Abstract: A method for removing heat from a heat generating component using a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
Type:
Grant
Filed:
January 20, 2006
Date of Patent:
September 28, 2010
Assignee:
Thermotek, Inc.
Inventors:
Overton L. Parish, IV, Roger S. DeVilbiss
Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
Type:
Grant
Filed:
December 28, 2007
Date of Patent:
March 30, 2010
Assignee:
ThermoTek, Inc.
Inventors:
Overton L. Parish, IV, Roger S. DeVilbiss
Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
Type:
Grant
Filed:
December 23, 2002
Date of Patent:
January 29, 2008
Assignee:
ThermoTek, Inc.
Inventors:
Overton L. Parish, IV, Roger S. DeVilbiss
Abstract: A stackable heat transfer system incorporating a plurality of flow controlled endcaps facilitating select flow of heat transfer fluid through low profile extrusions. The low profile extrusions are mounted in a sandwiched configuration with thermal electric cooling arrays for providing heat dissipation from the cooler arrays and the heat transfer from a low profile extrusion sandwiched the cooler arrays.
Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.
Type:
Grant
Filed:
January 15, 2003
Date of Patent:
April 3, 2007
Assignee:
Thermotek, Inc.
Inventors:
Overton L. Parish, IV, Tony Quisenberry
Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.
Type:
Grant
Filed:
August 26, 2004
Date of Patent:
December 19, 2006
Assignee:
Thermotek, Inc.
Inventors:
Overton L. Parish, IV, Tony Quisenberry
Abstract: A toroidally shaped LPE with a plurality of microtubes extending through the LPE is disclosed. The LPEs are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the microtubes of the LPEs and removes the heat from the heat producing components. This Abstract is provided to comply with rules requiring an Abstract that allows a searcher or other reader to quickly ascertain subject matter of the technical disclosure. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.
Type:
Grant
Filed:
April 19, 2004
Date of Patent:
December 12, 2006
Assignee:
Thermotek, Inc.
Inventors:
Tony Quisenberry, Darren C. Hester, Overton L. Parish
Abstract: A thermal control system of a 3U height includes various modules for providing temperature control in a rack environment. The modules may be, for example, a power module, user interface module, various different pump assemblies, various different models of fan assemblies, HTAs, and/or a serial communication interfaces. This Abstract is provided to comply with rules requiring an Abstract that allows a searcher or other reader to quickly ascertain subject matter of the technical disclosure. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.72(b).
Type:
Application
Filed:
August 12, 2005
Publication date:
February 16, 2006
Applicant:
Thermotek, Inc.
Inventors:
Overton Parish, Niran Balachandran, Tony Quisenberry, William Leggett
Abstract: A method for removing heat from a heat generating component using a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
Type:
Grant
Filed:
December 23, 2002
Date of Patent:
January 24, 2006
Assignee:
Thermotek, Inc.
Inventors:
Overton L. Parish, IV, Roger S. DeVilbiss
Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. In the caps interconnect the ends of the micro tubes in fluid communications and to inlet and outlet tubes. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid is circulated through the micro tubes of the low profile extrusion, and a heat exchanger removes the heat from the heat transfer fluid.
Type:
Grant
Filed:
December 31, 2002
Date of Patent:
January 3, 2006
Assignee:
Thermotek, Inc.
Inventors:
Overton L. Parish, IV, Roger S. DeVilbiss
Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. In the caps interconnect the ends of the micro tubes in fluid communications and to inlet and outlet tubes. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid is circulated through the micro tubes of the low profile extrusion, and a heat exchanger removes the heat from the heat transfer fluid.
Type:
Grant
Filed:
June 8, 1999
Date of Patent:
August 30, 2005
Assignee:
Thermotek, Inc.
Inventors:
Overton L. Parish IV, Roger S. DeVilbiss
Abstract: A sequential compression and temperature therapy blanket with a plurality of air chambers is disclosed. The air chambers are filled and released by a valve assembly that may be separate from or integrated within the blanket. The temperature therapy blanket includes a fluid bladder for delivering hot and/or cold therapy to a patient. The temperature therapy blanket may also include an air bladder for providing compression. This Abstract is provided to comply with rules requiring an Abstract that allows a searcher or other reader to quickly ascertain subject matter of the technical disclosure. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
Type:
Application
Filed:
July 19, 2004
Publication date:
June 30, 2005
Applicant:
Thermotek, Inc.
Inventors:
Overton Parish, Niran Balachandran, Tony Quisenberry
Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.
Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.
Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. In the caps interconnect the ends of the micro tubes in fluid communications and to inlet and outlet tubes. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid is circulated through the micro tubes of the low profile extrusion, and a heat exchanger removes the heat from the heat transfer fluid.
Abstract: A method for removing heat from a heat generating component using a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
Abstract: A cooling apparatus using “low profile extrusions” is disclosed. The cooling apparatus of the present invention may be incorporated into a closed loop liquid cooling system which is particularly well suited to heat removal from electronic components in applications where space is limited. A cooling system in accordance with the present invention is illustrated for use in a typical wireless telecommunication base station for removing heat from power amplifiers and other electronic components. Cooling is carried out by drawing heat away from the electronic components and into at least one low profile extrusion attached directly to the heat generating components or a heat sink, and transferring the removed heat to a cooling fluid circulating through a plurality of micro tubes or channels within each low profile extrusion.
Type:
Grant
Filed:
August 7, 2000
Date of Patent:
October 8, 2002
Assignee:
Thermotek, Inc.
Inventors:
Overton L. Parish, IV, Roger S. DeVilbiss
Abstract: An air conditioning apparatus and method for cooling enclosures containing electronic equipment. More particularly, one aspect of the present invention comprises a low cost passive heat removal system that utilizes a plurality of flat tubing or low profile extrusions. The flat tubing or low profile extrusions are arranged in parallel to create an air-to-air passive heat exchanger which may be incorporated into an air conditioning apparatus constructed in accordance with the present invention. The flat tubes or low profile extrusions offer a greater surface area and more efficient cooling than conventional folded fin designs having the same overall dimensions or volume. Moreover, the flat tubes or low profile extrusions may be manufactured with dimples, fins, or other surface enhancements with little additional labor or manufacturing steps. The air-to-air passive heat exchanger may be arranged in various configurations including cross flow, counterflow or concurrent flow.
Type:
Application
Filed:
September 6, 2001
Publication date:
September 26, 2002
Applicant:
Thermotek, Inc.
Inventors:
Roger S. DeVilbiss, Kathryn Ostrom, Overton L. Parish, Tony Quisenberry
Abstract: A system for conditioning the air within an enclosure which houses heat producing equipment. The system includes a passive heat removal system, for precooling the air, and a thermoelectric temperature control system used in conjunction with the passive heat removal system to achieve the necessary temperature control. A power control system includes a programmable control means which receives signals, from a temperature sensor, which are indicative of the temperature of the air in the enclosure. Based upon these signals, the power control system controls the activation of thermoelectric devices in the thermoelectric temperature control system and controls the activation of fans to remove a desired amount of heat from the air in the enclosure and discharge the unwanted heat to the outside air. A switching device operates to apply battery power to the power control system if the electrical power source for the thermoelectric temperature control system fails.
Type:
Grant
Filed:
July 12, 1996
Date of Patent:
May 9, 2000
Assignee:
Thermotek, Inc.
Inventors:
Sathya Rajasubramanian, Roger S. DeVilbiss, Thomas C. Dedmon, Tony M. Quisenberry