Patents Assigned to Thin Film Electronics ASA
  • Publication number: 20190059160
    Abstract: A method of and system for manufacturing an electronic device, a curable conductive adhesive for use in the same, and an electronic device are disclosed. The method includes printing a conductive adhesive onto pads at ends of traces on a substrate, placing one or more components having a non-standard size and/or shape onto the pads with the conductive adhesive thereon, and after the component(s) have been placed onto the pads, curing the conductive adhesive at a predetermined temperature or with light having a predetermined wavelength (band). The system comprises a printer configured to print a conductive adhesive onto pads at ends of traces on a substrate, a surface mounting machine configured to place one or more components having a non-standard size and/or shape onto the pads with the conductive adhesive thereon, and a curing station configured to cure the conductive adhesive after the component(s) have been placed onto the pads.
    Type: Application
    Filed: February 27, 2017
    Publication date: February 21, 2019
    Applicant: Thin Film Electronics ASA
    Inventor: Olle HAGEL
  • Publication number: 20190050707
    Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more protection lines. The antenna receives and/or transmits or broadcasts a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The integrated circuit has a first set of terminals electrically connected to the antenna. The protection line(s) are on a common or different substrate as the antenna. The protection line(s) sense or determine a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered, and are electrically connected to a second set of terminals of the integrated circuit different from the first set of terminals.
    Type: Application
    Filed: October 8, 2018
    Publication date: February 14, 2019
    Applicant: Thin Film Electronics ASA
    Inventor: Matthew A. BRIGHT
  • Patent number: 10202283
    Abstract: A cyclic silane having high purity, a composition containing a polysilane obtained by polymerization of the cyclic silane, and a silicon thin film are disclosed. A method for producing a cyclic silane of the formula (SiH2)n, where n is an integer of 4 to 6, includes reacting a cyclic silane compound of the formula (SiR1R2)n (where R1 and R2 are each a hydrogen atom, a C1-6 alkyl group, or a substituted or unsubstituted phenyl group) with a hydrogen halide in the presence of an aluminum halide to obtain a cyclic silane of the formula (SiR3R4)n (where R3 and R4 are each a halogen atom), and then distilling the solution, and reducing the cyclic silane of the formula (SiR3R4)n with hydrogen or lithium aluminum hydride. The distillation may be carried out at a temperature of 40° C. to 80° C. under a reduced pressure of 0 to 30 Torr.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: February 12, 2019
    Assignee: Thin Film Electronics ASA
    Inventors: Yuichi Goto, Kentaro Nagai, Masahisa Endo, Gun Son
  • Publication number: 20190019074
    Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing the same are disclosed. The method of manufacturing the wireless communication device includes forming an integrated circuit on a first substrate, printing stud bumps on input and/or output terminals of the integrated circuit, forming an antenna on a second substrate, and electrically connecting ends of the antenna to the stud bumps. The antenna is configured to (i) receive and (ii) transmit or broadcast wireless signals.
    Type: Application
    Filed: August 5, 2016
    Publication date: January 17, 2019
    Applicant: Thin Film Electronics ASA
    Inventors: Mao TAKASHIMA, Junfeng MEI
  • Publication number: 20180359858
    Abstract: An electronic device, and methods of manufacturing the same are disclosed. The method of manufacturing the electronic device includes forming a first metal layer on a first substrate, forming an integrated circuit or a discrete electrical component on a second substrate, forming electrical connectors on input and/or output terminals of the integrated circuit or discrete electrical component, forming a second metal layer on the first metal layer, the second metal layer improving adhesion and/or electrical connectivity of the first metal layer to the electrical connectors on the integrated circuit or discrete electrical component, and electrically connecting the electrical connectors to the second metal layer.
