Patents Assigned to Thermal Corp.
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Patent number: 7407083Abstract: A heat pipe housing assembly (22) includes a pair of silicon housing pieces (24, 26) and a bond joint (42) between the housings (24, 26), with the bond joint (42) preferably including a eutectic layer (43).Type: GrantFiled: August 19, 2004Date of Patent: August 5, 2008Assignee: Thermal Corp.Inventor: C. James Rogers
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Patent number: 7306028Abstract: A modular based heat sink which can be easily optimized for a given heat source relies upon both phase change based heat transfer and condenser modules that combine the efficiency of folded fin cooling and the efficiency of the two phase heat transfer.Type: GrantFiled: June 23, 2005Date of Patent: December 11, 2007Assignee: Thermal Corp.Inventors: Jon Zuo, Ernest H. Dubble, Donald M. Ernst
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Patent number: 7168171Abstract: A drum deheader is adapted for use with a cylindrical drum having a sidewall, a cover at opposite ends of the sidewall and an annular chime joining each cover to the sidewall. A receiver is adapted to be positioned against the sidewall and is engaged with the chime. A slide plate assembly is adapted for vertical sliding movement within the receiver and carries a cutting blade adapted to engage the cover. An elongated handle is pivotally mounted to the receiver for operably moving the cutting blade upwardly and downwardly into and out of cutting engagement with the cover. The invention is improved by a follower and slot arrangement formed in the handle, the receiver and the slide plate for enabling the upward and downward movement of the cutting blade as the operating handle is pivotally moved.Type: GrantFiled: April 11, 2005Date of Patent: January 30, 2007Assignee: Hydro-Thermal Corp.Inventor: Gary Zaiser
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Patent number: 7159649Abstract: An air-to-air heat exchanger, is provided that comprises a folded fin core formed from a continuous sheet of thermally conductive material that has been folded into alternating flat ridges and troughs; an insert overlay having an opening including two sets of uniform fingers, wherein each finger has a portion protruding into and essentially filling each trough on one surface of the folded fin core; an inset region between each finger portion and the end edges of each trough; a sealant within each inset region sealably attaching the insert overlay to the folded fin core; and an air flow divider plate. Heat exchanger components are also provided.Type: GrantFiled: July 16, 2004Date of Patent: January 9, 2007Assignee: Thermal Corp.Inventors: Geoffrey P. Thyrum, Scott D. Garner
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Patent number: 7149087Abstract: A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.Type: GrantFiled: September 7, 2005Date of Patent: December 12, 2006Assignee: Thermal Corp.Inventors: Michael J. Wilson, Jonathan Wattelet, Donald Lightner, Richard DeKeuster, Ernest H. Dubble, Gregg J. Baldassarre
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Patent number: 7143511Abstract: A method for forming a heat pipe is provided comprising coating the interior surface of the vessel with a wicking material and partially saturating the wick with a working fluid. The vessel is then partially evacuated. A portion of the vessel is pinched-off so as to seal the vessel. Then, the pinched-off portion of the vessel is pressed so as to move it from a first position wherein the portion is convex to a second position wherein the portion is concave.Type: GrantFiled: January 27, 2006Date of Patent: December 5, 2006Assignee: Thermal Corp.Inventors: Matthew Connors, Arthur H. Good
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Patent number: 7143818Abstract: An evaporator includes an enclosure having a fluid inlet manifold and a vapor outlet manifold. At least one blind passageway is arranged within the enclosure so as to open into a portion of the vapor outlet manifold. The interior surface of the enclosure that defines each passageway is covered with a capillary wick. A porous valve is arranged in fluid communication between the fluid inlet manifold and a blind end of the at least one blind passageway.Type: GrantFiled: January 23, 2006Date of Patent: December 5, 2006Assignee: Thermal Corp.Inventors: John Gilbert Thayer, Donald M. Ernst
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Patent number: 7137443Abstract: A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles. In this way, a network of capillary passageways are formed between the particles to aid in the transfer of working fluid by capillary action, while the plurality of fillets provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device. A method of making the capillary structure according to the invention is also presented.Type: GrantFiled: February 10, 2005Date of Patent: November 21, 2006Assignee: Thermal Corp.Inventors: John H. Rosenfeld, Kenneth G. Minnerly
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Patent number: 7129731Abstract: A burn-in testing cooling system includes a heat pipe having a tubular body. A capillary wick is disposed on an evaporator portion of the tubular body, and a base seals off the evaporator portion. The base is sized and shaped so as to be releasably thermally engaged with a semiconductor device during burn-in testing. A working fluid is disposed within the heat pipe in sufficient quantity to at least saturate the wick. A hollow tube is coiled around the exterior surface of the heat pipe such that a first set of interior coils are formed adjacent to the exterior surface. These interior coils are brazed to the exterior surface so as to enhance their thermal interface with the heat pipe. A second set of coils are wrapped around the first set of coils, in overlying relation to them.Type: GrantFiled: August 30, 2004Date of Patent: October 31, 2006Assignee: Thermal Corp.Inventors: John Gilbert Thayer, Donald M. Ernst
