Abstract: To provide a hydrophilizing surface treatment liquid suppressing the deterioration over time of the effect of a surface treatment even when a surface-treated article is exposed to a variety of chemicals and a hydrophilizing treatment method in which the hydrophilizing surface treatment liquid is used. In a hydrophilizing surface treatment liquid including a polymerizable compound having an ethylenic unsaturated double bond (A), a polymerization initiator (B) and a solvent (S), a hydrophilic polymerizable compound (A1), an adhesive polymerizable compound (A2), an acidic polymerizable compound (A3a) and/or a basic polymerizable compound (A3b) are used as the polymerizable compound (A), and an aqueous solution including the polymerizable compound (A) at a concentration of 10% by mass has a pH at 23° C. of 6.5 or more and 7.5 or less.

Abstract: A hard-mask forming composition that forms a hard mask that is used in lithography, the hard-mask forming composition including at least one of a compound represented by General Formula (sc-1) and a resin having a partial structure represented by General Formula (sc-p1).

Abstract: There is provided a production method for a resist composition purified product, which includes a step (i) of filtering a resist composition with a filter having a porous structure in which adjacent spherical cells are connected to each other. The filter includes a porous membrane containing at least one resin selected from the group consisting of polyimide and polyamide imide. The resist composition contains a base material component (A) that exhibits changed solubility in a developing solution under action of acid, an onium salt, and an organic solvent component (S), where the content of the organic solvent component (S) is 97% by mass or more.

Abstract: A chemical solution used for cleaning or etching a ruthenium-containing layer, which can obtain the ruthenium-containing layer having a reduced surface roughness while maintaining a good etching rate against the ruthenium, and a method for fabricating ruthenium wiring. The chemical solution includes orthoperiodic acid, a base component, and any one of a nitrogen-containing heterocyclic compound, an organic phosphonic acid, and an organic carboxylic acid.

Abstract: A resist composition including a base material component (A), an acid generator component (B), and a mixed solvent (S) in which an organic solvent (S1) represented by Formula (s1) is mixed, in which the acid generator component (B) contains a compound (B1) represented by Formula (b1). In the formula, Rb1 represents an aryl group. Rb2 and Rb3 each independently represent an aliphatic hydrocarbon group. Lb1, Lb2, and Lb3 each independently represent a divalent linking group or a single bond. X? represents a counter anion.

Abstract: To provide a polymerizable composition capable of forming a thick hydrophilic resin coating having high hardness and excellent durability on the surface of an object to be treated, which is a surface treatment object, and a hydrophilizing treatment method in which the polymerizable composition is used. In a polymerizable composition including a polymerizable compound (A), a polymerization initiator (B), inorganic fine particles (C) and a solvent (S), a polymerizable betaine compound (A1) having an ethylenic unsaturated double bond and a betaine structure and an adhesive polymerizable compound (A2) having an ethylenic unsaturated double bond and a specific type of adhesive group are used as the polymerizable compound (A); a water-soluble radical polymerization initiator (B1) is used as the polymerization initiator (B); and inorganic fine particles (C) having a functional group capable of forming a covalent bond with a polymer of the polymerizable compound (A) are used.

Abstract: Provided are: a surface treatment liquid with which it is possible to conduct a surface treatment of an object to be treated, so that water, upon contact with the treated surface, rapidly spreads on and wets the surface; a surface treatment method for treating an object using the surface treatment liquid; and a method for producing a roll-shaped sheet which has been surface-treated by the surface treatment method. The surface treatment liquid comprises a polymer (A) and a solvent(S), wherein the polymer (A) comprises a constituent unit (a1) which is derived from a monomer having a log P value of 0.5 or less and which has a hydrophilic group and a constituent unit (a2) derived from a monomer that gives a homopolymer having a glass transition temperature (Tg) of 120° C. or higher, and the polymer (A) has a weight-average molecular weight of 500-20,000.

