Patents Assigned to Toshiba Hokuto Electronics Corporation
  • Patent number: 10910539
    Abstract: A light emitting device includes a first light transmissive supportive substrate having a first light transmissive insulator and a conductive circuitry layer provided on a surface of the first light transmissive insulator, a second light transmissive supportive substrate having a second light transmissive insulator and disposed in such a way that a surface of the second light transmissive insulator faces the conductive circuitry layer and so as to have a predetermined gap from the first light transmissive supportive substrate, a light emitting diode having a main body, and first and second electrodes provided on a surface of the main body and electrically connected to the conductive circuitry layer via a conductive bump, and laid out between the first and second light transmissive supportive substrates, and a third light transmissive insulator embedded in a space between the first light transmissive supportive substrate and the second light transmissive supportive substrate.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: February 2, 2021
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Patent number: 10884367
    Abstract: There is provided a heater according to an embodiment including a heat generating unit configured to generate heat by electric conduction; and a plurality of electrodes configured to be respectively disposed at facing side edges of the heat generating unit so as to be electrically connected to the heat generating unit and at least one side of the side edges is formed by cutting out a part thereof.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: January 5, 2021
    Assignees: TOSHIBA TEC KABUSHIKI KAISHA, TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Osamu Takagi
  • Patent number: 10879438
    Abstract: According to one embodiment, a light emitting module includes a first insulating film having optical transparency, a second insulating film arranged facing the first insulating film and having optical transparency, a conductor layer formed on the first insulating film, and a plurality of light emitting elements arranged between the first insulating film and the second insulating film and connected to the conductor layer in a first surface on one side. Each of the plurality of light emitting elements including a first electrode in which a height from a second surface opposite to the first surface is a first height and a second electrode in which a height from the second surface is a second height. The plurality of light emitting elements are arranged such that a distance between the first electrodes of adjacent light emitting elements is smaller than a distance between the second electrodes.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: December 29, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Tsuyoshi Abe
  • Patent number: 10879442
    Abstract: A light-emitting device according to embodiments of the invention includes a film having light transmissive property to visible light; a conductor layer formed on one surface of the film; and a light-emitting element having electrodes connected to the conductor layer via bumps protruding toward the film. The curvature of the film curved on the outer edge of a contact area of the conductor layer contacting the bumps is defined by a radius of a circle contacting the conductor layer at at least three points on the outer edge of the contact area, and the radius of this circle is 13 ?m or larger.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: December 29, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventors: Naoki Takojima, Yojiro Yarimizu, Tsuyoshi Abe, Kouji Tanaka
  • Patent number: 10864749
    Abstract: According to one embodiment, a thermal print head includes a heat sink; a head substrate placed on the heat sink and having a plurality of heat generating elements arranged in a primary scanning direction; a circuit board placed on the heat sink so as to be adjacent to the head substrate in an auxiliary scanning direction and provided with a connection circuit; and a control element electrically connected to the heat generating element via a first bonding wire and electrically connected to the connection circuit via a second bonding wire, in which at least one of the first bonding wire and the second bonding wire includes any of a copper wire, a copper alloy wire, and a wire mainly made of copper and coated with a metal different from copper.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: December 15, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventors: Megumi Yamauchi, Seiichi Noro, Masakatsu Doi, Tsuyoshi Yamamoto, Yoshihide Abe, Tomonori Suzuki, Yuuki Komori
  • Patent number: 10859954
    Abstract: A heater includes an insulating substrate, a heat generating section formed in the insulating substrate and including a plurality of divided regions in a longitudinal direction, temperature sensors detecting temperature of the heat generating section and a wiring pattern for power feed to the temperature sensors, each formed in a layer different from a layer in which the heat generating section is formed in the insulating substrate. The heat generating section, the temperature sensors, and the wiring pattern are layer stacked.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: December 8, 2020
    Assignees: TOSHIBA TEC KABUSHIKI KAISHA, TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Osamu Takagi
  • Patent number: 10854582
    Abstract: Disclosed is a light-emitting module including: a first insulation film having light transmissive property; a conductor layer provided on the first insulation film; a second insulation film disposed to face the first insulation film; a plurality of light-emitting elements interposed between the first insulation film and the second insulation film and have one surface on which a pair of electrodes connected to the conductor layer are provided; and a board that is connected to the first insulation film and has a circuit connected to the conductor layer.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: December 1, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Publication number: 20200298588
    Abstract: Certain embodiments provide a thermal print head including: a first heat storage layer formed on a substrate; a heat generator formed on the first heat storage layer; an electrode formed from the first heat storage layer to the substrate and electrically connected to the heat generator; and a barrier layer that covers the electrode and is formed by a CVD method.