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Patent number: 7124809Abstract: A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles. In this way, a network of capillary passageways are formed between the particles to aid in the transfer of working fluid by capillary action, while the plurality of fillets, provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device.Type: GrantFiled: April 6, 2005Date of Patent: October 24, 2006Assignee: Thermal Corp.Inventors: John H. Rosenfeld, Kenneth G. Minnerly
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Patent number: 7117930Abstract: A heat sink has a base plate to be clamped against a heat source and one or more heat pipes containing a phase change fluid. Each heat pipe has an elongated tubular evaporator fitted in a channel in the base plate, and a columnar condenser part perpendicular to the base plate forming a structural column for air heat exchange fins. The channel in the base plate is parallel to an edge. An additional channel or ridge is provided, also parallel to the edge, for receiving a clamp or spring clip to urge the base plate against the heat source. The base plate is inexpensively extruded with the parallel channels, ridges, etc., extending across the width of the base plate parallel to the edge. The heat sink has a minimum number of inexpensive parts yet is highly thermally efficient.Type: GrantFiled: November 8, 2004Date of Patent: October 10, 2006Assignee: Thermal Corp.Inventors: John J. Todd, David R. Longsderff, Jerome E. Toth
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Patent number: 7111394Abstract: A heat pipe assembly (100) has a combined reservoir (102) and evaporator (104), the evaporator (104) having ducts of a vapor manifold (106) that exhausts vapor toward the condenser (108) instead of opposing the flow of liquid condensate to the reservoir (102), and the evaporator (104) having a wick passage that impels the condensate toward the reservoir (102) instead of opposing the flow of vapor.Type: GrantFiled: November 12, 2004Date of Patent: September 26, 2006Assignee: Thermal Corp.Inventor: Kevin L. Wert
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Patent number: 7100679Abstract: A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.Type: GrantFiled: December 18, 2003Date of Patent: September 5, 2006Assignee: Thermal Corp.Inventors: Peter M. Dussinger, Thomas L. Myers
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Patent number: 7100680Abstract: The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.Type: GrantFiled: August 9, 2005Date of Patent: September 5, 2006Assignee: Thermal Corp.Inventors: Peter M. Dussinger, Thomas L. Myers
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Patent number: 7096928Abstract: A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.Type: GrantFiled: August 23, 2005Date of Patent: August 29, 2006Assignee: Thermal Corp.Inventors: Alfred L. Phillips, Dmitry K. Khrustalev, Kevin L. Wert, Michael J. Wilson, Jonathan P. Wattelet, John Broadbent
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Patent number: 7090002Abstract: A heat pipe is provided having a vessel with a closed first end, a second end, and a wick on an inner surface that defines a passageway. A convex wall is positioned at the second end so as to block the passageway. The convex wall is deformable so as to move from a first position wherein a portion of the wall is convex to a second position wherein the portion of the wall is concave. The convex wall may include at least one stress concentrator so that upon an application of a force to the convex wall, the stress concentrator causes the convex wall to buckle. A method for forming the above-described heat pipe is also provided.Type: GrantFiled: November 8, 2004Date of Patent: August 15, 2006Assignee: Thermal Corp.Inventors: Matthew Connors, Arthur H. Good
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Patent number: 7080681Abstract: A component of a heat pipe assembly (100) has hollow fluid transport sections (108) communicating with hollow bendable fluid transport sections (110); the bendable fluid transport sections (110) being bendable to deploy the transport sections (108) from a compact volume.Type: GrantFiled: March 3, 2004Date of Patent: July 25, 2006Assignee: Thermal Corp.Inventor: Kevin L. Wert
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Patent number: 7069978Abstract: The present invention provides an apparatus including a magnesium alloy vessel that is substantially free of aluminum and zinc, but including magnesium in combination with a gettering metal. The magnesium alloy vessel has a hollow interior cavity containing a working fluid, with a stable, protective layer formed on the inside wall of the vessel so as to establish non-corrosive compatibility with the working fluid.Type: GrantFiled: August 19, 2003Date of Patent: July 4, 2006Assignee: Thermal Corp.Inventors: John H. Rosenfeld, G. Yale Eastman
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Patent number: 7071408Abstract: A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first-thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g.Type: GrantFiled: September 2, 2005Date of Patent: July 4, 2006Assignee: Thermal Corp.Inventor: Scott D. Garner
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Patent number: 7066240Abstract: The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.Type: GrantFiled: May 9, 2001Date of Patent: June 27, 2006Assignee: Thermal CorpInventors: Peter M. Dussinger, Thomas L. Myers