    Type: Application
    Filed: December 12, 2016
    Publication date: December 13, 2018
    Applicant: Thin Film Electronics ASA
    Inventor: Mao ITO
  • Patent number: 10115051
    Abstract: A tag or smart label including a humidity sensor, and methods of manufacturing and using the same, are disclosed. The tag or smart label includes a substrate or backplane with a battery or antenna, a humidity sensor, and an integrated circuit thereon. The integrated circuit is in electrical communication with the humidity sensor and the antenna or battery, and is configured to process a signal from the humidity sensor corresponding to the humidity level or value in the environment to be monitored, and provide or generate a signal that represents the humidity level/value. The humidity sensor includes first and second electrodes that are a predetermined distance apart, a humidity-sensitive material having one or more electrical, mechanical or chemical properties that vary as a function of the humidity level/value, and a water- and/or humidity-permeable membrane covering the humidity-sensitive material.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: October 30, 2018
    Assignee: Thin Film Electronics ASA
    Inventors: Mao Takashima, Aditi Chandra
  • Patent number: 10115053
    Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more protection lines. The antenna receives and/or transmits or broadcasts a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The integrated circuit has a first set of terminals electrically connected to the antenna. The protection line(s) are on a common or different substrate as the antenna. The protection line(s) sense or determine a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered, and are electrically connected to a second set of terminals of the integrated circuit different from the first set of terminals.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: October 30, 2018
    Assignee: Thin Film Electronics ASA
    Inventor: Matthew A. Bright
  • Publication number: 20180253632
    Abstract: A security and/or identification device including an integrated circuit and an antenna or a battery, and methods of manufacturing and using the same, are disclosed. The integrated circuit is on a substrate to be applied, affixed or attached to a package or container, and includes a set of connection pads electrically connectable to an external component, and a memory storing a unique identification number. The antenna or battery may be on the same or a different substrate. The antenna receives a first wireless signal, transmits a second wireless signal, and enables the integrated circuit to extract power from the first wireless signal. The battery provides power to the integrated circuit. The connection pads may be electrically connectable to one or more sensing lines, and the integrated circuit may further include a continuity sensor configured to determine a continuity state of the package/container.
    Type: Application
    Filed: September 20, 2017
    Publication date: September 6, 2018
    Applicant: Thin Film Electronics ASA
    Inventors: David ULAND, Patricia BRITTON, Peter FISCHER, Aditi CHANDRA
  • Publication number: 20180247509
    Abstract: A computer-implemented method and system for associating one or more wireless tags with one or more products is disclosed. The method comprises communicating wirelessly with the wireless tag(s) using a mobile device, associating the wireless tag(s) with a user account, and assigning at least one of the wireless tag(s) to a current product or a new product. The system comprises one or more wireless tags, a mobile device configured to communicate wirelessly with the wireless tag(s), and a storage server or cloud computer configured to (i) send, receive and store the information regarding the wireless tag(s) and the associated product and (ii) store and execute an analytics program or web application configured to track the information regarding the wireless tag(s). A computer-readable storage medium enabling the method on the mobile device and a system for managing one or more wireless tags associated with one or more products are also disclosed.
    Type: Application
    Filed: February 23, 2018
    Publication date: August 30, 2018
    Applicant: Thin Film Electronics ASA
    Inventors: Zvika ASHKENAZI, Christian DELAY
  • Publication number: 20180225559
    Abstract: A method, algorithm, architecture, circuits, and/or systems for EAS, HF, UHF, and RFID designs suitable for multi-tag read applications using TTF anti-collision schemes are disclosed. In one embodiment, a tag for wirelessly communicating with a reader can include: (i) a memory portion with an identifier, the memory having at least one printed layer; and (ii) a circuit for providing a bit string followed by a predetermined silent period, where the bit string is related to the identifier. The tag can include pre-programmed memory bits (e.g., bits the value of which is programmed by printing), or alternatively, memory bits formed by conventional photolithography, but having connections made using printing technology to form the identifier, for example. A unique identifier for each tag or device used in a system under a given set of operating conditions can allow a reader to distinguish between them based on a length and/or value of a bit string, for example.
