Patents Assigned to Tokyo Ohka Kogyo Co., Ltd.
  • Patent number: 11612891
    Abstract: A filter film includes a through-hole and a recessed portion having a size capable of capturing one particle, in which the recessed portion is open to one face of the filter film, the through-hole in the one face has a shape or a size such that the one particle is not capable of passing through the through-hole, and the through-hole and the recessed portion are disposed close to each other.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: March 28, 2023
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yasuo Suzuki, Atsushi Murota, Takashi Ohsaka, Toshiyuki Ogata
  • Patent number: 11586111
    Abstract: A resist composition including a compound (D0) represented by general formula (d0) and a resin component (A1) has a structural unit (a0) in which a compound represented by general formula (a0-1) has a polymerizable group within the W1 portion converted into a main chain (in formula (d0), Rd01 represents a fluorine atom or a fluorinated alkyl group; In formula (a0-1), W1 represents a polymerizable group-containing group; Ct represents a tertiary carbon atom, and the ?-position of Ct is a carbon atom which constitutes a carbon-carbon unsaturated bond; R11 represents an aromatic hydrocarbon group; or a chain hydrocarbon group; R12 and R13 each independently represents a chain hydrocarbon group, or R12 and R13 are mutually bonded to form a cyclic group).
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: February 21, 2023
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yasuhiro Yoshii, Masahito Yahagi, Yoichi Hori, Takahiro Kojima
  • Publication number: 20230041025
    Abstract: A negative-working photosensitive resin composition including an epoxy group-containing resin, a metal oxide, and a cationic polymerization initiator, in which a photosensitive resin film having a film thickness of 20 ?m obtained by applying the negative-working photosensitive resin composition onto a silicon wafer and performing a bake treatment at 90° C. for 5 minutes has a Martens hardness of less than 235 [N/mm2], and when a viscoelasticity of a cured film, which is obtained by exposing the photosensitive resin film to i-rays at an irradiation amount of 200 mJ/cm2, performing a bake treatment after the exposure at 90° C. for 5 minutes, and then performing a bake treatment at 200° C. for 1 hour to cure the photosensitive resin film, is measured at a frequency of 1.0 Hz, a tensile elastic modulus (E*) of the cured film at a temperature of 175° C. is 2.1 [GPa] or more.
    Type: Application
    Filed: October 5, 2020
    Publication date: February 9, 2023
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Ryosuke NAKAMURA, Takahiro KONDO, Hiroaki TAKEUCHI, Hirofumi IMAI
  • Patent number: 11560444
    Abstract: A block copolymer including a first block consisting of a polymer having a repeating structure of a structural unit (u1) containing no silicon atom, and a second block consisting of a polymer having a repeating structure of a structural unit (u2) containing a silicon atom, the second block containing a block (b21) consisting of a polymer having a repeating structure of a structural unit (u21) represented by general formula (u2-1) shown below, and the volume ratio of the first block, based on all blocks constituting the block copolymer being 42 to 44 vol %: In which RP211 represents an alkyl group, a halogenated alkyl group, a hydrogen atom, or an organic group having a polar group; and RP212 is a group derived from a compound represented by formula SHRt1, wherein Rt1 represents a hydrocarbon group having 1 to 5 carbon atoms optionally having a substituent.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: January 24, 2023
    Assignees: TOKYO OHKA KOGYO CO., LTD., TOKYO INSTITUTE OF TECHNOLOGY
    Inventors: Teruaki Hayakawa, Seina Yamazaki, Akiyoshi Yamazaki, Daisuke Kawana, Yoshitaka Komuro, Takaya Maehashi, Rin Odashima
  • Patent number: 11547968
    Abstract: The present invention provides: a gas separation method which is capable of desirably separating a slight amount of a component from a mixed gas under mild conditions such that the pressure difference between both sides of a gas separation membrane is 1 atmosphere or less; and a gas separation membrane which is suitable for use in this gas separation method. According to the present invention, in a gas separation method wherein a specific gas (A) in a mixed gas, which contains the specific gas (A) at a concentration of 1,000 ppm by mass or less, is selectively permeated with use of a gas separation membrane, an extremely thin gas separation membrane that has a film thickness of 1 ?m or less is used, so that the gas (A) is desirably separated under mild conditions such that the pressure difference between both sides of the gas separation membrane is 1 atmosphere or less.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: January 10, 2023
    Assignees: TOKYO OHKA KOGYO CO., LTD., NANOMEMBRANE TECHNOLOGIES, INC.
