Abstract: A curable liquid composition containing a particulate filler and an epoxy compound having a non-aromatic cyclic group having 5 or more annular atoms, having a favorable dispersion stability of particulate filler and providing a cured material having high hardness, a filler that is suitably incorporated in the curable liquid composition, and a compound that can be suitably used as a ligand bonded to the filler. In a curable liquid composition comprising an epoxy compound having a non-aromatic cyclic group having 5 or more annular atoms as a curable component, a filler on a surface of which a ligand having an alicyclic epoxy group that may be condensed with an aromatic ring and a thiol group, is bonded, is used.

Abstract: Provided is a cleaning composition for a component of a semiconductor manufacturing process chamber including: a foaming agent; an oxidizing agent; and an acidic compound, in which a value of (Number of moles of the acidic compound contained in the cleaning composition×acid valence of the acidic compound)/(Number of moles of the foaming agent contained in the cleaning composition×Base valence of the foaming agent) is more than 0.1 and less than 1.5.

Abstract: A curable composition that can contain a high concentration of a heterocyclic compound (A) having a triazine ring as a component which gives a cured product exhibiting a high refractive index, surface without defects such as roughness or cracks, and is unlikely to have cracks occurring on the surface thereof even when exposed to a high-temperature and high-humidity environment, a cured product of the curable composition, and a compound that may be blended to the curable composition. As a component of the composition, a triazine compound having a structure in which an optionally substituted monocyclic aromatic group(s) or an optionally substituted condensed aromatic group(s) is/are bonded to the triazine ring via an amino group, and, as a solvent, triethylene glycol dimethyl ether are used in combination.

Abstract: A radio wave-absorbing laminate film in which both the top surface and the bottom surface have superior transmission attenuation properties and reflection attenuation capabilities in extremely high-frequency wave bands and higher, and which exhibits excellent radio wave absorption properties even when extremely thin; a production method for the film; and an element containing the film. A radio wave-absorbing laminate film having radio wave-absorbing layers, the radio wave-absorbing laminate film including a center layer, two substrate layers, and two radio wave-absorbing layers, the center layer containing at least one metal layer, and the two substrate layers being laminated on both surfaces of the center layer.

Abstract: A resist composition which generates an acid by exposure and whose solubility in a developing solution changes by the action of an acid. The resist composition contains a high-molecular-weight compound having a constitutional unit represented by General Formula (a0-1), and a high-molecular-weight compound having a constitutional unit represented by General Formula (f01-1) and a constitutional unit including an acid-dissociable group represented by General Formula (f02-r-1).

Abstract: A surface treatment agent containing a silylating agent (A) and a compound (C) having an amide skeleton in a molecule, and a surface treatment method for subjecting an object to be treated to surface treatment using the surface treatment agent.

Abstract: Provided are a curable composition that provides a cured film excellent in antifogging properties, an antifogging coating agent containing the composition, and a cured film formed from a cured product of the composition. A curable composition according to an embodiment of the invention contains a (meth)acrylate compound (A), and a surfactant (B), wherein the component (A) contains a (meth)acrylate compound (A1) having an HLB value of 15.2 or more, and the content of the component (B) with respect to 100 parts by mass of the component (A) is 0.1 parts by mass or more and 20 parts by mass or less.

Abstract: A resist composition containing a resin component (A1) having a constitutional unit (a01) and a constitutional unit (a02) derived from compounds each represented by General Formulae (a01-1) and (a02-1), a compound (B1) represented by General Formula (b1), and a compound represented by General Formula (d1-1) or a compound represented by General Formula (d1-2), in the formulae, Ct represents a tertiary carbon atom, a carbon atom at an ?-position of Ct constitutes a carbon-carbon unsaturated bond, Wa02 represents an aromatic hydrocarbon group, and Rb1 represents hydrocarbon group, where a fluorine atom is not contained

Abstract: A method of analyzing a metal component contained as an impurity in a polymer composition that contains a polymer and an organic solvent including a step (i) of preparing a dispersion by mixing the polymer composition with an acid aqueous solution, a step (ii) of separating the dispersion prepared in the step (i) into a dispersoid layer containing the polymer and a dispersion medium layer containing the metal component, and a step (iii) of quantifying the metal component contained in the dispersion medium layer separated in the step (ii).