    Type: Application
    Filed: March 30, 2018
    Publication date: August 9, 2018
    Applicant: Thin Film Electronics ASA
    Inventors: Vivek SUBRAMANIAN, Vikram PAVATE
  • Publication number: 20180205135
    Abstract: A wireless communication device and methods of manufacturing and using the same are disclosed. The wireless communication device includes a substrate with an antenna and/or inductor thereon, a patterned ferrite layer overlapping the antenna and/or inductor, and a capacitor electrically connected to the antenna and/or inductor. The wireless communication device may further include an integrated circuit including a receiver configured to convert a first wireless signal to an electric signal and a transmitter configured to generate a second wireless signal, the antenna being configured to receive the first wireless signal and transmit or broadcast the second wireless signal. The patterned ferrite layer advantageously mitigates the deleterious effect of metal objects in proximity to a reader and/or transponder magnetically coupled to the antenna.
    Type: Application
    Filed: March 9, 2018
    Publication date: July 19, 2018
    Applicant: Thin Film Electronics ASA
    Inventors: Mao TAKASHIMA, Aditi CHANDRA, Somnath MUKHERJEE, Gloria WONG, Khanh VAN TU, Joey LI, Anton POPIOLEK, Arvind KAMATH
  • Patent number: 9985664
    Abstract: Circuits and circuit elements configured to generate a random delay, a monostable oscillator, circuits configured to broadcasting repetitive messages wireless systems, and methods for forming such circuits, devices, and systems. The present invention advantageously provides relatively low cost delay generating circuitry based on TFT technology in wireless electronics applications, particularly in RFID applications. Such novel, technically simplified, low cost TFT-based delay generating circuitry enables novel wireless circuits, devices and systems, and methods for producing such circuits, devices and systems.
    Type: Grant
    Filed: July 10, 2014
    Date of Patent: May 29, 2018
    Assignee: Thin Film Electronics, ASA
    Inventors: Vivek Subramanian, Mingming Mao, Zhigang Wang
  • Patent number: 9985691
    Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more continuity sensors. The antenna receives and/or backscatters a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The continuity sensor(s) are configured to sense or determine the presence of a chemical or substance in the package or container, and thus a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered. The continuity sensor(s) are electrically connected to a set of terminals of the integrated circuit different from the set of terminals to which the antenna is electrically connected.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: May 29, 2018
    Assignee: Thin Film Electronics ASA
    Inventor: Somnath Mukherjee
  • Patent number: 9953259
    Abstract: A MOS RF surveillance and/or identification tag, and methods for its manufacture and use. The tag generally includes an interposer, an antenna and/or inductor on the interposer, and integrated circuitry on the interposer in a location other than the antenna and/or inductor. The integrated circuitry generally has a lowest layer in physical contact with the interposer surface. The method of manufacture generally includes forming a lowest layer of integrated circuitry on an interposer, forming successive layers of the integrated circuitry on the lowest layer of integrated circuitry, and attaching an electrically conductive functional layer to the interposer. Alternatively, an electrically conductive structure may be formed from a functional layer attached to the interposer.