    Inventors: Takuya Noguchi, Takahiro Senzaki, Toshiyuki Ogata, Toyoki Kunitake, Shigenori Fujikawa, Miho Ariyoshi
  • Patent number: 11542397
    Abstract: The present invention provides: a liquid composition which can be suitably used for production of an optical film having a favorable fluorescence efficiency and includes quantum dots (A), a quantum dot-containing film obtained by drying and/or curing the liquid composition, an optical film for a light-emitting display element made of the quantum dot-containing film, a light-emitting display element panel including the optical film, and a light-emitting display equipped with the light-emitting display element panel. An ionic liquid (B), and a solvent (S) are incorporated into a liquid composition including quantum dots (A), in which the solvent (S) includes a solvent (S1), the solvent (S1) being a compound having a cyclic skeleton and including a heteroatom other than a hydrogen atom and a carbon atom.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: January 3, 2023
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Takehiro Seshimo, Kunihiro Noda, Dai Shiota
  • Patent number: 11518937
    Abstract: An etching solution for selectively performing an etching process on a compound represented by General Formula Si1-xGex, in which x is more than 0 and less than 1, with respect to Si, Ge, and oxides thereof, the etching solution including hydrofluoric acid, nitric acid, and water, in which a content ratio of the hydrofluoric acid in the entire etching solution is 0.002% by mass or more and 1.0% by mass or less, a content ratio of the nitric acid in the entire etching solution is 10% by mass or more, and a content ratio of the water in the entire etching solution is 40% by mass or less.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: December 6, 2022
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yukihisa Wada, Daijiro Mori
  • Publication number: 20220381768
    Abstract: A method for screening secretion-producing cells is provided, in which a cell that produces a secretion of interest is subjected to screening from a plurality of cells. The method includes capturing the cell and at least one detection particle that is allowed to capture the secretion of interest in each of a plurality of wells having a bottom section with a through-hole sized such that the cell does not pass through, causing the cell captured in each of the plurality of wells to produce a secretion, detecting the secretion of interest captured by the at least one detection particle, and identifying, based on a result of the detection as an index, a well in which a cell producing the secretion of interest is captured from the plurality of wells. Each of the wells has a size allowing the cell to be captured in one cell unit in a state in which one or more detection particles are captured.
    Type: Application
    Filed: September 28, 2020
    Publication date: December 1, 2022
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventor: Takashi OHSAKA
  • Patent number: 11491772
    Abstract: A substrate bonding method which enables forming a precision fine space using a method that is simpler and easier than conventional methods; and a laminated body production method that uses the substrate bonding method. This substrate bonding method includes disposing a first substrate on a photoresist pattern formed on a support film so as to bring the first substrate into contact with a surface of the photoresist pattern located on the side opposite to the support film, and pressure-bonding the support film, the photoresist pattern, and the first substrate; releasing the bonded support film after the pressure-bonding; and disposing a second substrate on the photoresist pattern so as to bring the second substrate into contact with the surface of the photoresist pattern located on the side opposite to the first substrate, and pressure-bonding the first substrate, the photoresist pattern, and the second substrate.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: November 8, 2022
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Ryuma Mizusawa, Tomoyuki Ando
  • Publication number: 20220340859
    Abstract: A cell screening device including a bottom plate, a cell placement membrane, a pair of fluid injection parts, and a flow channel, the flow channel being formed between the bottom plate and the cell placement membrane and extending in such a manner that the flow channel end parts respectively reach the fluid injection parts. In the cell placement membrane, a plurality of wells, each having a size capable of housing a single cell, and through holes are formed. In the back side of each lid, i.e., the ceiling face of the flow channel end part, a debubbling surface, which rises in an inclined or step-like manner as getting closer to a fluid injection hole, is formed.
