Abstract: Systems and methods of manufacturing a shoe outsole are provided wherein at least a portion of the resulting shoe outsole includes embedded particles. An example method includes applying adhesive to at least one region of the shoe outsole, depositing selected particles onto the adhesive to provide the shoe outsole with a first coat of particles, and at least partially curing the adhesive. The method continues by applying additional adhesive over the first coat of particles, depositing additional particles onto the adhesive to provide the shoe outsole with a second coat of particles, and at least partially curing the subsequent application of adhesive.

Abstract: Systems and methods of manufacturing a shoe outsole are provided wherein at least a portion of the resulting shoe outsole includes embedded particles. An example method includes applying adhesive to at least one region of the shoe outsole, depositing selected particles onto the adhesive to provide the shoe outsole with a first coat of particles, and at least partially curing the adhesive. The method continues by applying additional adhesive over the first coat of particles, depositing additional particles onto the adhesive to provide the shoe outsole with a second coat of particles, and at least partially curing the subsequent application of adhesive.

Abstract: Disclosed herein are embodiments of lead-free (Pb-free) or lead-bearing solder column devices that can include an inner core, an outer sleeve surrounding a portion of the inner core, at least one space along a length of the outer sleeve, and a second layer including a solder material coupled with a portion of the inner core within the at least one space. The inner core can be configured to support the solder column so as to prevent a collapse of the solder column at temperatures above a liquidus temperature of the outer sleeve's solder material and the second layer's solder material. The column serves as a heat-sink to conduct excessive heat away from a heat generating semiconductor chip. Moreover, the compliant solder column absorbs strain and mechanical stress caused by a difference in the coefficient of thermal expansion (CTE) connecting the semiconductor chip to a printed circuit board (PCB).

Abstract: An apparatus and system for attaining maximum unidirectional response to vibration damping of a printed circuit board (PCB) or other planar surface utilizing a defined travel displacement of a single tungsten (or other material) cylindrical rod in a single or plurality of sealed cylindrical chambers in a particle impact damper (PID). The single tungsten (or other material) cylindrical rod is not weighed down, constrained, encumbered within the chamber; accordingly, providing unrestricted freedom for the cylinder to quickly respond in a unidirectional direction at the first occurrence of excessive vibrational acceleration over 1G. The structure of a single cylindrical particle within a sealed cylindrical chamber also provides a path of minimum distance for the cylinder to travel before colliding with the ceiling or floor of the PID chamber. A plurality of cylindrical chambers can be arranged in a variety of patterns within the PID housing such as desired.

Abstract: An improved solder column, having a solder core comprising a solder core material, an exoskeleton sleeve structure surrounding at least a majority of an outside surface of the solder core and comprising a plurality of wires woven together to form a mesh, and a plurality of spaces formed in the exoskeleton between the plurality of wires. The exoskeleton sleeve can be configured such that the exoskeleton sleeve will support the solder core so as to prevent a collapse of the solder core at temperatures exceeding a liquidus temperature of the solder core. Optionally, each of the plurality of spaces can have a width and a height that is at least as large as a width of the wire adjacent to the space, and the spaces can be configured to provide additional flexibility to the solder column.

Abstract: Systems and methods of manufacturing a shoe outsole are provided wherein at least a portion of the resulting shoe outsole includes embedded particles. An example method includes applying adhesive to at least one region of the shoe outsole, depositing selected particles onto the adhesive to provide the shoe outsole with a first coat of particles, and at least partially curing the adhesive. The method continues by applying additional adhesive over the first coat of particles, depositing additional particles onto the adhesive to provide the shoe outsole with a second coat of particles, and at least partially curing the subsequent application of adhesive.

