Patents Assigned to Tokai Denka Kogyo Kabushiki Kaisha
  • Method of treating surface of copper and its alloys
    Patent number: 4040863
    Abstract: In the surface treatment of copper and its alloys with an acidic aqueous solution of hydrogen peroxide, methylcyclohexanol or cyclohexanol or both of the two are added to the solution thereby inhibiting the hindering action of chlorine ion in removal of metals and oxide scales by dissolution.
    Type: Grant
    Filed: October 26, 1976
    Date of Patent: August 9, 1977
    Assignee: Tokai Denka Kogyo Kabushiki Kaisha
    Inventor: Koji Kitamura
  • Method of low-temperature activation of peroxides
    Patent number: 3948795
    Abstract: This invention provides a method for activating peroxides, particularly hydrogen peroxide or hydrogen peroxide adducts and for thereby furnishing the said peroxides with excellent bleaching effects, cleaning effects, and sterilizing effects at low temperatures, by adding to the said peroxides an aromatic compound containing in the molecule one or several groups represented by the formula ##EQU1## wherein R is a substituted or unsubstituted monovalent aromatic group and X is either CO or SO.sub.2. The activation according to this invention is preferably carried out in an aqueous solution at a pH value ranging from 7 to 11, at a temperature below 40.degree.C.
    Type: Grant
    Filed: December 21, 1973
    Date of Patent: April 6, 1976
    Assignee: Tokai Denka Kogyo Kabushiki Kaisha
    Inventors: Yasumasa Kawabe, Masaaki Suzuki
  • Method of chemically polishing copper and copper alloy
    Patent number: 3948703
    Abstract: This invention provides a method of chemically polishing copper and copper alloys which comprises using a solution with one or more members selected from azoles having the structure represented by the general formulae ##SPC1##Wherein X, X' and X" represent any of hydrogen, amino, aminoalkyl containing 1-3 carbon atoms and alkyl containing 1-3 carbon atoms added to an acid aqueous solution of hydrogen peroxide containing hydrogen peroxide and sulfuric or nitric acid.
    Type: Grant
    Filed: November 26, 1973
    Date of Patent: April 6, 1976
    Assignee: Tokai Denka Kogyo Kabushiki Kaisha
    Inventor: Kazuyoshi Kushibe
  • Etching solutions for copper and copper alloys and etching process using the same
    Patent number: 3939089
    Abstract: This invention provides etching solutions for copper and copper alloys comprising a mixed aqueous solution of a peroxysulfate with a purine compound and a halogen compound added as the catalyst. There is also provided a process for etching copper or copper alloys with said etching solutions.
    Type: Grant
    Filed: September 30, 1974
    Date of Patent: February 17, 1976
    Assignee: Tokai Denka Kogyo Kabushiki Kaisha
    Inventors: Akira Matsumoto, Katsutoshi Itani
  • Copper and copper alloy etching solutions and process
    Patent number: 3936332
    Abstract: This invention provides cooper and copper alloy etching solutions comprising a mixed aqueous solution of a peroxysulfate with a diazine compound and a halogen compound added as the catalyst. There is also provided a process for etching copper and copper alloys with said etching solutions.
    Type: Grant
    Filed: September 30, 1974
    Date of Patent: February 3, 1976
    Assignee: Tokai Denka Kogyo Kabushiki Kaisha
    Inventors: Akira Matsumoto, Katsutoshi Itani