    Type: Application
    Filed: February 18, 2020
    Publication date: September 24, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventors: Megumi YAMAUCHI, Takuji TSUNOO, Masakatsu DOI, Masanori UCHITSUBO
  • Patent number: 10777720
    Abstract: A light emitting module includes a first light transmissive insulator, a conductive circuitry layer formed on a surface of the first light transmissive insulator, a second light transmissive insulator disposed so as to face the conductive circuitry layer, a light emitting element disposed between the first light transmissive insulator and the second light transmissive insulator, and connected to the conductive circuitry layer, and a third light transmissive insulator which is disposed between the first light transmissive insulator and the second light transmissive insulator, and which is thermosetting.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: September 15, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Publication number: 20200279986
    Abstract: A light emitting device, according to the present embodiment, has a first insulator, which is transparent to light, a first conductor layer, which is provided on a surface of the first insulator, a second insulator, which is transparent to light and arranged to oppose the first conductor layer, a light emitting element, which is arranged between the first insulator and the second insulator, and connected to the first conductor layer, and a third insulator, which is transparent to light and arranged between the first insulator and the second insulator, and the contact pressure between the first conductor layer and the light emitting element is 0.02 N or greater, up to 6 N.
    Type: Application
    Filed: February 27, 2020
    Publication date: September 3, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Akira ISHIGAI
  • Publication number: 20200279983
    Abstract: A light emitting device, according to the present embodiment, has a first insulator, which is transparent to light, a first conductor layer, which is provided on a surface of the first insulator, a second insulator, which is transparent to light and arranged to oppose the first conductor layer, a light emitting element, which is arranged between the first insulator and the second insulator, and connected to the first conductor layer, and a third insulator, which is transparent to light and arranged between the first insulator and the second insulator, and the tensile storage elastic modulus of the third insulator is 1.0×109 Pa or greater, up to 1.0×1010 Pa, at 0° C., and 1.0×106 Pa or greater, up to 6.0×108 Pa, at 130° C.
    Type: Application
    Filed: February 27, 2020
    Publication date: September 3, 2020
    Applicant: Toshiba Hokuto Electronics Corporation
    Inventors: Naoki Takojima, Fumio Ueno
  • Publication number: 20200249607
    Abstract: A heater includes an insulator substrate, a heat generating section in which a plurality of divided regions are formed in a longitudinal direction on a first surface of the insulator substrate, electrodes formed at both end portions of the heat generating section to correspond to the plurality of divided regions, and electric conductors connected to at least one of the electrodes and formed over a surface different from the first surface of the insulator substrate.
    Type: Application
    Filed: March 10, 2020
    Publication date: August 6, 2020
    Applicants: TOSHIBA TEC KABUSHIKI KAISHA, TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Osamu TAKAGI
  • Publication number: 20200251630
    Abstract: A light-emitting device includes a pair of light-transmissive insulator sheets disposed opposite to each other and two types of light-transmissive electroconductive layers disposed on a common one of or separately on one and the other of the pair of light-transmissive insulator sheets, and at least one light-emitting semiconductor each provided with a cathode and an anode which are individually and electrically connected to the two types of the light-transmissive electroconductive layers. The electrical connection and mechanical bonding between the members are improved by a light-transmissive elastomer which is between the pair of light-transmissive insulator sheets. A method in which a light-emitting semiconductor element and a light-transmissive electroconductive member are subjected to vacuum hot-pressing.