    Type: Application
    Filed: September 28, 2020
    Publication date: October 27, 2022
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventor: Takashi OHSAKA
  • Patent number: 11474432
    Abstract: A chemically amplified photosensitive composition which forms a resist pattern whose cross-sectional shape is rectangular, and which has a wide depth of focus margin; a photosensitive dry film having a photosensitive layer made from the composition; a method of manufacturing a patterned-resist film using the composition; a method of manufacturing a substrate with a template using the composition; a method of manufacturing a plated article using the substrate with a template; and a novel compound. An acid diffusion suppressing agent having a specific structure is blended into the composition including an acid generator which generates acid upon exposure to an irradiated active ray or radiation.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: October 18, 2022
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Akiya Kawaue, Yasushi Kuroiwa
  • Patent number: 11472956
    Abstract: A resin composition for forming a phase-separated structure containing a block copolymer having a first block and a second block, in which the first block is formed of a constituent unit represented by Formula (b1), the second block is formed of a constituent unit represented by Formula (b2m) and a random copolymer having a constituent unit represented by Formula (b2g), and a ratio of a volume of the first block is 20% to 80% by volume.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: October 18, 2022
    Assignees: TOKYO OHKA KOGYO CO., LTD., TOKYO INSTITUTE OF TECHNOLOGY
    Inventors: Teruaki Hayakawa, Lei Dong, Takahiro Dazai, Ken Miyagi, Takayoshi Mori, Daisuke Kawana
  • Publication number: 20220325024
    Abstract: Provided are a curable composition that provides a cured film excellent in antifogging properties, an antifogging coating agent containing the composition, and a cured film formed from a cured product of the composition. A curable composition according to an embodiment of the invention contains a (meth)acrylate compound (A), and a surfactant (B), wherein the component (A) contains a (meth)acrylate compound (A1) having an HLB value of 15.2 or more, and the content of the component (B) with respect to 100 parts by mass of the component (A) is 0.1 parts by mass or more and 20 parts by mass or less.
    Type: Application
    Filed: March 29, 2022
    Publication date: October 13, 2022
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Hisato SHIMIZU, Takahiro SENZAKI
  • Patent number: 11466114
    Abstract: A composition for forming a phase-separated structure contains a block copolymer having a block (b1) consisting of a repeating structure of a styrene unit and a block (b2) consisting of a repeating structure of a methyl methacrylate unit, in which the block (b2) is disposed at least at one terminal portion of the block copolymer, the block copolymer has a structure (e1) represented by General Formula (e1) at least at one main chain terminal, and the structure (e1) is bonded to the main chain terminal of the block (b2) disposed at a terminal portion of the block copolymer. Ree0 represents a hydrocarbon group containing a hetero atom, and Re1 represents a hydrogen atom or a halogen atom.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: October 11, 2022
    Assignees: TOKYO OHKA KOGYO CO., LTD., NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY
    Inventors: Ken Miyagi, Takahiro Dazai, Toshifumi Satoh, Takuya Isono
  • Patent number: 11460770
    Abstract: A resist composition containing a base material component of which solubility in a developing solution is changed due to an action of an acid and a compound represented by Formula (bd1); in the formula, Rbd1 to Rbd3 each independently represent an aryl group which may have a substituent, provided that one or more of Rbd1 to Rbd3 are aryl groups having a fluorinated alkyl group which may have a substituent, and at least one of the fluorinated alkyl groups which may have a substituent in these aryl groups is bonded to a carbon atom adjacent to a carbon atom that is bonded to a sulfur atom in the formula, and a total number of the fluorinated alkyl groups which may have a substituent is 2 or more; X? represents a counter anion.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: October 4, 2022
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Takuya Ikeda, Junichi Miyakawa
  • Publication number: 20220301662
    Abstract: An information processing system includes a storage unit configured to store correspondence information in which material information indicating a material of a composition and a process condition in a process using the composition are associated with performance information of a composition obtained by the process, a performance estimation unit configured to acquire the performance information on the basis of the input material information and processing condition, and the correspondence information, and an output unit configured to output the performance information.
