Patents Assigned to Tong Hsing Electronic Industries Ltd.
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Patent number: 12189152Abstract: A sensor lens assembly includes a circuit board, an optical module assembled onto the circuit board, and a sensing module that is surrounded by the optical module. The sensing module includes a sensor chip disposed on and electrically coupled to the circuit board, a supporting layer having a ring shape and disposed on the sensor chip, and a light-permeable layer. The light-permeable layer is disposed on the supporting layer through a ring-shaped segment thereof, so that the light-permeable layer, the supporting layer, and the sensor chip jointly define an enclosed space. The ring-shaped segment has a ring-shaped roughened region. A projection space defined by orthogonally projecting the ring-shaped roughened region toward the sensor chip is located outside of a sensing region of the sensor chip and overlaps an entirety of the supporting layer and a part of the enclosed space.Type: GrantFiled: February 8, 2023Date of Patent: January 7, 2025Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Chia-Shuai Chang, Chien-Chen Lee, Li-Chun Hung
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Patent number: 12177996Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically coupling the substrate and the sensor chip, a frame fixed on the substrate, and a light-permeable layer that is disposed on the frame. The light-permeable layer has a transparent segment and a ring-shaped segment that surrounds the transparent segment. The ring-shaped segment is disposed on a top end surface of the frame, so that the light-permeable layer, the frame, and the substrate jointly define an enclosed space that accommodates the sensor chip and the metal wires therein. The ring-shaped segment has an inner ring-shaped roughened region that is arranged on an inner surface thereof and that is fixed onto the top end surface of the frame. Moreover, an inner edge of the inner ring-shaped roughened region is arranged in the enclosed space.Type: GrantFiled: February 24, 2023Date of Patent: December 24, 2024Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Li-Chun Hung, Chien-Chen Lee, Chia-Shuai Chang
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Patent number: 12174446Abstract: A sensor lens assembly having a non-soldering configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed on the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupled to the sensor chip and the circuit board, and a cover that overcovers the sensor chip and the wires. The cover includes a light-permeable sheet and an opaque frame. The light-permeable sheet has a ring-shaped notch recessed in an edge of an inner surface thereof. The opaque frame is formed on the ring-shaped notch and is disposed on the circuit board, the light-permeable sheet and the sensor chip are spaced apart from each other, and the sensor chip and the wires are arranged in a space that is defined by the light-permeable sheet and the opaque frame.Type: GrantFiled: March 8, 2022Date of Patent: December 24, 2024Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Chia-Shuai Chang, Chien-Chen Lee, Li-Chun Hung, Chien-Yuan Wang
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Patent number: 12119363Abstract: A sensor package structure is provided and includes a substrate, a sensor chip, a ring-shaped supporting layer, and a light-permeable sheet. The sensor chip is disposed on and electrically coupled to the substrate. The ring-shaped supporting layer is disposed on the sensor chip and surrounds a sensing region of the sensor chip. The light-permeable sheet has a ring-shaped notch recessed in a peripheral edge of an inner surface of the light-permeable sheet, and a depth of the ring-shaped notch with respect to the inner surface is at least 10 ?m. The light-permeable sheet is disposed on the ring-shaped supporting layer through the ring-shaped notch, and the inner surface is not in contact with the ring-shaped supporting layer, so that the inner surface of the light-permeable sheet, an inner side of the ring-shaped supporting layer, and the top surface of the sensor chip jointly define an enclosed space.Type: GrantFiled: May 19, 2022Date of Patent: October 15, 2024Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Chien-Chen Lee, Li-Chun Hung, Ya-Han Chang
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Patent number: 12113082Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a ring-shaped support disposed on the sensor chip, and a light-permeable layer disposed on the ring-shaped support. A top portion of the sensor chip defines a sensing region and a carrying region that surrounds the sensing region and that carries the ring-shaped support. The top portion of the sensor chip includes a passivation layer arranged in the sensing region and the carrying region, a color filter arranged in the sensing region and the carrying region, a pixel layer arranged in the sensing region and formed on the central segment, and a micro-lens layer that is formed on the pixel layer. A part of the color filter layer in the carrying region has a roughened surface and at least partially embedded in the ring-shaped support.Type: GrantFiled: April 11, 2022Date of Patent: October 8, 2024Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Ya-Han Chang, Li-Chun Hung, Chien-Chen Lee
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Patent number: 12108517Abstract: A sensor lens assembly having a non-soldering configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to the circuit board, a sensor chip and an extending wall both assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The extending wall surrounds the sensor chip and has an extending top surface that is substantially flush with a top surface of the sensor chip. The supporting adhesive layer is in a ringed shape and is disposed on the extending top surface of the extending wall and the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer, so that the light-permeable sheet, the supporting adhesive layer, and the top surface of the sensor chip jointly define an enclosed space.Type: GrantFiled: January 20, 2022Date of Patent: October 1, 2024Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Chia-Shuai Chang, Chien-Chen Lee, Li-Chun Hung, Ya-Han Chang
