Patents Assigned to Thin Film Electronics ASA
  • Publication number: 20200273719
    Abstract: A method of attaching one or more active devices on one or more substrates to a metal carrier by “hot stamping” is disclosed. The method includes contacting the active device(s) on the substrate(s) with the metal carrier, and applying pressure to and heating the active device(s) on the substrate(s) and the metal carrier sufficiently to affix or attach the active device(s) on the substrate(s) to the metal carrier. The active device(s) may include an integrated circuit. The substrate(s) may include a metal substrate on the backside of the active device and a protective/carrier film on the frontside of the active device. The protective/carrier film may be or include an organic polymer. The metal carrier may be or include a metal foil. Various examples of the method further include thinning the metal substrate, dicing the active device(s) and a continuous substrate, and/or separating the active devices.
    Type: Application
    Filed: February 26, 2020
    Publication date: August 27, 2020
    Applicant: Thin Film Electronics ASA
    Inventors: Miki TRIFUNOVIC, Aditi CHANDRA, Anand DESHPANDE, Arvind KAMATH
  • Publication number: 20200266534
    Abstract: Embodiments of the disclosure pertain to a wireless communication device and a method of reading a wireless communication device in which the magnitude of electromagnetically-induced currents in a metal-containing substrate is reduced. The metal-containing substrate has one or more openings therethrough. The device includes an antenna configured to (i) receive one or more first wireless signals from a reader and (ii) transmit or broadcast one or more second wireless signals and an integrated circuit coupled to the antenna. The antenna overlaps with at least one of the one or more openings.
    Type: Application
    Filed: February 13, 2020
    Publication date: August 20, 2020
    Applicant: Thin Film Electronics ASA
    Inventors: Somnath MUKHERJEE, Olle Jonny HAGEL
  • Patent number: 10667397
    Abstract: An electronic device, and methods of manufacturing the same are disclosed. The method of manufacturing the electronic device includes forming a first metal layer on a first substrate, forming an integrated circuit or a discrete electrical component on a second substrate, forming electrical connectors on input and/or output terminals of the integrated circuit or discrete electrical component, forming a second metal layer on the first metal layer, the second metal layer improving adhesion and/or electrical connectivity of the first metal layer to the electrical connectors on the integrated circuit or discrete electrical component, and electrically connecting the electrical connectors to the second metal layer.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: May 26, 2020
    Assignee: Thin Film Electronics ASA
    Inventor: Mao Ito
  • Publication number: 20200127021
    Abstract: The present disclosure pertains to a barrier stack for thin film and/or printed electronics on substrates having a diffusible element and/or species, methods of manufacturing the same, and methods of inhibiting or preventing diffusion of a diffusible element or species in a substrate using the same. The barrier stack includes a first barrier layer on the substrate, an insulator layer on the first barrier layer, a second barrier layer on the insulator layer in a first region of the substrate, and a third barrier layer on the insulator layer in a second region of the substrate and on the second barrier layer in the first region. Each of the second and third barrier layers has a thickness less than that of the first barrier layer.
    Type: Application
    Filed: October 22, 2019
    Publication date: April 23, 2020
    Applicant: Thin Film Electronics ASA
    Inventors: Raghav SREENIVASAN, Aditi CHANDRA, Yoocharn JEON
  • Patent number: 10579919
    Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more protection lines. The antenna receives and/or transmits or broadcasts a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The integrated circuit has a first set of terminals electrically connected to the antenna. The protection line(s) are on a common or different substrate as the antenna. The protection line(s) sense or determine a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered, and are electrically connected to a second set of terminals of the integrated circuit different from the first set of terminals.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: March 3, 2020
    Assignee: Thin Film Electronics ASA
    Inventor: Matthew A. Bright
  • Publication number: 20200059106
    Abstract: A battery management system having and configurable batteries are disclosed. The battery management system generally includes (a) one or more cell control units, each configured to control and/or balance a charge in a plurality of battery cells, and (b) a master controller in electrical communication with cell control unit(s). The cell control unit(s) as a whole include one or more switches, configured to be electrically connected to a first one of a plurality of battery cells, and a resistor, capacitor or inductor electrically (i) connected to one switch and (ii) connected or connectable to a second battery cell. The master controller is configured to open or close each switch. The configurable battery generally includes a plurality of battery cells and switches configured to connect or disconnect the battery cells in a configurable or predetermined manner.
