Patents Assigned to Thermal Corp.
  • Patent number: 10349557
    Abstract: An electronics rack comprising a first cage, a first heat sink positioned at a rear and in thermal communication with the first cage, a second cage positioned above the first cage, and a second heat sink in thermal communication with the second cage. In another aspect, the present invention provides an electronics rack comprising a frame, a cage, a heat sink positioned at a rear of the frame, and a compliant thermal collector operatively positioned between the cage and the heat sink. The compliant thermal collector can comprise a heat pipe having a non-linear shape that facilitates flexing of the heat pipe to change the length of the thermal collector. The thermal collector advantageously includes a plurality of heat pipes and a contact bar coupling the plurality of heat pipes. Preferably, the rack further includes an adjusting mechanism (e.g., threaded rods) for adjusting a position of the contact bar.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: July 9, 2019
    Assignee: Thermal Corp.
    Inventors: Walter John Bilski, Jr., Sidrit Kosta
  • Patent number: 10247486
    Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: April 2, 2019
    Assignee: Thermal Corp.
    Inventors: David Sarraf, John Hartenstine, Jerome Toth, Scott Garner
  • Patent number: 10225953
    Abstract: A heat transfer system includes a heat source, a first heat exchanger coupled to the heat source to remove heat from the heat source, and a second heat exchanger coupled to the first heat exchanger to remove heat from the first heat exchanger. The heat transfer system also includes a thermal doubler coupled to the second heat exchanger to remove heat from the second heat exchanger, a first heat pipe coupled to the thermal doubler to remove heat from the thermal doubler, and a second heat pipe coupled to the first heat pipe to remove heat from the first heat pipe.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: March 5, 2019
    Assignee: Thermal Corp.
    Inventor: Nelson Gernert
  • Patent number: 10209003
    Abstract: A thermal management system for a electronics cabinets having an electronics heat source therein. The thermal management system includes a first passive thermal device having an evaporator portion and a condenser portion. The thermal management system can also include a heat sink in contact with air inside the cabinet and in thermal contact with the evaporator portion of the first passive thermal device, wherein the heat sink is contained within the sealed cabinet. The condenser portion of the first passive thermal device can be in contact with a liquid to liquid heat exchanger.
    Type: Grant
    Filed: February 21, 2013
    Date of Patent: February 19, 2019
    Assignee: Thermal Corp.
    Inventor: W. John Bilski
  • Patent number: 10136556
    Abstract: An electronics rack comprising a frame, a heat sink coupled to the frame, and a cage adapted to support an electronic component. The cage is movable between first and second positions toward and away from the heat sink. The rack further includes an eccentric cam operatively positioned between the frame and the cage and being rotatable to move the cage between the first and second positions. In one embodiment, the cage comprises a cooling brick movable toward and away from the heat sink when the cage moves between the first and second positions. The cooling brick can include a first heat pipe extending generally in a first direction and a second heat pipe extending generally in a second direction transverse to the first direction. For example, the first heat pipe can be embedded in a top plate and the second heat pipe can be embedded in a top cold rail.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: November 20, 2018
    Assignee: Thermal Corp.
    Inventors: Walter John Bilski, Sidrit Kosta
  • Patent number: 9810483
    Abstract: A heat transfer device is provided for conducting heat from a heat source. The heat transfer device generally includes an evaporator for generating a vapor, a condenser in fluid communication with the evaporator, and a vapor flow restrictor interposed between the evaporator and the condenser, wherein the vapor flow restrictor can increase vapor pressure in at least a portion of the evaporator relative to vapor pressure in the condenser.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: November 7, 2017
    Assignee: Thermal Corp.