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Patent number: 12080659Abstract: A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the substrate and surrounding the sensor chip, a light-permeable layer disposed on the light-curing layer, and a shielding layer that is ring-shaped and that is disposed on the light-permeable layer. And inner surface of the light-permeable layer, the light-curing layer, and the substrate jointly define an enclosed space that accommodates the sensor chip. A first projection area defined by orthogonally projecting the shielding layer onto the inner surface does not overlap the assembling region. A second projection area defined by orthogonally projecting the sensing region onto the inner surface along the predetermined direction does not overlap the first projection area and is located inside of the first projection area.Type: GrantFiled: April 7, 2022Date of Patent: September 3, 2024Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Chien-Chen Lee, Li-Chun Hung
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Publication number: 20240282727Abstract: A power chip packaging structure includes: a ceramic substrate; a first and a second top metal layers are formed on the ceramic substrate; a bottom metal layer formed on the ceramic substrate; a power chip having an active surface and a chip back surface. The active surface has a contact pad, and the chip back surface is connected to the first top metal layer. One or more first copper layers are formed on the contact pad, a top surface of the first copper layer has a peripheral region and an arrangement region surrounded by the peripheral region. Multiple second copper layers are formed in the arrangement region and separated from each other. Each of multiple wires is respectively connected to the second copper layer with one end and connected to the second top metal layer with the other end.Type: ApplicationFiled: June 14, 2023Publication date: August 22, 2024Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Chung-Hsiao Lien, Wei-Ming Lu, Jia-Yi Wu, Zzu-Chi Chiu
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Publication number: 20240284592Abstract: A printed circuit board (PCB) is disclosed. The PCB includes a substrate having a plurality of through holes, a plurality of thermally-conductive blocks disposed in the through holes respectively, bonding structures respectively disposed in each through holes, and a metal circuit formed on the substrate. Particularly, the thermally-conductive block is tightly attached to the inner wall of the through hole through the bonding structure. In brief, the bonding structure includes a metal block and metal layers coated on both surfaces of the metal block to replace the conventional adhesive layer made of epoxy resin to tightly fix the thermally-conductive block in the through hole.Type: ApplicationFiled: May 24, 2023Publication date: August 22, 2024Applicant: Tong Hsing Electronic Industries, Ltd.Inventors: CHENG-YU CHEN, SHIH-HAN WU, JHIH-WEI LAI, JIAN-YU SHIH, MING-YEN PAN
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Patent number: 12027545Abstract: A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically coupling the sensor chip to the substrate, a supporting colloid layer disposed on the substrate, and a light-permeable sheet that is disposed on the supporting colloid layer. The substrate has a first board surface and a second board surface that is opposite to the first board surface. The substrate has a chip-accommodating slot recessed in the first board surface. The sensor chip is disposed in the chip-accommodating slot, and a gap distance between a top surface of the sensor chip and the first board surface is less than or equal to 10 ?m. The supporting colloid layer is ring-shaped and is disposed on the first board surface, and each of the wires is at least partially embedded in the supporting colloid layer.Type: GrantFiled: December 22, 2021Date of Patent: July 2, 2024Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Jui-Hung Hsu, Chien-Chen Lee
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Publication number: 20240204018Abstract: A chip packaging structure is provided. The chip packaging structure includes a first substrate, an image sensing chip, a supporting member, a second substrate, a grating film, and an encapsulant. The image sensing chip is disposed on an upper surface of the first substrate and has an image sensing region. The supporting member is disposed on an upper surface of the image sensing chip and surrounds the image sensing region. The second substrate is disposed on an upper surface of the supporting member. The grating film is disposed on a peripheral region of the second substrate and includes a plurality of grating units. The encapsulant is attached to the upper surface of the first substrate, a side surface of the supporting member, and a side surface of the second substrate.Type: ApplicationFiled: March 7, 2023Publication date: June 20, 2024Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Jui-Hung Hsu, Li-Chun Hung, Chien-Chen Lee
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Patent number: 11984516Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.Type: GrantFiled: February 16, 2023Date of Patent: May 14, 2024Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, Chien-Chen Lee, Ya-Han Chang, Li-Chun Hung
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Patent number: 11967652Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.Type: GrantFiled: February 16, 2023Date of Patent: April 23, 2024Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, Chien-Chen Lee, Ya-Han Chang, Li-Chun Hung
