Patents Assigned to Thermotek, Inc.
  • Patent number: 7802436
    Abstract: A method for removing heat from a heat generating component using a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
    Type: Grant
    Filed: January 20, 2006
    Date of Patent: September 28, 2010
    Assignee: Thermotek, Inc.
    Inventors: Overton L. Parish, IV, Roger S. DeVilbiss
  • Patent number: 7686069
    Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: March 30, 2010
    Assignee: ThermoTek, Inc.
    Inventors: Overton L. Parish, IV, Roger S. DeVilbiss
  • Patent number: 7322400
    Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: January 29, 2008
    Assignee: ThermoTek, Inc.
    Inventors: Overton L. Parish, IV, Roger S. DeVilbiss
  • Patent number: 7305843
    Abstract: A stackable heat transfer system incorporating a plurality of flow controlled endcaps facilitating select flow of heat transfer fluid through low profile extrusions. The low profile extrusions are mounted in a sandwiched configuration with thermal electric cooling arrays for providing heat dissipation from the cooler arrays and the heat transfer from a low profile extrusion sandwiched the cooler arrays.
    Type: Grant
    Filed: November 26, 2004
    Date of Patent: December 11, 2007
    Assignee: Thermotek, Inc.
    Inventors: Tony Quisenberry, Clark R. Havis
  • Patent number: 7198096
    Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: April 3, 2007
    Assignee: Thermotek, Inc.
    Inventors: Overton L. Parish, IV, Tony Quisenberry
  • Patent number: 7150312
    Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: December 19, 2006
    Assignee: Thermotek, Inc.
    Inventors: Overton L. Parish, IV, Tony Quisenberry
  • Patent number: 7147045
    Abstract: A toroidally shaped LPE with a plurality of microtubes extending through the LPE is disclosed. The LPEs are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the microtubes of the LPEs and removes the heat from the heat producing components. This Abstract is provided to comply with rules requiring an Abstract that allows a searcher or other reader to quickly ascertain subject matter of the technical disclosure. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.
    Type: Grant
    Filed: April 19, 2004
    Date of Patent: December 12, 2006
    Assignee: Thermotek, Inc.
    Inventors: Tony Quisenberry, Darren C. Hester, Overton L. Parish
  • Publication number: 20060034053
    Abstract: A thermal control system of a 3U height includes various modules for providing temperature control in a rack environment. The modules may be, for example, a power module, user interface module, various different pump assemblies, various different models of fan assemblies, HTAs, and/or a serial communication interfaces. This Abstract is provided to comply with rules requiring an Abstract that allows a searcher or other reader to quickly ascertain subject matter of the technical disclosure. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.72(b).
    Type: Application
    Filed: August 12, 2005
    Publication date: February 16, 2006
    Applicant: Thermotek, Inc.
    Inventors: Overton Parish, Niran Balachandran, Tony Quisenberry, William Leggett
  • Patent number: 6988315
    Abstract: A method for removing heat from a heat generating component using a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: January 24, 2006
    Assignee: Thermotek, Inc.
    Inventors: Overton L. Parish, IV, Roger S. DeVilbiss
  • Patent number: 6981322
    Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. In the caps interconnect the ends of the micro tubes in fluid communications and to inlet and outlet tubes. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid is circulated through the micro tubes of the low profile extrusion, and a heat exchanger removes the heat from the heat transfer fluid.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: January 3, 2006
    Assignee: Thermotek, Inc.
    Inventors: Overton L. Parish, IV, Roger S. DeVilbiss
  • Patent number: 6935409
    Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. In the caps interconnect the ends of the micro tubes in fluid communications and to inlet and outlet tubes. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid is circulated through the micro tubes of the low profile extrusion, and a heat exchanger removes the heat from the heat transfer fluid.
    Type: Grant
    Filed: June 8, 1999
    Date of Patent: August 30, 2005
    Assignee: Thermotek, Inc.
    Inventors: Overton L. Parish IV, Roger S. DeVilbiss
  • Publication number: 20050143797
    Abstract: A sequential compression and temperature therapy blanket with a plurality of air chambers is disclosed. The air chambers are filled and released by a valve assembly that may be separate from or integrated within the blanket. The temperature therapy blanket includes a fluid bladder for delivering hot and/or cold therapy to a patient. The temperature therapy blanket may also include an air bladder for providing compression. This Abstract is provided to comply with rules requiring an Abstract that allows a searcher or other reader to quickly ascertain subject matter of the technical disclosure. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
    Type: Application
    Filed: July 19, 2004
    Publication date: June 30, 2005
    Applicant: Thermotek, Inc.
