Abstract: The invention provides a docking system for a portable device, comprising a housing assembly disposed partially within an input-output module and operable between a plurality of viewing angles, at least one retaining member for coupling the housing assembly to the input-output module, and a locking sub-system provided on the housing assembly for locking the portable device to the housing assembly.

Abstract: A system for qualifying a process in a facility. The system includes a validation system and a portable computer device. The validation system includes a storage device, a processing device, and one or more sensor input modules each connected to one or more sensors. The portable computer device includes a storage device and a processing device. The storage device of the portable computer device includes a database comprising configuration file for configuring the validation system to perform a qualification of the asset. The processing device of the portable computer device is configured to transmit the configuration file to the validation system for storage in the storage device thereof. The processing device of the validation system is configured to load the configuration file stored in the storage device thereof and to perform the qualification of the asset based on the loaded configuration file.

Abstract: Semiconductor sensor chips are provided. In some embodiments, a semiconductor sensor chip can include at least one wire bond pad on one side thereof, at least one bond pad on another, opposite side thereof, and at least one through-silicon via (TSV) extending therebetween and electrically connected to the bond pads on opposite sides of the chip. Each of the bond pads can have a wire attached thereto. In some embodiments, a semiconductor sensor chip can include a pressure sensor, a substrate, and a resistor in a well that provides p-n junction isolation from a body of the substrate. In some embodiments, a semiconductor sensor chip can include a plurality of wire bonds pads with a wire soldered to each of the bond pads. Each of the wires can be soldered with a longitudinal length thereof soldered to its associated bond pad.

Abstract: Systems and method for flow sensing are provided. One system includes a flow conduit configured to allow fluid flow therethrough, a flow disturber disposed in the flow conduit and configured to impart a flow disturbance to the fluid flow and an actuator operably connected to the flow disturber to control the flow disturber to impart the flow disturbance to the fluid flow. The system further includes a plurality of sensors disposed in the flow conduit that are configured to have a geometrical and functional relationship with the flow conduit and the flow disturber, wherein the plurality of sensors are responsive to flow characteristics in the flow conduit. The system also includes a processor operably coupled to the plurality of sensors and configured to determine a flow rate of the fluid flow in the flow conduit using timing characteristics to select a processing method.

Abstract: Systems and methods for flow sensing in a conduit are provided. One system includes a flow disturber disposed in a flow conduit and configured to impart a flow disturbance to the fluid flow. The system further includes a plurality of flow sensors disposed in the flow conduit and responsive to flow characteristics in the flow conduit. The system also includes a frequency resolver configured to determine frequency information related to the fluid flow based on the flow characteristics. The frequency resolver uses one or more time sample windows to select data samples for use in determining the frequency information, wherein a length of one or more of the time sample windows is based at least in part on the flow characteristics. The system additionally includes a processor configured to determine a flow rate of the fluid flow in the flow conduit using the frequency information.

Abstract: Ceramic heating devices with a three-dimensional ceramic element are disclosed for protecting surfaces from icing. The shape of the three-dimensional ceramic element can be configured to physically match to the three-dimensional profile of the protected surface, allowing for high thermal coupling with the surface. The shape of the three-dimensional ceramic element can also be configured to form an aerodynamic surface typically found on the exterior of aircraft.

Abstract: A battery cell that comprises a sensing platform with sensing elements configured to provide information about in-situ characteristics and parameters of the battery cell. Embodiments of the battery cell can have the sensing platform integrated into the structure of the battery cell, as a separate structure incorporated in the battery cell, and combinations thereof. In one embodiment, the battery cell comprises a sensing platform having sensing elements proximate a localized measurement region, where the sensing platform comprises a substrate with material layers disposed thereon. The material layers comprise at least one sensing layer that forms the sensing elements so that the sensing elements are responsive to properties of the battery cell.

Abstract: A device for measuring forces and a method of making the same. The device has a boss structure within a diaphragm cavity, wherein the boss structure has substantially parallel sidewalls. One or more sensors are installed proximate to the diaphragm to sense flexure in the diaphragm, which is controlled by the boss structure.

Abstract: The present application provides a non-dispersive infrared gas sensor. The non-dispersive infrared gas sensor may include an infrared source, an infrared detector, and a waveguide extending about the infrared source and the infrared detector. The waveguide may include a reflective diffuser thereon.

Abstract: A flow sensor assembly is provided and includes a flow conduit configured to impart a disturbance to a flow, multiple sensors disposed at respective sensing locations along the flow conduit. Each sensor is responsive to the disturbance of the flow and generates a corresponding response signal. The flow sensor assembly further includes a processor operably connected to each sensor, the processor being configured to compute a cross-correlation function between the response signals generated by said sensors, and determine a flow rate and a direction for the flow through the conduit based on the computed cross-correlation function. Additional flow sensor assembly arrangements are also disclosed.

Abstract: A flexible cable with a substrate divided into at least two sections is disclosed. The first section includes a first electrically conductive track and a first attach pad, while the section includes a second and third electrically conductive tracks, as well as a second attach pad. The first section is disposed on the second section to align the attach pads and connect the first electrically conductive track to the third electrically conductive track. The resulting flexible cable can be used with a low profile electrical device.

Abstract: A catheter die is provided and includes an elongate body having first and second opposing end portions and an end face at the first one of the first and second opposing end portions. The elongate body defines a cavity within the first end portion with an interior facing surface of the cavity disposed to extend alongside at least a portion of the first end face. At least one or more piezoresistive pressure sensors are operably disposed proximate to the cavity.

Abstract: A catheter die is provided and includes a device layer defining a cavity and including a piezoresistive pressure sensor operably disposed proximate to the cavity and an insulator having an opening and being disposed on an upper surface of the device layer such that a portion of the piezoresistive pressure sensor is exposed through the opening. The catheter die further includes an insulation layer bonded to a lower surface of the device layer and first and second bond pads, the first bond pad being electrically coupled to the portion of the piezoresistive pressure sensor via the opening and the second bond pad being disposed on the insulation layer.

Abstract: A method of attaching a die to a carrier using a temporary attach material is disclosed. The method comprises attaching the temporary attach material between a surface of the die and a surface of the carrier. The temporary attach material attaches the die to the carrier. The method comprises bonding at least one connector to the die and the carrier. The connector includes a first end bonded to the carrier and a second end bonded to the die. The method further comprises encapsulating at least a portion of the die and at least a portion of the at least one connector by an encapsulation material.

Abstract: A gas sensor is disclosed. The gas sensor includes a gas sensing layer, at least one electrode, an adhesion layer, and a response modification layer adjacent to said gas sensing layer and said layer of adhesion. A system having an exhaust system and a gas sensor is also disclosed. A method of fabricating the gas sensor is also disclosed.

Abstract: An antenna and method of making the same is disclosed wherein the antenna includes a seal assembly comprising a seal plate to prevent material used to form a seal around the conductor element from entering into the air gap of the antenna body.