    Type: Application
    Filed: April 22, 2020
    Publication date: August 6, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Keiichi MAKI
  • Patent number: 10734365
    Abstract: A light-emitting device according to an embodiment includes a light-emitting part and an external wiring. The light-emitting part includes: a pair of insulating substrates that has light transmissive property and flexibility; a plurality of light-emitting elements arranged between the pair of insulating substrates; an internal wiring pattern that is provided between the pair of insulating substrates, and is connected to the light-emitting elements; and a resin layer that has light transmissive property and insulating property, and is provided between the pair of insulating substrates. An end of the external wiring is divided into a plurality of wirings having a line width that is narrower than a line width of the internal wiring pattern. An end of the internal wiring pattern is bonded, at an end of the insulating substrates, to the end of the external wiring that is divided into a plurality of wirings by an anisotropic conductive adhesive.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: August 4, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Patent number: 10707192
    Abstract: A light emitting panel according to this embodiment includes a plurality of light emitting modules, and the plurality of light emitting modules each include: a first insulation film that is light transmissive; a second insulation film which is disposed so as to face the first insulation film, and which is light transmissive; a conductive layer formed on at least either one of the first insulation film or the second insulation film; and a plurality of light emitting elements which is disposed between the first insulation film and the second insulation film, is disposed so as to form a predetermined pattern, and is connected to the conductive layer.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: July 7, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Tomotsugu Jingi
  • Patent number: 10688807
    Abstract: According to one embodiment, a thermal print head includes a heat sink, a head substrate having a plurality of heat generating elements placed on the heat sink and disposed in a primary scanning direction, a circuit board placed on the heat sink so as to be adjacent to the head substrate in an auxiliary scanning direction and provided with a connection circuit, and a control element electrically connected to the heat generating element via a first bonding wire and electrically connected to the connection circuit via a second bonding wire, wherein a plurality of first bonding wires is disposed in parallel in the primary scanning direction, and among the first bonding wires, the first bonding wire having a length of at least 2 mm or more is a metal wire having a Young's modulus greater than that of gold.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: June 23, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventors: Megumi Yamauchi, Seiichi Noro, Masakatsu Doi, Yoshihide Abe, Tomonori Suzuki, Yuuki Komori, Tsuyoshi Yamamoto
  • Publication number: 20200194645
    Abstract: A light emitting device, according to the present embodiment, has a light emitting panel, a flexible wiring substrate, a mold resin and a protective tape. The light emitting panel has a first substrate, which is transparent to light, a plurality of conductor patterns, which are formed on a surface of the first substrate, a plurality of light emitting elements, which are connected to any of the conductor patterns, and a resin layer, which holds the light emitting elements on the first substrate. The flexible wiring substrate has a circuit pattern that is electrically connected with an exposed part of the conductor patterns. The mold resin covers the exposed part of the conductor patterns and an exposed part of the circuit pattern. The protective tape covers the mold resin, and is wound around a joint part of the light emitting panel and the flexible wiring substrate.
    Type: Application
    Filed: December 13, 2019
    Publication date: June 18, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventors: Naoki TAKOJIMA, Kairi Makita, Fumio Ueno
  • Publication number: 20200168588
    Abstract: A light emitting module according to an embodiment includes a first insulation film and a second insulation film with a light transmissivity, a plurality of first double-sided light emitting elements disposed between the first insulation film and the second insulation film, and each including a pair of electrodes on one surface, a plurality of second double-sided light emitting elements disposed between the first insulation film and the second insulation film adjacent to the respective first double-sided light emitting elements, each including a pair of electrodes on one surface, and emitting different light from the first double-sided light emitting element.
    Type: Application
    Filed: December 30, 2019
    Publication date: May 28, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Keiichi MAKI
  • Publication number: 20200154564
    Abstract: A light-emitting module according to an embodiment includes a first insulating film with light transmissive property, a plurality of mesh patterns including a plurality of first line patterns and a plurality of second line patterns, a light-emitting element, and a resin layer. The first line patterns are formed on the first insulating film and are parallel to one another. The second line patterns intersect with the first line patterns and are parallel to one another. The light-emitting element is connected to any two of a plurality of the mesh patterns. The resin layer holds the light-emitting element to the first insulating film. A first mesh pattern and a second mesh pattern adjacent to one another among the plurality of mesh patterns have a boundary. Line patterns projecting from the first mesh pattern to the boundary and line patterns projecting from the second mesh pattern to the boundary are collocated along the boundary in a state of being adjacent to one another.
    Type: Application
    Filed: January 9, 2020
    Publication date: May 14, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Keiichi MAKI
  • Publication number: 20200136000
    Abstract: A light transmissive first insulating film having light transmissive property to visible light, a second insulating film arranged opposite to the first insulating film, a plurality of conductor patterns formed of, for example, mesh patterns having the light transmissive property to the visible light and formed on a surface of at least one of the first insulating film and the second insulating film, a plurality of first light-emitting devices connected to any two conductor patterns of the plurality of conductor patterns, and a resin layer arranged between the first insulating film and the second insulating film to hold the first light-emitting devices are included.
    Type: Application
    Filed: December 24, 2019
    Publication date: April 30, 2020
    Applicant: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi MAKI