixtures. The fuels provide higher density impulses than monomethyl hydrazine (MMH) but are less toxic and have lower vapor pressures that MMH. In addition, the fuels have shorter ignition delay times than dimethylaminoethylazide (DMAZ) and other potential reduced toxicity replacements for MMH.

Abstract: An electrical device support assembly that includes a bracket member that can be mounted on a building wall stud during new construction, and a frame, external to the wall substrate, that is engageable with the bracket member through an opening in the wall substrate. The bracket member may have a plurality of flange elements extending from the perimeter edge of the opening in an internal direction from the wall substrate.

Abstract: The invention is directed toward a vapor-liquid heat and/or mass exchange device that can be used in an integrated heat and/or mass transfer system. To achieve high heat and mass transfer rates, optimal temperature profiles, size reduction and performance increases, appropriately sized flow passages with microscale features, and countercurrent flow configurations between working fluid solution, vapor stream, and/or the coupling fluid in one or more functional sections of the desorber are implemented. In one exemplary embodiment of the present invention, a desorber section utilizes a heating fluid flowing in a generally upward direction and a concentrated solution flowing in a generally downward direction with gravity countercurrent to the rising desorbed vapor stream. To further increase the efficiency of the system, various types of column configurations can be used. Additionally, the surfaces of the microchannels can be altered to better transfer heat.

Abstract: Wafer temperature is measured as a function of time following removal of a heat source to which the wafer is exposed. During the wafer temperature measurements, a gas is supplied at a substantially constant pressure at an interface between the wafer and a chuck upon which the wafer is supported. A chuck thermal characterization parameter value corresponding to the applied gas pressure is determined from the measured wafer temperature as a function of time. Wafer temperatures are measured for a number of applied gas pressures to generate a set of chuck thermal characterization parameter values as a function of gas pressure. A thermal calibration curve for the chuck is generated from the set of measured chuck thermal characterization parameter values and the corresponding gas pressures. The thermal calibration curve for the chuck can be used to tune the gas pressure to obtain a particular wafer temperature during a fabrication process.

Abstract: The present invention provides an apparatus for fluidics-based automated orientation of plant embryos. The apparatus comprises flow channels, flow direction means, an orientation detector and a control unit. The orientation of embryos suspended in liquid flowing individually through the flow channels is constrained to cotyledon-first or cotyledon-last orientation by dimensional constraints. The orientation is determined by the orientation detector. Embryos not oriented as desired are directed into a reservoir tube by the flow direction means, after which the flow is directed from the reservoir tube to the outlet thereby having reoriented the embryo. Means of sorting viable embryos from other objects are optionally included in the apparatus.

Abstract: A temperature-controlled hot edge ring assembly adapted to surround a semiconductor substrate supported in a plasma reaction chamber is provided. A substrate support with an annular support surface surrounds a substrate support surface. A radio-frequency (RF) coupling ring overlies the annular support surface. A lower gasket is between the annular support surface and the RF coupling ring. The lower gasket is thermally and electrically conductive. A hot edge ring overlies the RF coupling ring. The substrate support is adapted to support a substrate such that an outer edge of the substrate overhangs the hot edge ring. An upper thermally conductive medium is between the hot edge ring and the RF coupling ring. The hot edge ring, RF coupling ring and annular support surface can be mechanically clamped. A heating element can be embedded in the RF coupling ring.

Abstract: A microelectromechanical resonator can include a suspended frame-shaped beam anchored at four corners thereof to a surrounding substrate along with a suspended resonator plate tethered on four sides thereof to corresponding sides of the frame-shaped beam. A pair of drive electrodes are provided on first and third diametrically opposite corners of the frame-shaped beam and a pair of sense electrodes are provided on second and fourth diametrically opposite corners of the frame-shaped beam. The resonator may also include a ground electrode on the frame-shaped beam and a piezoelectric layer sandwiched between each of the drive and sense electrodes and the ground electrode.

Abstract: A method for processing a substrate is disclosed. The method includes supporting the substrate in the plasma-processing chamber configured with a first electrode and a second electrode. The method also includes coupling a passive radio frequency (RF) circuit to the second electrode, the passive RF circuit being configured to adjust one or more of an RF impedance, an RF voltage potential, and a DC bias potential on the second electrode.

Abstract: Using a sling that includes a central portion and at least two arms extending from the central portion, a method of treating anal incontinence may include positioning the central portion posteriorly to the rectum and/or anus of a subject, and extending each arm of the sling to a respective obturator region. Using a sling having the same or similar structure, a method of treating pelvic organ prolapse may include positioning the central portion beneath the ano-rectum of a subject, and extending each arm of the sling to a respective thigh incision near the obturator region.

