Patents Assigned to Toshiba Hokuto Electronics Corporation
  • Publication number: 20220045251
    Abstract: A light emitting device, according to the present embodiment, has a light emitting panel, a flexible wiring substrate, a mold resin and a protective tape. The light emitting panel has a first substrate, which is transparent to light, a plurality of conductor patterns, which are formed on a surface of the first substrate, a plurality of light emitting elements, which are connected to any of the conductor patterns, and a resin layer, which holds the light emitting elements on the first substrate. The flexible wiring substrate has a circuit pattern that is electrically connected with an exposed part of the conductor patterns. The mold resin covers the exposed part of the conductor patterns and an exposed part of the circuit pattern. The protective tape covers the mold resin, and is wound around a joint part of the light emitting panel and the flexible wiring substrate.
    Type: Application
    Filed: October 27, 2021
    Publication date: February 10, 2022
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventors: Naoki TAKOJIMA, Kairi MAKITA, Fumio UENO
  • Patent number: 11189768
    Abstract: A light emitting device, according to the present embodiment, has a light emitting panel, a flexible wiring substrate, a mold resin and a protective tape. The light emitting panel has a first substrate, which is transparent to light, a plurality of conductor patterns, which are formed on a surface of the first substrate, a plurality of light emitting elements, which are connected to any of the conductor patterns, and a resin layer, which holds the light emitting elements on the first substrate. The flexible wiring substrate has a circuit pattern that is electrically connected with an exposed part of the conductor patterns. The mold resin covers the exposed part of the conductor patterns and an exposed part of the circuit pattern. The protective tape covers the mold resin, and is wound around a joint part of the light emitting panel and the flexible wiring substrate.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: November 30, 2021
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventors: Naoki Takojima, Kairi Makita, Fumio Ueno
  • Patent number: 11094859
    Abstract: Disclosed is a light emitting apparatus including: a first substrate having light transmissive property and flexibility with a conductive layer; a second substrate having light transmissive property and flexibility and arranged to face the first substrate; a plurality of light emitting elements including an electrode connected to the conductive layer and arranged between the first and second substrates; and a resin layer having light transmissive property and flexibility and arranged between the first and second substrates to hold the plurality of light emitting elements. A temperature for a maximum mechanical loss tangent tan ? in dynamic viscoelasticity of the resin layer is 117° C. or higher.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: August 17, 2021
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventors: Naoki Takojima, Yojiro Yarimizu, Tsuyoshi Abe
  • Publication number: 20210207791
    Abstract: A decoration device according to this embodiment is a decoration device decorating an object used indoors, including: a light emitting device having light transmittivity and flexibility, including a plurality of light emitting elements emitting light from one surface and the other surface, and being arranged on one side of the object, in which a distance between the object and the light emitting device when an indoor light is turned off is less than or equal to 90 cm.
    Type: Application
    Filed: March 25, 2021
    Publication date: July 8, 2021
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventors: Koichi MATSUSHITA, Takamasa OOTAKE
  • Patent number: 11029003
    Abstract: A decoration device according to this embodiment is a decoration device decorating an object used indoors, including: a light emitting device having light transmittivity and flexibility, including a plurality of light emitting elements emitting light from one surface and the other surface, and being arranged on one side of the object, in which a distance between the object and the light emitting device when an indoor light is turned off is less than or equal to 90 cm.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: June 8, 2021
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventors: Koichi Matsushita, Takamasa Ootake
  • Patent number: 10991866
    Abstract: A light emitting module according to an embodiment includes a first insulation film and a second insulation film with a light transmissivity, a plurality of first double-sided light emitting elements disposed between the first insulation film and the second insulation film, and each including a pair of electrodes on one surface, a plurality of second double-sided light emitting elements disposed between the first insulation film and the second insulation film adjacent to the respective first double-sided light emitting elements, each including a pair of electrodes on one surface, and emitting different light from the first double-sided light emitting element.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: April 27, 2021
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Patent number: 10985144
    Abstract: Disclosed is a light emitting apparatus including: first and second substrates having light transmissive property and flexibility arranged to face each other; a plurality of light emitting element groups arranged along a predetermined straight line between the first and second substrates and each of the light emitting element groups includes a first light emitting element and a second light emitting element; and a conductor pattern formed on the first substrate and including respective individual line patterns individually connected to the first and second light emitting elements and a common line pattern commonly connected to the first and second light emitting elements. The individual line patterns are routed to one side and the other side of the straight line centered on at least a part of the common line pattern.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: April 20, 2021
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Tomotsugu Jingi
  • Publication number: 20210066261
    Abstract: A light-emitting device according to an embodiment is provided with: a light-emitting panel including a first board that is light transmissive and flexible, a plurality of conductor patterns formed on a surface of the first board, a plurality of light-emitting elements connected to one of the conductor patterns, and a second board that is light transmissive and flexible and that holds the light-emitting elements relative to the first board; and a flexible wiring board including a circuit pattern that is electrically connected via an anisotropic conductive layer to an exposed part of the conductor patterns formed on the first board, the exposed part being exposed by the end of the second board.