    Type: Application
    Filed: August 16, 2019
    Publication date: February 20, 2020
    Applicant: Thin Film Electronics ASA
    Inventors: Christer KARLSSON, Per BRÖMS
  • Patent number: 10450419
    Abstract: There is provided a highly conductive and good silicon thin film which is obtained by applying a coating-type polysilane composition prepared by use of a polysilane having a large weight average molecular weight to a substrate, followed by baking. A polysilane having a weight average molecular weight of 5,000 to 8,000. The polysilane may be a polymer of cyclopentasilane. A silicon film obtained by applying a polysilane composition in which the polysilane is dissolved in a solvent to a substrate, and baking the substrate at 100° C. to 425° C. The cyclopentasilane may be polymerized in the presence of a palladium catalyst supported on a polymer. The palladium catalyst supported on a polymer may be a catalyst in which palladium as a catalyst component is immobilized on a functional polystyrene. The palladium may be a palladium compound or a palladium complex.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: October 22, 2019
    Assignee: Thin Film Electronics ASA
    Inventors: Masahisa Endo, Gun Son, Yuichi Goto, Kentaro Nagai
  • Patent number: 10453853
    Abstract: A ferroelectric memory cell (1) and a memory device (100) comprising one or more such cells (1). The ferroelectric memory cell comprises a stack (4) of layers arranged on a flexible substrate (3). Said stack comprises an electrically active part (4a) and a protective layer (11) for protecting the electrically active part against scratches and abrasion. Said electrically active part comprises a bottom electrode layer (5) and a top electrode layer (9) and at least one ferroelectric memory material layer (7) between said electrodes. The stack further comprises a buffer layer (13) arranged between the top electrode layer (9) and the protective layer (11). The buffer layer (13) is adapted for at least partially absorbing a lateral dimensional change (?L) occurring in the protective layer (11) and thus preventing said dimensional change (?L) from being transferred to the electrically active part (4a), thereby reducing the risk of short circuit to occur between the electrodes.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: October 22, 2019
    Assignee: THIN FILM ELECTRONICS ASA
    Inventors: Christer Karlsson, Olle Jonny Hagel, Jakob Nilsson, Per Bröms
  • Publication number: 20190311239
    Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more protection lines. The antenna receives and/or transmits or broadcasts a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The integrated circuit has a first set of terminals electrically connected to the antenna. The protection line(s) are on a common or different substrate as the antenna. The protection line(s) sense or determine a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered, and are electrically connected to a second set of terminals of the integrated circuit different from the first set of terminals.
    Type: Application
    Filed: June 24, 2019
    Publication date: October 10, 2019
    Applicant: Thin Film Electronics ASA
    Inventor: Matthew A. BRIGHT
  • Patent number: 10414661
    Abstract: A method of producing a silicon hydride oxide-containing organic solvent (coating solution) is provided with which a silicon hydride oxide coating film can be formed on a substrate. Using the silicon hydride oxide-containing organic solvent makes it unnecessary to place a coating solution in non-oxidizing atmosphere at the time of coating or to heat the substrate after coating because the silicon hydride oxide is formed in the coating solution before it is coated. The method includes blowing an oxygen-containing gas through an organic solvent containing a silicon hydride or a polymer thereof. The silicon hydride oxide may contain a proportion of (residual Si-H groups)/(Si-H groups before oxidation) of 1 to 40 mol %. The silicon hydride can be obtained by reacting a cyclic silane with a hydrogen halide in the presence of an aluminum halide, and reducing the obtained cyclic halosilane.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: September 17, 2019
    Assignee: Thin Film Electronics ASA
    Inventors: Yuichi Goto, Masahisa Endo, Gun Son, Kentaro Negai
  • Publication number: 20190267698
    Abstract: A wireless communication device having an integrated antenna, and methods for making and using the same are disclosed. The device generally includes (a) a substrate; (b) an integrated circuit (IC) comprising a plurality of printed and/or thin film layers and/or structures on the substrate, (c) a dielectric or insulator layer in at least one area of the substrate other than the IC; and (d) an antenna on the dielectric or insulator layer, comprising one or more metal traces. The plurality of printed and/or thin film layers and/or structures include an uppermost layer of metal.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 29, 2019
    Applicant: Thin Film Electronics ASA
    Inventors: Somnath MUKHERJEE, Aditi CHANDRA, Mao ITO, Arvind KAMATH, Scott BRUNER, Sambhu KUNDU, Anand DESHPANDE
  • Patent number: 10371737
    Abstract: An electronic device including a continuity sensor and electrical circuitry configured to detect and report the continuity state of an article, container or product packaging is disclosed. The continuity sensor includes a first substrate with first and second coils thereon, and a second substrate with a third coil thereon. The first coil has an integrated circuit electrically connected thereto. The first substrate is part of, or is attached or secured to a part of the article, container or packaging. The second substrate is another part of, or is attached or secured to another part of the article, container or packaging. One of the article, container or packaging parts is (re)movable with respect to the other part. The first and second coils have one coupling when the article, container or packaging is closed or sealed, and a different coupling when the article, container or packaging is open or unsealed.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: August 6, 2019
    Assignee: Thin Film Electronics ASA
    Inventor: Somnath Mukherjee
  • Patent number: 10360493
    Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more protection lines. The antenna receives and/or transmits or broadcasts a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The integrated circuit has a first set of terminals electrically connected to the antenna. The protection line(s) are on a common or different substrate as the antenna. The protection line(s) sense or determine a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered, and are electrically connected to a second set of terminals of the integrated circuit different from the first set of terminals.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: July 23, 2019
    Assignee: THIN FILM ELECTRONICS ASA
    Inventor: Matthew A. Bright
  • Patent number: 10332686
    Abstract: High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: June 25, 2019
    Assignee: Thin Film Electronics ASA
    Inventors: Arvind Kamath, Criswell Choi, Patrick Smith, Erik Scher, Jiang Li
  • Publication number: 20190132658
    Abstract: An electronic device including a continuity sensor and electrical circuitry configured to detect and report the continuity state of an article, container or product packaging is disclosed. The continuity sensor includes a first substrate with first and second coils thereon, and a second substrate with a third coil thereon. The first coil has an integrated circuit electrically connected thereto. The first substrate is part of, or is attached or secured to a part of the article, container or packaging. The second substrate is another part of, or is attached or secured to another part of the article, container or packaging. One of the article, container or packaging parts is (re)movable with respect to the other part. The first and second coils have one coupling when the article, container or packaging is closed or sealed, and a different coupling when the article, container or packaging is open or unsealed.