Abstract: A bonded assembly to reduce particle contamination in a semiconductor vacuum chamber such as a plasma processing apparatus is provided, including an elastomeric sheet adhesive bond between mating surfaces of a component and a support member to accommodate thermal stresses. The elastomeric sheet comprises a silicone adhesive to withstand a high shear strain of ?800% at a temperature range between room temperature and 300° C. such as heat curable high molecular weight dimethyl silicone with optional fillers. The sheet form has bond thickness control for parallelism of bonded surfaces. The sheet adhesive may be cut into pre-form shapes to conform to regularly or irregularly shaped features, maximize surface contact area with mating parts, and can be installed into cavities. Installation can be manually, manually with installation tooling, or with automated machinery. Composite layers of sheet adhesive having different physical properties can be laminated or coplanar.

Abstract: A temperature control module for a showerhead electrode assembly for a semiconductor material plasma processing chamber includes a heater plate adapted to be secured to a top surface of a top electrode of the showerhead electrode assembly, and which supplies heat to the top electrode to control the temperature of the top electrode; a cooling plate adapted to be secured to and thermally isolated from a surface of a top plate of the showerhead electrode assembly, and to cool the heater plate and control heat conduction between the top electrode and heater plate; and at least one thermal choke adapted to control heat conduction between the heater plate and cooling plate.

Abstract: Systems and methods are presented for a peripheral RF feed and symmetric RF return for symmetric RF delivery. According to one embodiment, a chuck assembly for plasma processing is provided. The chuck assembly includes an electrostatic chuck having a substrate support surface on a first side, a facility plate coupled to the electrostatic chuck on a second side that is opposite the substrate support surface, a peripheral RF feed configured to deliver RF power, the peripheral RF feed having a first portion contacting a periphery of the facility plate and an RF strap coupling the peripheral RF feed to an RF source.

Abstract: A system and method of plasma processing includes a plasma chamber including a substrate support and an upper electrode opposite the substrate support, the upper electrode having a plurality of concentric temperature control zones and a controller coupled to the plasma chamber.

Abstract: A CMUT on CMOS imaging chip is disclosed. The imaging chip can use direct connection, CMOS architecture to minimize external connections and minimize chip cross-section. The CMOS architecture can enable substantially the entire chip area to be utilized for element placement. The chip can utilize arbitrarily selected transmit (Tx) and receive (Rx) element arrays to improve image quality, while reducing sampling time. The chip can comprise a plurality of dummy elements dispersed throughout the Tx and Rx elements to reduce cross-talk. The chip can utilize batch firing techniques to increase transmit power using sparse Tx arrays. The chip can comprise hexagonal Tx and or Rx subarrays for improved image quality with reduce sample sizes. The chip can utilize electrode geometry, bias voltage, and polarity to create phased and amplitude apodized arrays of Tx and Rx elements.

Abstract: Systems and methods for controlling a plasma edge region are described. One of the systems includes a top electrode and a bottom electrode. The system also includes an upper electrode extension and a lower electrode extension. At least a portion of the plasma edge region is formed between the upper electrode extension and the lower electrode extension. The system includes a circuit to control a radio frequency signal at the upper electrode extension.

Abstract: In one embodiment, a plasma processing assembly may include an upper process body coupled to a hinge body and a lower process body coupled to a base hinge member. The hinge body can be pivotally engaged with the base hinge member. A self locking latch can be pivotally engaged with the base hinge member. When the hinge body is rotated around the first axis of rotation, the protruding latch engagement member can contact the self locking latch and can rotate the self locking latch around the second axis of rotation opposite to the bias direction. The self locking latch can rotate around the second axis of rotation in the bias direction and can block the hinge body from rotating around the first axis of rotation.

Abstract: A system for decoupling arcing RF signals in a plasma chamber including a top electrode, an electrostatic chuck for supporting a semiconductor wafer, and a capacitor coupled between the at least one of a plurality of clamping electrodes in the surface of the electrostatic chuck and a baseplate of the electrostatic chuck, the capacitor having a capacitance of greater than about 19 nanofarads, the capacitor disposed within an interior volume of the electrostatic chuck. A method of decoupling arcing RF signals in a plasma chamber is also disclosed.

Abstract: Systems and methods are presented for a peripheral RF feed and symmetric RF return for symmetric RF delivery. According to one embodiment, a chuck assembly for plasma processing is provided. The chuck assembly includes an electrostatic chuck having a substrate support surface on a first side, and a facility plate coupled to the electrostatic chuck on a second side that is opposite the substrate support surface. A hollow RF feed is configured to deliver RF power, the hollow RF feed defined by a first portion contacting a periphery of the facility plate and a second portion coupled to the first portion, the second portion extending away from the chuck assembly.