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Publication number: 20240088179Abstract: A chip packaging structure and a chip packaging method are provided. The chip packaging structure includes a first substrate, an image sensing chip, a supporting member, a second substrate, and an encapsulant. The image sensing chip is disposed on an upper surface of the first substrate, and the image sensing chip has an image sensing region. The supporting member is disposed on an upper surface of the image sensing chip and surrounds the image sensing region. The supporting member is formed by stacking microstructures with each other, so that the supporting member has pores. The second substrate is disposed on an upper surface of the supporting member, and the second substrate, the supporting member, and the image sensing chip define an air cavity. The encapsulant is attached to the upper surface of the first substrate and a side surface of the second substrate and filled into the pores.Type: ApplicationFiled: October 18, 2022Publication date: March 14, 2024Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: You-Wei Chang, Chien-Chen Lee, Li-Chun Hung
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Patent number: 11792497Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The circuit board has a chip-receiving slot recessed in the surface thereof. The sensor chip is arranged in the chip-receiving slot, and a top surface of the sensor chip and the surface of the circuit board have a step difference therebetween that is less than or equal to 10 ?m. The supporting adhesive layer is in a ringed shape and is disposed on the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.Type: GrantFiled: February 9, 2022Date of Patent: October 17, 2023Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Chia-Shuai Chang, Chien-Chen Lee, Jui-Hung Hsu
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Patent number: 11776975Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically coupled to the substrate and the sensor chip, a light-permeable layer, and a colloid formed on the substrate to fix the light-permeable layer. The colloid covers the wires, a peripheral portion of the sensor chip, and lateral surfaces of the light-permeable layer. A top curved surface of the colloid is partially arranged beside the lateral surfaces. In a cross section of the sensor package structure, the top curved surface has a reference point spaced apart from one of the lateral surfaces adjacent thereto by 100 ?m, a top edge of the top curved surface and the reference point define a connection line, and the connection line and the one of the lateral surfaces have an acute angle within a range from 25 degrees to 36 degrees.Type: GrantFiled: September 8, 2021Date of Patent: October 3, 2023Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Chien-Chen Lee, Jui-Hung Hsu, Ya-Han Chang
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Patent number: 11764240Abstract: An image sensing chip package structure includes a chip, an adhesive loop and a light-transmissible substrate member. The chip includes an image sensing region. The adhesive loop is connected to the chip, and has an inner peripheral surface that defines a plurality of protrusions which surround the image sensing region of the chip. The light-transmissible substrate member is connected to the adhesive loop oppositely of the chip to cover the image sensing region of the chip. Methods of manufacturing the image sensing chip package structures are also provided.Type: GrantFiled: April 27, 2022Date of Patent: September 19, 2023Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventor: Chia-Shuai Chang
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Patent number: 11744010Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the surface of the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, a light-permeable sheet, and a top shielding layer. The circuit board has no slot recessed in the surface thereof. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip. The top shielding layer is formed on an outer surface of the light-permeable sheet and has an opening that is located above a sensing region of the sensor chip.Type: GrantFiled: January 11, 2022Date of Patent: August 29, 2023Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Chia-Shuai Chang, Chien-Chen Lee, Ya-Han Chang
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Patent number: 11735562Abstract: A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of electrical connection members electrically connecting the sensor chip to the substrate, a supporting adhesive layer formed on the sensor chip, and a light-permeable sheet disposed on the supporting adhesive layer. Each of the electrical connection members includes a head solder disposed on a connecting pad of the sensor chip, a wire having a first end and a second end, and a tail solder. The first end of the wire extends from the head solder so as to connect the second end onto a soldering pad of the substrate, and the wire has a first bending portion arranged adjacent to the head solder. The head solder and the first bending portion of each of the electrical connection members are embedded in the supporting adhesive layer.Type: GrantFiled: March 18, 2021Date of Patent: August 22, 2023Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Chien-Chen Lee, Chen-Pin Peng
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Patent number: 11723147Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an electronic chip assembled to the circuit board, a sensor chip, a die attach film (DAF) pre-bonded onto the sensor chip, a plurality of wires electrically coupling the electronic chip and the sensor chip to the circuit board, a supporting adhesive layer, a light-permeable sheet, and an optical module that is fixed to the circuit board for surrounding the above components. The sensor chip is adhered to the electronic chip through the DAF such that a sensing region of the sensor chip is perpendicular to a central axis of the optical module. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.Type: GrantFiled: February 8, 2022Date of Patent: August 8, 2023Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Chia-Shuai Chang, Chien-Chen Lee, Jui-Hung Hsu