    Type: Application
    Filed: June 19, 2017
    Publication date: May 2, 2019
    Applicant: Thin Film Electronics ASA
    Inventors: Somnath MUKHERJEE, James GODFREY
  • Publication number: 20190059160
    Abstract: A method of and system for manufacturing an electronic device, a curable conductive adhesive for use in the same, and an electronic device are disclosed. The method includes printing a conductive adhesive onto pads at ends of traces on a substrate, placing one or more components having a non-standard size and/or shape onto the pads with the conductive adhesive thereon, and after the component(s) have been placed onto the pads, curing the conductive adhesive at a predetermined temperature or with light having a predetermined wavelength (band). The system comprises a printer configured to print a conductive adhesive onto pads at ends of traces on a substrate, a surface mounting machine configured to place one or more components having a non-standard size and/or shape onto the pads with the conductive adhesive thereon, and a curing station configured to cure the conductive adhesive after the component(s) have been placed onto the pads.
    Type: Application
    Filed: February 27, 2017
    Publication date: February 21, 2019
    Applicant: Thin Film Electronics ASA
    Inventor: Olle HAGEL
  • Publication number: 20190050707
    Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more protection lines. The antenna receives and/or transmits or broadcasts a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The integrated circuit has a first set of terminals electrically connected to the antenna. The protection line(s) are on a common or different substrate as the antenna. The protection line(s) sense or determine a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered, and are electrically connected to a second set of terminals of the integrated circuit different from the first set of terminals.
    Type: Application
    Filed: October 8, 2018
    Publication date: February 14, 2019
    Applicant: Thin Film Electronics ASA
    Inventor: Matthew A. BRIGHT
  • Patent number: 10202283
    Abstract: A cyclic silane having high purity, a composition containing a polysilane obtained by polymerization of the cyclic silane, and a silicon thin film are disclosed. A method for producing a cyclic silane of the formula (SiH2)n, where n is an integer of 4 to 6, includes reacting a cyclic silane compound of the formula (SiR1R2)n (where R1 and R2 are each a hydrogen atom, a C1-6 alkyl group, or a substituted or unsubstituted phenyl group) with a hydrogen halide in the presence of an aluminum halide to obtain a cyclic silane of the formula (SiR3R4)n (where R3 and R4 are each a halogen atom), and then distilling the solution, and reducing the cyclic silane of the formula (SiR3R4)n with hydrogen or lithium aluminum hydride. The distillation may be carried out at a temperature of 40° C. to 80° C. under a reduced pressure of 0 to 30 Torr.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: February 12, 2019
    Assignee: Thin Film Electronics ASA
    Inventors: Yuichi Goto, Kentaro Nagai, Masahisa Endo, Gun Son
  • Publication number: 20190019074
    Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing the same are disclosed. The method of manufacturing the wireless communication device includes forming an integrated circuit on a first substrate, printing stud bumps on input and/or output terminals of the integrated circuit, forming an antenna on a second substrate, and electrically connecting ends of the antenna to the stud bumps. The antenna is configured to (i) receive and (ii) transmit or broadcast wireless signals.
    Type: Application
    Filed: August 5, 2016
    Publication date: January 17, 2019
    Applicant: Thin Film Electronics ASA
    Inventors: Mao TAKASHIMA, Junfeng MEI
  • Publication number: 20180359858
    Abstract: An electronic device, and methods of manufacturing the same are disclosed. The method of manufacturing the electronic device includes forming a first metal layer on a first substrate, forming an integrated circuit or a discrete electrical component on a second substrate, forming electrical connectors on input and/or output terminals of the integrated circuit or discrete electrical component, forming a second metal layer on the first metal layer, the second metal layer improving adhesion and/or electrical connectivity of the first metal layer to the electrical connectors on the integrated circuit or discrete electrical component, and electrically connecting the electrical connectors to the second metal layer.
    Type: Application
    Filed: December 12, 2016
    Publication date: December 13, 2018
    Applicant: Thin Film Electronics ASA
    Inventor: Mao ITO