    Inventors: Overton Parish, Niran Balachandran, Tony Quisenberry
  • Patent number: 6834712
    Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: December 28, 2004
    Assignee: Thermotek, Inc.
    Inventors: Overton L. Parish, Roger S. DeVilbiss
  • Publication number: 20040099407
    Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.
    Type: Application
    Filed: January 15, 2003
    Publication date: May 27, 2004
    Applicant: THERMOTEK, INC.
    Inventors: Overton L. Parish, Tony Quisenberry
  • Publication number: 20030127215
    Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. In the caps interconnect the ends of the micro tubes in fluid communications and to inlet and outlet tubes. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid is circulated through the micro tubes of the low profile extrusion, and a heat exchanger removes the heat from the heat transfer fluid.
    Type: Application
    Filed: December 31, 2002
    Publication date: July 10, 2003
    Applicant: THERMOTEK, INC.
    Inventors: Overton L. Parish, Roger S. DeVilbiss
  • Publication number: 20030089487
    Abstract: A method for removing heat from a heat generating component using a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
    Type: Application
    Filed: December 23, 2002
    Publication date: May 15, 2003
    Applicant: ThermoTek, Inc.
    Inventors: Overton L. Parish, Roger S. DeVilbiss
  • Publication number: 20030089486
    Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
    Type: Application
    Filed: December 23, 2002
    Publication date: May 15, 2003
    Applicant: Thermotek, Inc.
    Inventors: Overton L. Parish, Roger S. DeVilbiss
  • Patent number: 6462949
    Abstract: A cooling apparatus using “low profile extrusions” is disclosed. The cooling apparatus of the present invention may be incorporated into a closed loop liquid cooling system which is particularly well suited to heat removal from electronic components in applications where space is limited. A cooling system in accordance with the present invention is illustrated for use in a typical wireless telecommunication base station for removing heat from power amplifiers and other electronic components. Cooling is carried out by drawing heat away from the electronic components and into at least one low profile extrusion attached directly to the heat generating components or a heat sink, and transferring the removed heat to a cooling fluid circulating through a plurality of micro tubes or channels within each low profile extrusion.
    Type: Grant
    Filed: August 7, 2000
    Date of Patent: October 8, 2002
    Assignee: Thermotek, Inc.
    Inventors: Overton L. Parish, IV, Roger S. DeVilbiss
  • Publication number: 20020134544
    Abstract: An air conditioning apparatus and method for cooling enclosures containing electronic equipment. More particularly, one aspect of the present invention comprises a low cost passive heat removal system that utilizes a plurality of flat tubing or low profile extrusions. The flat tubing or low profile extrusions are arranged in parallel to create an air-to-air passive heat exchanger which may be incorporated into an air conditioning apparatus constructed in accordance with the present invention. The flat tubes or low profile extrusions offer a greater surface area and more efficient cooling than conventional folded fin designs having the same overall dimensions or volume. Moreover, the flat tubes or low profile extrusions may be manufactured with dimples, fins, or other surface enhancements with little additional labor or manufacturing steps. The air-to-air passive heat exchanger may be arranged in various configurations including cross flow, counterflow or concurrent flow.
    Type: Application
    Filed: September 6, 2001
    Publication date: September 26, 2002
    Applicant: Thermotek, Inc.
    Inventors: Roger S. DeVilbiss, Kathryn Ostrom, Overton L. Parish, Tony Quisenberry
  • Patent number: 6058712
    Abstract: A system for conditioning the air within an enclosure which houses heat producing equipment. The system includes a passive heat removal system, for precooling the air, and a thermoelectric temperature control system used in conjunction with the passive heat removal system to achieve the necessary temperature control. A power control system includes a programmable control means which receives signals, from a temperature sensor, which are indicative of the temperature of the air in the enclosure. Based upon these signals, the power control system controls the activation of thermoelectric devices in the thermoelectric temperature control system and controls the activation of fans to remove a desired amount of heat from the air in the enclosure and discharge the unwanted heat to the outside air. A switching device operates to apply battery power to the power control system if the electrical power source for the thermoelectric temperature control system fails.
    Type: Grant
    Filed: July 12, 1996
    Date of Patent: May 9, 2000
    Assignee: Thermotek, Inc.
    Inventors: Sathya Rajasubramanian, Roger S. DeVilbiss, Thomas C. Dedmon, Tony M. Quisenberry