Abstract: A curable composition capable of forming a cured product having a high refractive index and suppressed increase in reflectance, a cured product of the curable composition, and a method for producing the cured product using the curable composition. The curable composition includes a photopolymerizable monomer, metal oxide nanoparticles, and a photopolymerization initiating agent. The photopolymerizable monomer includes a compound represented by the following formula (a1).

Abstract: A protective film forming agent for plasma dicing which can favorably form an opening (processed groove) of a desired shape by irradiation of a laser beam, at a desired position of the protective film, upon producing semiconductor chips by cutting a semiconductor substrate by plasma dicing, and a method for producing a semiconductor chip using this protective film forming agent. The protective film forming agent comprises a water-soluble resin, a light absorber, and a solvent, and a weight loss rate when the temperature is raised to 500° C. in thermogravimetry of the water-soluble resin is at least 80 weight %.

Abstract: A hard mask-forming composition which forms a hard mask used in lithography, including: a resin containing an aromatic ring and a polar group; and a compound containing at least one of an oxazine ring fused to an aromatic ring, and a fluorene ring.

Abstract: The present invention aims to provide: a novel silicon-containing polymer that is alkali soluble or is soluble in an alkaline aqueous solution by using heat, etc.; a film-forming composition including the silicon-containing polymer; a method for forming a silicon-containing polymer coating using the film-forming composition; a method for forming a silica coating using the film-forming composition; and a production method for the silicon-containing polymer. The silicon-containing polymer including at least either a polysiloxane chain or oligosiloxane chain or a polysilane chain or oligosilane chain in the molecular chain thereof has a group that has e.g., a carboxy or carboxylic acid ester group and a sulfide group, introduced to the molecular chain as a result of an ene-thiol reaction.

Abstract: An energy-sensitive composition that yields a cured product with excellent thermal resistance and crack resistance, a cured product of the composition, and a method of forming a cured product. The energy-sensitive composition includes a polysilane and a thermal base generator, in which the thermal base generator includes an ionic compound and a nonionic compound. An anion moiety in the ionic compound preferably includes at least one of an anion having an oxaxanthone skeleton, an anion having a ketoprofen skeleton, and an anion having a fluorenone skeleton.

Abstract: A ruthenium-etching solution for carrying out an etching process on ruthenium. The etching solution includes orthoperiodic acid and ammonia, in which a pH is 8 or higher and 10 or lower. A method for manufacturing the ruthenium-etching solution, a method for processing an object to be processed including carrying out an etching process on an object to be processed including ruthenium using the ruthenium-etching solution, and a method for manufacturing a ruthenium-containing wiring.

Abstract: A resist composition that contains a base material component exhibiting changed solubility in a developing solution under action of acid and a compound (D0) represented by General Formula (d0), in which R01, R02, R03, and R04 each independently represents a hydrogen atom, a hydroxy group, a halogen atom, or an alkyl group; alternatively, R01 and R02, R02 and R03, or R03 and R04 are bonded to each other to form an aromatic ring; R05 represents a hydrogen atom or an alkyl group; Y represents a group that forms an alicyclic group together with a carbon atom *C; provided that at least one of the carbon atoms that form the alicyclic group is substituted with an ether bond, a thioether bond, a carbonyl group, a sulfinyl group, or a sulfonyl group; m represents an integer of 1 or more, and Mm+ represents an m-valent organic cation.

Abstract: A resist composition that contains a base material component (A), a first acid generator, and a second acid generator, the first acid generator is a compound represented by General Formula (b1), the second acid generator is a compound (B2) having an anion moiety having a molar volume of 250 cm3/mol or less, and the molar volume of the anion moiety of the compound (B2) is smaller than the molar volume of the anion moiety of the compound (B1). In the formula, Rb0 represents a specific condensed cyclic group, Yb0 represents a divalent linking group, Vb0 represents a single bond, Rc1 represents an aryl group having an electron-withdrawing group, Rc2 and Rc3 each independently represent an aryl group or are bonded to each other to form a ring together with a sulfur atom in the formula.

Abstract: A method for collecting a fine particle stored in a structure by suctioning the fine particle using a nozzle, in which, as the structure, a structure in which at least one communication portion that communicates a space storing the fine particle with one surface side and the other surface side of the structure is formed is used.