    Inventors: Walter John Bilski, Jerome E. Toth, John G. Thayer
  • Patent number: 9746248
    Abstract: A heat pipe system for conducting thermal energy. The heat pipe system includes a sealed tube having along its length a reservoir region, an evaporator region, and a condenser region, the tube having a first end and a second end and an inside wall. The system also includes a wick disposed adjacent the inside wall of the tube, the wick including a first portion at the first end of the tube and a second portion adjacent the first portion, wherein the first portion of the wick is thicker than the second portion of the wick, and wherein the second portion of the wick does not extend to the second end of the tube. The system also includes a working fluid contained within the tube.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: August 29, 2017
    Assignee: Thermal Corp.
    Inventors: Sergey Y. Semenov, John Gilbert Thayer, Nelson J. Gernert
  • Patent number: 9417015
    Abstract: A backing plate for joining a heat removal device to a heat source. The backing plate can include a planar plate region having a first face and a second face opposite the first face. The backing plate can also include at least one boss projecting from the first face and having an opening therein for receiving a fastener.
    Type: Grant
    Filed: February 21, 2013
    Date of Patent: August 16, 2016
    Assignee: Thermal Corp.
    Inventors: Matt Connors, Jerome E. Toth
  • Patent number: 9417017
    Abstract: A method is provided for heat transfer from a surface to a fluid. The method includes directing a first fluid flow towards the surface in a first direction and directing a second fluid flow towards the surface in a second direction. The first and second fluid flows cooperate to cool the surface.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: August 16, 2016
    Assignee: Thermal Corp.
    Inventors: Anthony Ciulla, Nelson Gernert, Mark T. North, Donald Wood, Smita Agrawal, Tianhong Cui, Longzhong Huang, Vinnee Bharathi A. Selvi, Terrence W. Simon, Taiho Yeom, Youmin Yu, Min Zhang, Congshun Wang, Xuelin Zhu, Tao Zhang
  • Patent number: 9273910
    Abstract: A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources. The evaporator can be an integral vessel made of thermally conductive material to which the multiple heat sources are coupled, preferably at evaporation points that are placed on opposite sides of a fluid reservoir for the liquid phase of the working fluid that feeds the evaporation points via capillary flow through a wicking material.
    Type: Grant
    Filed: October 7, 2008
    Date of Patent: March 1, 2016
    Assignee: Thermal Corp.
    Inventor: Todd M. Wenger
  • Publication number: 20140251577
    Abstract: A heat-transfer system is provided for conveying heat from a heat source, the heat-transfer system generally including a frame for coupling to the heat source, wherein the frame is insertable into a first slot of a cooling chassis, and a heat-transfer rail extending parallel to the frame at an offset distance, wherein the offset distance is dimensioned such that the heat-transfer rail is insertable into a second slot of the cooling chassis. At least one heat-transfer device couples the heat-transfer rail to the frame.
    Type: Application
    Filed: March 8, 2013
    Publication date: September 11, 2014
    Applicant: THERMAL CORP.
    Inventor: Matthew J. Connors
  • Publication number: 20140190667
    Abstract: A capillary device (102) for use in a heat pipe in which heat is transferred from at least one evaporation region to at least one condensation region by means of evaporated working fluid is disclosed. The capillary device comprises a body portion defining chambers (108) containing powdered material (110) therein, wherein at least part of the periphery of at least one said chamber is porous to allow flow of condensed working fluid, by means of capillary action, through said powdered material in said chamber when flowing from a condensation region to an evaporation region.
    Type: Application
    Filed: May 24, 2012
    Publication date: July 10, 2014
    Applicant: THERMAL CORP.
    Inventors: Ryan James McGlen, John Gilbert Thayer
  • Patent number: 8627879
    Abstract: A capillary assisted loop thermosiphon apparatus (100) has at least one evaporator (102) connected by a vapor line (104) to a condenser (106); a liquid line (108) connects the condenser (106) and the evaporator (102), the evaporator (102) is in the direction of gravity from the condenser (106) for the condenser (106) to supply liquid under gravity induced pressure to the evaporator (102), and the evaporator (102) has a vertical capillary wick (102a) in which liquid wicks in the direction of gravity.