    Type: Application
    Filed: August 14, 2020
    Publication date: September 22, 2022
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Hitoshi YAMANO, Ryohei EGUCHI, Makoto SATO, Hiroaki SHIMIZU
  • Publication number: 20220297127
    Abstract: A cell screening device having a bottom plate part; a cell placement membrane provided on the bottom plate part and forming a cell placement surface; a pair of fluid injection parts provided on the bottom plate part and partitioned from the cell placement membrane; and a flow channel provided between the bottom plate part and the cell placement membrane and having flow channel end portions extending to the fluid injection parts. On the cell placement surface of the cell placement membrane are formed a plurality of wells having a size that enables the wells to individually accommodate cells to be screened, and through holes extending from the inner bottom surfaces of the wells and communicating with the flow channel.
    Type: Application
    Filed: September 28, 2020
    Publication date: September 22, 2022
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventor: Takashi OHSAKA
  • Patent number: 11441101
    Abstract: A cleaning composition which can remove a layer of interest using a conventional apparatus, such as a coater, a baking furnace and a cleaning chamber, installed in semiconductor manufacturing equipment while preventing the damage or deformation of layers other than the layer of interest, such as a substrate and an interlayer insulation film; a cleaning method using the cleaning composition; and a method for producing a semiconductor employing the cleaning method. A layer of interest formed on a substrate is cleaned with a cleaning composition containing a component capable of decomposing the layer of interest and a film-forming polymer. An example of the layer of interest is a hard mask film. An example of the component is at least one of a basic compound and an acidic compound.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: September 13, 2022
    Assignees: TOKYO OHKA KOGYO CO., LTD., TOKYO ELECTRON LIMITED
    Inventors: Isao Hirano, Kazumasa Wakiya, Shoichi Terada, Junji Nakamura, Takayuki Toshima
  • Patent number: 11413682
    Abstract: To provide a method for producing surface-modified metal oxide fine particles, which can produce surface-modified metal oxide fine particles having excellent dispersion stability in dispersion liquids having various compositions; a method for producing improved metal oxide fine particles, suitable as a method for producing metal oxide fine particles to be surface-modified in production of the surface-modified metal oxide fine particles; surface-modified metal oxide fine particles which can be produced by the method for producing surface-modified metal oxide fine particles; and a metal oxide fine particle dispersion liquid including the surface-modified metal oxide fine particles. Surface-modified metal oxide fine particles are produced by a method including coating at least a part of surfaces of metal oxide fine particles with a carboxylic acid compound having a certain structure substituted with an amino group which may be cyclic, and/or carboxylate thereof.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: August 16, 2022
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Naozumi Matsumoto, Kazuya Someya, Dai Shiota
  • Patent number: 11415888
    Abstract: A negative type photosensitive resin composition containing an epoxy group-containing resin; a metal oxide; and a cationic polymerization initiator (I). The cationic polymerization initiator (I) contains one or more of a compound represented by Formula (I1) and a compound represented by Formula (I2). In Formula (I1), Rb01 to Rb04 represent an aryl group which may have a substituent or a fluorine atom. In Formula (I2), Rb05 represents a fluorinated alkyl group which may have a substituent or a fluorine atom. A plurality of Rb05's may be the same as or different from one another. q represents an integer of 1 or greater, and Qq+'s each independently represent a q-valent organic cation.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: August 16, 2022
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Ryosuke Nakamura, Tomoyuki Ando, Tokunori Yamadaya