Abstract: An apparatus for optimizing vibration attenuation of a printed circuit board (PCB) by means of a tunable control for adjusting the volumetric storage capacity, effective mass and travel displacement of a particle impact damper (PID). The apparatus is comprised of a housing with a single or plurality of sealed storage tank(s) containing a payload of tungsten balls (or other materials) with a single or plurality of adjustment screw(s). The volumetric capacity of the storage tank is at maximum when the screw is fully withdrawn from apparatus. The volumetric capacity of the apparatus is reduced when the screw is inserted into the storage tank. The tunable adjustment screw controls the performance of the PID to dampen and attenuate (reduce) the vibration in a printed circuit board without the need to add or remove the payload of tungsten balls inside the particle impact damper.

Abstract: Systems and methods of manufacturing a shoe outsole are provided wherein at least a portion of the resulting shoe outsole includes embedded particles. An example method includes applying adhesive to at least one region of the shoe outsole, depositing selected particles onto the adhesive to provide the shoe outsole with a first coat of particles, and at least partially curing the adhesive. The method continues by applying additional adhesive over the first coat of particles, depositing additional particles onto the adhesive to provide the shoe outsole with a second coat of particles, and at least partially curing the subsequent application of adhesive.

Abstract: A disposable apparatus with a plurality of preloaded pins such as solder columns, micro-coil springs, or other cylindrically shaped metallic parts (solder columns, et al.) in an array pattern is provided for aligning and dispensing onto a column grid array (CGA) substrate. The apparatus includes a carrier plate with a pattern of holes that is covered by removable covers to retain, position and hold an array of solder columns, et al. Alignment features on the top of the carrier plate plugs into a jig-alignment fixture or frame that precisely positions the solder columns, et al. over a CGA substrate. After inverting (flipping over) the apparatus and jig-fixture or frame upside down, the payload of solder columns, et al. detaches and transfers by gravity onto a pattern of metal pads on the CGA substrate, without the use of vacuum or vibration.

Abstract: Systems and methods of manufacturing a shoe outsole are provided wherein at least a portion of the resulting shoe outsole includes embedded particles. An example method includes applying adhesive to at least one region of the shoe outsole, depositing selected particles onto the adhesive to provide the shoe outsole with a first coat of particles, and at least partially curing the adhesive. The method continues by applying additional adhesive over the first coat of particles, depositing additional particles onto the adhesive to provide the shoe outsole with a second coat of particles, and at least partially curing the subsequent application of adhesive.

Abstract: A disposable apparatus with a plurality of preloaded pins such as solder columns, micro-coil springs, or other cylindrically shaped metallic parts (solder columns, et al.) in an array pattern is provided for aligning and dispensing onto a column grid array (CGA) substrate. The apparatus is comprised of a carrier plate with a pattern of holes that is covered by a layer of sacrificial adhesive tape with sufficient tackiness to retain, position and hold an array of solder columns, et al. Alignment features on the bottom of the carrier plate plugs into a jig alignment fixture that precisely positions the solder columns, et al. over a CGA substrate. After peeling away the sacrificial adhesive tape from the apparatus, the payload of solder columns, et al. detaches and transfers by gravity onto a pattern of metal pads on the CGA substrate, without the use of vacuum or vibration.

Abstract: A shoe having a fabric outsole and method for manufacturing are disclosed. In described embodiments, a shoe outsole with a bottom surface wherein an adhesive is applied to at least a portion of the bottom surface of the shoe outsole and a plurality of fibers are embedded within the adhesive. In the described method embodiment, once the adhesive is applied to the outsole, fibers are sifted down through an electrostatic field onto the adhesive. Once sufficient fibers have been embedded, the adhesive is cured and then cooled.

Abstract: A shoe having a fabric outsole and method for manufacturing are disclosed. In described embodiments, a shoe outsole with a bottom surface wherein an adhesive is applied to at least a portion of the bottom surface of the shoe outsole and a plurality of fibers are embedded within the adhesive. In the described method embodiment, once the adhesive is applied to the outsole, fibers are sifted down through an electrostatic field onto the adhesive. Once sufficient fibers have been embedded, the adhesive is cured and then cooled.