    Type: Grant
    Filed: October 3, 2005
    Date of Patent: April 24, 2018
    Assignee: Thin Film Electronics, ASA
    Inventors: J. Devin MacKenzie, Vikram Pavate
  • Patent number: 9947988
    Abstract: A wireless communication device and methods of manufacturing and using the same are disclosed. The wireless communication device includes a substrate with an antenna and/or inductor thereon, a patterned ferrite layer overlapping the antenna and/or inductor, and a capacitor electrically connected to the antenna and/or inductor. The wireless communication device may further include an integrated circuit including a receiver configured to convert a first wireless signal to an electric signal and a transmitter configured to generate a second wireless signal, the antenna being configured to receive the first wireless signal and transmit or broadcast the second wireless signal. The patterned ferrite layer advantageously mitigates the deleterious effect of metal objects in proximity to a reader and/or transponder magnetically coupled to the antenna.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: April 17, 2018
    Assignee: Thin Film Electronics ASA
    Inventors: Mao Takashima, Aditi Chandra, Somnath Mukherjee, Gloria Wong, Khanh Van Tu, Joey Li, Anton Popiolek, Arvind Kamath
  • Patent number: 9934836
    Abstract: An electronic component (1) and an electronic device (100) comprising one or more such components (1). The electronic component (1) comprises a stack (4) of layers arranged on a flexible substrate (3). Said stack comprises an electrically active part (4a) and a protective layer (11) for protecting the electrically active part against scratches and abrasion. Said electrically active part comprises a bottom electrode layer (5) and a top electrode layer (9) and at least one insulating or semi-insulating layer (7) between said electrodes. The stack further comprises a buffer layer (13), arranged between the top electrode layer (9) and the protective layer (11). The buffer layer (13) is adapted for at least partially absorbing a lateral dimensional change (?L) occurring in the protective layer (11) and thus preventing said dimensional change (?L) from being transferred to the electrically active part (4a), thereby reducing the risk of short circuit to occur between the electrodes.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: April 3, 2018
    Assignee: THIN FILM ELECTRONICS ASA
    Inventors: Christer Karlsson, Olle Jonny Hagel, Jakob Nilsson, Per Bröms
  • Publication number: 20180089552
    Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more protection lines. The antenna receives and/or transmits or broadcasts a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The integrated circuit has a first set of terminals electrically connected to the antenna. The protection line(s) are on a common or different substrate as the antenna. The protection line(s) sense or determine a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered, and are electrically connected to a second set of terminals of the integrated circuit different from the first set of terminals.
    Type: Application
    Filed: November 29, 2017
    Publication date: March 29, 2018
    Applicant: Thin Film Electronics ASA
    Inventor: Matthew A. BRIGHT
  • Patent number: 9846835
    Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more protection lines. The antenna receives and/or transmits or broadcasts a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The integrated circuit has a first set of terminals electrically connected to the antenna. The protection line(s) are on a common or different substrate as the antenna. The protection line(s) sense or determine a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered, and are electrically connected to a second set of terminals of the integrated circuit different from the first set of terminals.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: December 19, 2017
    Assignee: Thin Film Electronics, ASA
    Inventor: Matthew A. Bright
  • Publication number: 20170317719
    Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more continuity sensors. The antenna receives and/or backscatters a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The continuity sensor(s) are configured to sense or determine the presence of a chemical or substance in the package or container, and thus a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered. The continuity sensor(s) are electrically connected to a set of terminals of the integrated circuit different from the set of terminals to which the antenna is electrically connected.
    Type: Application
    Filed: July 20, 2017
    Publication date: November 2, 2017
    Applicant: Thin Film Electronics ASA
    Inventor: Somnath MUKHERJEE
  • Publication number: 20170309470
    Abstract: A method of exchanging or transforming end groups in and/or improving the ferroelectric properties of a PVDF-TrFE co-polymer is disclosed. A bulky or chemically dissimilar end group, such as an iodine, sulfate, aldehyde or carboxylic acid end group, may be transformed to a hydrogen, fluorine or chlorine atom. A method of making a PVDF-TrFE co-polymer is disclosed, including polymerizing a mixture of VDF and TrFE using an initiator, and transforming a bulky or chemically dissimilar end group to a hydrogen, fluorine or chlorine atom. A PVDF-TrFE co-polymer or other fluorinated alkene polymer is also disclosed. The co-polymer may be used as a ferroelectric, electromechanical, piezoelectric or dielectric material in an electronic device.
    Type: Application
    Filed: July 7, 2017
    Publication date: October 26, 2017
    Applicant: Thin Film Electronics ASA
    Inventors: Jakob NILSSON, Christian BROX-NILSEN