    Type: Grant
    Filed: November 1, 2010
    Date of Patent: January 14, 2014
    Assignee: Thermal Corp.
    Inventors: John H. Rosenfeld, Kenneth G. Minnerly
  • Publication number: 20130213603
    Abstract: A backing plate for joining a heat removal device to a heat source. The backing plate can include a planar plate region having a first face and a second face opposite the first face. The backing plate can also include at least one boss projecting from the first face and having an opening therein for receiving a fastener.
    Type: Application
    Filed: February 21, 2013
    Publication date: August 22, 2013
    Applicant: THERMAL CORP.
    Inventor: Thermal Corp.
  • Publication number: 20130213075
    Abstract: A thermal management system for a electronics cabinets having an electronics heat source therein. The thermal management system includes a first passive thermal device having an evaporator portion and a condenser portion. The thermal management system can also include a heat sink in contact with air inside the cabinet and in thermal contact with the evaporator portion of the first passive thermal device, wherein the heat sink is contained within the sealed cabinet. The condenser portion of the first passive thermal device can be in contact with a liquid to liquid heat exchanger.
    Type: Application
    Filed: February 21, 2013
    Publication date: August 22, 2013
    Applicant: THERMAL CORP.
    Inventor: Thermal Corp.
  • Publication number: 20130092354
    Abstract: A heat pipe system for conducting thermal energy. The heat pipe system includes a sealed tube having along its length a reservoir region, an evaporator region, and a condenser region, the tube having a first end and a second end and an inside wall. The system also includes a wick disposed adjacent the inside wall of the tube, the wick including a first portion at the first end of the tube and a second portion adjacent the first portion, wherein the first portion of the wick is thicker than the second portion of the wick, and wherein the second portion of the wick does not extend to the second end of the tube. The system also includes a working fluid contained within the tube.
    Type: Application
    Filed: October 18, 2012
    Publication date: April 18, 2013
    Applicant: THERMAL CORP.
    Inventor: THERMAL CORP.
  • Patent number: 8397796
    Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: March 19, 2013
    Assignee: Thermal Corp.
    Inventors: John G. Thayer, Kevin L. Wert, Mark T. North, C. Scott Schaeffer
  • Patent number: 8286694
    Abstract: The present invention provides an apparatus including aluminum alloy vessel, the vessel including aluminum in combination with a gettering metal and a method for making such apparatus.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: October 16, 2012
    Assignee: Thermal Corp.
    Inventors: John H. Rosenfeld, G. Yale Eastman
  • Patent number: 8230907
    Abstract: A flexible heat pipe for use with evaporator and condenser elements for removing heat from electronic components. The flexible heat pipe includes a bellows member fixed at one end to a condenser member and at an opposite end to an evaporator member. A cable artery is disposed within the bellows and is fixed at one end to the evaporator, and slidingly engages the condenser at the opposite end. The bellows acts as a flexible vapor envelope, and the cable artery acts as a flexible wick for directing condensed working fluid from the condenser back to the evaporator. The sliding connection between the cable artery and the condenser allows relative axial movement, and the inherent flexibility of the cable artery allows relative lateral movement. Thus, the condenser and evaporator can move in all directions with respect to each other, which can provide desired vibration isolation of the two components.
    Type: Grant
    Filed: January 18, 2010
    Date of Patent: July 31, 2012
    Assignee: Thermal Corp.
    Inventors: John Gilbert Thayer, Clark Scott Schaeffer, Samuel W. Apicelli
  • Patent number: 7947354
    Abstract: The present invention discloses a thermal insulating blanket (10) including an insulating core (41) encased in a fibrous envelope with at least one breather vent (50) in the upper portion of the outer enveloping cover (31) and at least one drain opening (60) in the lower portion of the outer enveloping cover.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: May 24, 2011
    Assignee: Advance Thermal Corp.
    Inventors: Joseph Pirogovsky, Alex Spivak