Abstract: A curable composition that gives a cured product exhibiting a high refractive index and a surface without defects such as roughness or cracks, a cured product of the composition, and a compound that may be blended to the composition. A triazine compound is used as a curable component in a curable composition, the triazine compound having an optionally substituted quinolinyl group, an optionally substituted isoquinolinyl group, or an optionally substituted 2-substituted benzothiazolyl group and an aromatic-ring-containing group having a radically polymerizable group-containing group or an aromatic-ring-containing group having a cationically polymerizable group-containing group, each group bonded to the triazine ring via an amino group.

Abstract: A resist composition including a base material component (A) whose solubility in a developing solution is changed due to an action of an acid, in which the base material component (A) contains a polymer compound (A1) having a constitutional unit (a1) represented by Formula (a1-1). In the formula, R represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, Vax1 represents a single bond or a divalent linking group, na0 represents an integer of 0 to 2, and R01 represents a methyl group or an ethyl group.

Abstract: A curable composition that gives a cured product exhibiting a high refractive index and a surface without defects such as roughness or cracks, a cured product of the composition, and a compound that may be blended to the composition. In a curable composition including a triazine compound having three aromatic-ring-containing groups each bonded to the triazine ring via an amino group, an aromatic-ring-containing group having a specific structure having a radically polymerizable group-containing group or a cationically polymerizable group-containing group is used as at least one of the three aromatic-ring-containing groups bonded to the triazine ring in the triazine compound mentioned above.

Abstract: A resist composition containing a polymeric compound having a constitutional unit (a01) derived from a compound represented by General Formula (a0-1).

Abstract: A resist composition containing a polymeric compound having a constitutional unit (a01) derived from a compound represented by General Formula (a0-1).

Abstract: A particle capturing device including a substrate, a particle capturing film configured to capture particles, and a support configured to support the particle capturing film when tension is applied to the particle capturing film such that the particle capturing film is in parallel with the substrate and a space is formed between the particle capturing film and the substrate.

Abstract: In a method of manufacturing an integrated circuit device, a photoresist layer is formed by coating a photoresist composition on a substrate having a main surface and an edge portion surrounding the main surface. A portion of the photoresist layer is removed from the edge portion of the substrate. After the portion of the photoresist layer is removed, the substrate is processed using a main treatment composition including an organic solvent, acid, and water.

Abstract: A method for producing a semiconductor element and a chemical solution to be used in the method for producing a semiconductor element, the method including dry-etching or chemically-mechanically polishing a ruthenium-containing layer located as an uppermost layer of a substrate; and bringing a surface of the substrate into contact with a chemical solution thereby satisfactorily cleaning and removing a ruthenium residue formed on the surface of the substrate; and a chemical solution to be suitably used in the method for producing a semiconductor element.

Abstract: An energy-sensitive composition including a polysilane, a base generator, and a solvent, the base generator including a compound represented by formula (b1) and a photo base generator: in which Rb1 to Rb3 each independently represents a hydrogen atom, halogen atom, hydroxyl group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, sulfonato group, phosphino group, phosphinyl group, phosphonato group or organic group; Rb4 and Rb5 each independently represent a hydrogen atom, halogen atom, hydroxyl group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, sulfino group, sulfo group, sulfonato group, phosphino group, phosphinyl group, phosphono group, phosphonato group or aliphatic group; and Rb6 represents a hydrogen atom, alkyl group or alkoxy group.

Abstract: A resist composition containing a silicon-containing resin, an acid generator component which generates an acid upon exposure, and a photodecomposable base which controls diffusion of the acid generated from the acid generator component upon exposure, in which the silicon content proportion in the silicon-containing resin is in a range of 20% to 25% with respect to a total amount of all atoms constituting the silicon-containing resin.

Abstract: A curable liquid composition containing a particulate filler and an epoxy compound having a non-aromatic cyclic group having 5 or more annular atoms, having a favorable dispersion stability of particulate filler and providing a cured material having high hardness, a filler that is suitably incorporated in the curable liquid composition, and a compound that can be suitably used as a ligand bonded to the filler. In a curable liquid composition comprising an epoxy compound having a non-aromatic cyclic group having 5 or more annular atoms as a curable component, a filler on a surface of which a ligand having an alicyclic epoxy group that may be condensed with an aromatic ring and a thiol group, is bonded, is used.