Abstract: A spring clip having a flat base and a spring portion extending from the base portion intermediate its ends supporting a finger is used to hold an electronic device package in thermal contact with a heat sink by hooking one end of the base into a groove in the heat sink.

Abstract: A mounting clip for securing a heat sink to a device package is secured to the heat sink by forming a groove in the heat sink, positioning the central body portion of the clip in the groove and deforming the wall of the groove to trap the clip in the groove. The clip is an elongated body with ends extending from the axis of its central body. The ends may be trapped or hooked in appropriate receivers on a frame or socket holding an electronic device package to secure the heat sink adjacent the device package.

Abstract: A mounting spring clamp for securing a heat sink to a device package is secured to the heat sink by positioning the central body portion of the spring clamp in an attachment clip. The clip is compressed and positioned in a groove of the heat sink. The clip comprises a semi-circular shaped seat with ears extending from both sides of the seat and is made from a flexible material. Compression of the ears reduces the seat diameter, thereby trapping the spring's central body, and also creates spring force in the ears, thereby trapping the clip between the fins of the heat sink. The mounting spring has an elongated body with ends extending from the axis of its central body. The ends may be trapped or hooked in appropriate receivers on a frame or socket holding an electronic device package to secure the heat sink adjacent the device package.

Abstract: A mounting spring clamp for securing a heat sink to a device package is secured to the heat sink by positioning the central body portion of the spring clamp in an attachment clip. The clip is compressed and positioned in a groove of the heat sink. The clip comprises a semi-circular shaped seat with ears extending from both sides of the seat and is made from a flexible material. Compression of the ears reduces the seat diameter, thereby trapping the spring's central body, and also creates spring force in the ears, thereby trapping the clip between the fins of the heat sink. The mounting spring has an elongated body with ends extending from the axis of its central body. The ends may be trapped or hooked in appropriate receivers on a frame or socket holding an electronic device package to secure the heat sink adjacent the device package.

Abstract: A spring clamp and insulating shoe assembly is used to secure a finned heat sink to an electronic device package. The spring clamp body fits between or around fins or pins extending from one face of a heat sink and carries an insulating shoe which fits around the edge of the device package and has a lip which engages the opposite face of the device package to urge the device package and heat sink into mutual contact.

Abstract: Two or more bodies of sheet-like material are secured together with a single rivet-like fastening device which has an expanded head, a shank extending from the expanded head and a chamfer at the junction of the expanded head and the shank having a radius which is larger adjacent the head and which has bosses extending radially therefrom. An aperture is formed in the first body of material which substantially conforms to the radial dimensions of the shank and the shank is inserted into the aperture. A shaped aperture having radial dimensions which cooperate with the shank to define voids adjacent the shank is formed in the second body of material and the shank inserted into the shaped aperture. The shank is then axially compressed to force the first body over the chamfer and deform part of the first body into the voids in the second body, thus locking the first and second bodies together.

Abstract: A clip having parallel edge frames with pockets at each end and connected by transverse beams is used to removeably secure a heat sink to an orthogonal device package by inserting the corners of the device package in the pockets to secure the heat sink between the transverse beams and the surface of the device package.

Abstract: Disclosed are methods and apparatus for attaching a heat sink mounted semiconductor case to a circuit board employing a stud with a flange near one end. The longer shank is threaded and at least the shorter shank or head stud is tin-plated. The stud may be swaged into a mounting hole in the heat sink and the heat sink and semiconductor case pre-assembled. The pre-assembled unit may then be mounted and soldered to the circuit board along with other circuit components.

Abstract: Disclosed is a unitary heat sink apparatus in the form of a U-shaped body of thermally conductive material adapted for use in connection with semiconductor device packages having a thermally conductive transfer plate adjacent one major face of the device package. Typical of such device packages is the TO-220 plastic power package. One leg of the U-shaped clip urges the thermal transfer plate into intimate contact with a flat portion of the opposite leg by the spring action provided by the base of the U. An aperture in the base of the U allows the leads to extend from the heat sink. Fins are included on one leg of the heat sink and means for attaching the heat sink apparatus to printed circuit boards are also disclosed.