Abstract: A heat sink includes a base plate which is fitted against a component to be cooled, and a heat pipe formed as a loop having a condenser portion upstanding from the base plate and a pair of ends which form a pair of evaporator portions received in parallel channels in the base plate. A wall upstanding from the base plate between the channels is formed with an upright channel which receives the condenser portion substantially within the profile of the wall, so that a plurality of horizontal cooling fins can be fixed to the wall in thermal contact with the condenser portion.

Abstract: A strap spring for insertion into a circuit board for securing a heat sink to an electronic device is disclosed that has a body portion having two ends and a contact section and one or more engaging sections extending from said ends. The ends are inserted into an aperture in the circuit board and an aperture in the heat sink to anchor the circuit board to the heat sink. Electronic assemblies comprising a circuit board having a microprocessor and a heat sink having a surface larger than the microprocessor are also disclosed in which a strap spring is disposed on a side of the circuit board opposite the heat sink, and the strap extends through the circuit board to engage the heat sink.

Abstract: A strap spring for insertion into a circuit board for securing a heat sink to an electronic device is disclosed that has a body portion having two ends and a contact section and one or more engaging sections extending from said ends. The ends are inserted into an aperture in the circuit board and an aperture in the heat sink to anchor the circuit board to the heat sink. Electronic assemblies comprising a circuit board having a microprocessor and a heat sink having a surface larger than the microprocessor are also disclosed in which a strap spring is disposed on a side of the circuit board opposite the heat sink, and the strap extends through the circuit board to engage the heat sink.

Abstract: Heat sinks and electrical components pre-coated with a layer of a material such as thermal grease are disclosed. Contamination and migration of the thermal grease is substantially reduced by covering the coated areas with a release liner that is removed prior to the assembly of the heat sink into a circuit board or other assembly. By providing a pre-coated heat sink, productivity can be enhanced by increasing accuracy with which the thermal grease is applied, thus eliminating waste and clean up. Methods for pre-coating either a heat sink or the release liner with thermal grease are also disclosed. In preferred embodiments areas of the heat sink can be either fully coated, or portions electively coated, and the coating is most preferably accomplished by pushing grease through an applicator head that has numerous small nozzles.

Abstract: A clip secures a pin fin heat sink to a fan. The clip includes a frame having a width which can be wedged between the fins of the heat sink. Blades extend downwardly from the frame and bear against the heat sink fins to secure the frame to the heat sink. The clip is locked in place by barbs which extend upwardly to engage the fins of the heat sink when the clip is urged in a direction which would free it of the heat sink.

Abstract: A strap spring mounts a heat sink to an electronic device by snapping holes in the leg over ears of a catch on the socket. Two perpendicularly extending springs have an opening between them so that the springs fit between the fins of a heat sink and are latched in ratched indentations.

Abstract: Heat sinks and electrical components pre-coated with a layer of a material such as thermal grease are disclosed. Contamination and migration of the thermal grease is substantially reduced by covering the coated areas with a release liner that is removed prior to the assembly of the heat sink into a circuit board or other assembly. By providing a pre-coated heat sink, productivity can be enhanced, by increasing accuracy with which the thermal grease is applied, thus eliminating waste and clean up. Methods for pre-coating either a heat sink or the release liner with thermal grease are also disclosed. In preferred embodiments areas of the heat sink can be either fully coated, or portions electively coated, and the coating may be accomplished by a silk screening or pad printing process, which includes using an applicator head. The release liner is preferably provided with a pull-off tab to facilitate the removal of the release liner.

Abstract: A heat sink having a support base which supports a base plate is used to mount one or more device packages on a circuit board or the like. The support base is adapted to be secured to the circuit board. The base plate has opposed major faces adapted for mating with device packages. Tongues or clips secure individual device packages on the major faces of the base plate independently to that device packages may be removeably attached to either or both sides of the base plate.

Abstract: A clip assembly and method of attachment for a heat sink having a pin-fin array employing thermally conducting tape to secure the heat sink to a heat dissipating BGA component together with at least one clip assembly which is secured to the underside of the component at its edges.

Abstract: Heat sinks pre-coated with a layer of a material such as thermal grease are disclosed. Contamination and migration of the thermal grease is substantially reduced by covering the coated areas with a protective film that is removed prior to the assembly of the heat sink into a circuit board or other assembly. By providing a pre-coated heat sink, productivity can be enhanced, by increasing accuracy with which the thermal grease is applied, thus eliminating waste and clean up. Methods for pre-coating either a heat sink or the protective film with thermal grease are also disclosed. In preferred embodiments areas of the heat sink can be either fully coated,, or portions electively coated, and the coating is most preferably accomplished by a silk screening or pad printing process. The protective film is preferably provided with a tear off tab to facilitate the removal of the protective film.

Abstract: A strap spring mounts a heat sink to an electronic device by snapping holes in the leg over ears of a catch on the socket. Two perpendicularly extending springs have an opening between them so that the springs fit between the fins of a heat sink and are latched in ratched indentations.

Abstract: A strap spring for insertion into a circuit board for securing a heat sink to an electronic device is disclosed that has a body portion having two ends and a contact section and one or more engaging sections extending from said ends. The ends are inserted into an aperture in the circuit board and an aperture in the heat sink to anchor the circuit board to the heat sink. Electronic assemblies comprising a circuit board having a microprocessor and a heat sink having a surface larger than the microprocessor are also disclosed in which a strap spring is disposed on a side of the circuit board opposite the heat sink, and the strap extends through the circuit board to engage the heat sink.

Abstract: A clip secures a heat sink having a slot with grooves on opposing sides thereof to a transistor. The frame has sides with a width therebetween which can be wedged into grooves on opposing sides of a slot in the heat sink. A portion of the frame is raised up between two parallel cuts in the frame. A transistor is wedged under the raised up portion. The clip has legs which are insertable into a printed circuit board for easy assembly of a heat sink, transistor, clip and printed circuit board.

Abstract: A clip secures a pin fin heat sink to a fan. The clip includes a frame having a width which can be wedged between the fins of the heat sink. Blades extend downwardly from the frame and bear against the heat sink fins to secure the frame to the heat sink. The clip is locked in place by barbs which extend upwardly to engage the fins of the heat sink when the clip is urged in a direction which would free it of the heat sink.

Abstract: An anchor for mounting a heat sink and an electronic device on a printed circuit board has a plastic body. An arcuate groove or protruberance is engaged by a spring. The anchor has a neck which is inserted into a hole in a printed circuit board. A pin in a hole in the body is pushed into the neck to spread it to secure the anchor to the printed circuit board. The assembly is formed by attaching a wire or clip spring to the anchor.

Abstract: A strap spring mounts a heat sink to an electronic device by snapping holes in the leg over ears of a catch on the socket. Two perpendicularly extending springs have an opening between them so that the springs fit between the fins of a heat sink and are latched in ratched indentations.

Abstract: A clip secures a pin fin heat sink to a fan. The clip includes a frame having a width which can be wedged between the fins of the heat sink. Blades extend downwardly from the frame and bear against the heat sink fins to secure the frame to the heat sink. The clip is locked in place by barbs which extend upwardly to engage the fins of the heat sink when the clip is urged in a direction which would free it of the heat sink.

Abstract: A stamped and formed heat sink has a thermally conductive body including a base having a face adapted for attachment to an electronic device package. Stamped and formed heat dissipation elements extend from the edges of the base perpendicular to the base. The heat sink is formed in a progressive punch and die press so that a heat sink is produced on every stroke.

Abstract: Heat sink apparatus for cooling large electronic devices is formed with a heat sink body having a plurality of pins extending outwardly from the base of the heat sink body and a rotary fan having a blowing surface mounted adjacent the outer extremity of the pins. The pins are separated by intersecting grooves providing a large surface area for the heat sink body. The surface area of the heat sink body is sufficiently large to provide a thermal impedance of substantially less than 1.0.degree. C./W and the volume occupied by the heat sink is sufficiently small to provide a volume performance value of less than about 6.degree. C. in.sup.3 /W.

Abstract: Disclosed is a heat sink clip assembly comprising a frame and a clip for securing and aligning a heat sink with an electronic device package. The frame includes a cavity for receiving the electronic device package with the leads thereof exposed for mounting on a printed circuit board or the like. A resilient heat sink clip is removably engaged with a pair of latching members on the perimeter of the frame. The clip includes means for releasably gripping the heat sink. The heat sink is urged by the heat sink clip into intimate thermal contact with the electronic device package for dissipation of heat therefrom.