    Type: Application
    Filed: August 10, 2020
    Publication date: March 4, 2021
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventors: Kairi MAKITA, Fumio UENO
  • Patent number: 10910539
    Abstract: A light emitting device includes a first light transmissive supportive substrate having a first light transmissive insulator and a conductive circuitry layer provided on a surface of the first light transmissive insulator, a second light transmissive supportive substrate having a second light transmissive insulator and disposed in such a way that a surface of the second light transmissive insulator faces the conductive circuitry layer and so as to have a predetermined gap from the first light transmissive supportive substrate, a light emitting diode having a main body, and first and second electrodes provided on a surface of the main body and electrically connected to the conductive circuitry layer via a conductive bump, and laid out between the first and second light transmissive supportive substrates, and a third light transmissive insulator embedded in a space between the first light transmissive supportive substrate and the second light transmissive supportive substrate.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: February 2, 2021
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Patent number: 10884367
    Abstract: There is provided a heater according to an embodiment including a heat generating unit configured to generate heat by electric conduction; and a plurality of electrodes configured to be respectively disposed at facing side edges of the heat generating unit so as to be electrically connected to the heat generating unit and at least one side of the side edges is formed by cutting out a part thereof.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: January 5, 2021
    Assignees: TOSHIBA TEC KABUSHIKI KAISHA, TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Osamu Takagi
  • Patent number: 10879438
    Abstract: According to one embodiment, a light emitting module includes a first insulating film having optical transparency, a second insulating film arranged facing the first insulating film and having optical transparency, a conductor layer formed on the first insulating film, and a plurality of light emitting elements arranged between the first insulating film and the second insulating film and connected to the conductor layer in a first surface on one side. Each of the plurality of light emitting elements including a first electrode in which a height from a second surface opposite to the first surface is a first height and a second electrode in which a height from the second surface is a second height. The plurality of light emitting elements are arranged such that a distance between the first electrodes of adjacent light emitting elements is smaller than a distance between the second electrodes.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: December 29, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Tsuyoshi Abe
  • Patent number: 10879442
    Abstract: A light-emitting device according to embodiments of the invention includes a film having light transmissive property to visible light; a conductor layer formed on one surface of the film; and a light-emitting element having electrodes connected to the conductor layer via bumps protruding toward the film. The curvature of the film curved on the outer edge of a contact area of the conductor layer contacting the bumps is defined by a radius of a circle contacting the conductor layer at at least three points on the outer edge of the contact area, and the radius of this circle is 13 ?m or larger.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: December 29, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventors: Naoki Takojima, Yojiro Yarimizu, Tsuyoshi Abe, Kouji Tanaka
  • Patent number: 10864749
    Abstract: According to one embodiment, a thermal print head includes a heat sink; a head substrate placed on the heat sink and having a plurality of heat generating elements arranged in a primary scanning direction; a circuit board placed on the heat sink so as to be adjacent to the head substrate in an auxiliary scanning direction and provided with a connection circuit; and a control element electrically connected to the heat generating element via a first bonding wire and electrically connected to the connection circuit via a second bonding wire, in which at least one of the first bonding wire and the second bonding wire includes any of a copper wire, a copper alloy wire, and a wire mainly made of copper and coated with a metal different from copper.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: December 15, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventors: Megumi Yamauchi, Seiichi Noro, Masakatsu Doi, Tsuyoshi Yamamoto, Yoshihide Abe, Tomonori Suzuki, Yuuki Komori
  • Patent number: 10859954
    Abstract: A heater includes an insulating substrate, a heat generating section formed in the insulating substrate and including a plurality of divided regions in a longitudinal direction, temperature sensors detecting temperature of the heat generating section and a wiring pattern for power feed to the temperature sensors, each formed in a layer different from a layer in which the heat generating section is formed in the insulating substrate. The heat generating section, the temperature sensors, and the wiring pattern are layer stacked.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: December 8, 2020
    Assignees: TOSHIBA TEC KABUSHIKI KAISHA, TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Osamu Takagi
  • Patent number: 10854582
    Abstract: Disclosed is a light-emitting module including: a first insulation film having light transmissive property; a conductor layer provided on the first insulation film; a second insulation film disposed to face the first insulation film; a plurality of light-emitting elements interposed between the first insulation film and the second insulation film and have one surface on which a pair of electrodes connected to the conductor layer are provided; and a board that is connected to the first insulation film and has a circuit connected to the conductor layer.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: December 1, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Publication number: 20200298588
    Abstract: Certain embodiments provide a thermal print head including: a first heat storage layer formed on a substrate; a heat generator formed on the first heat storage layer; an electrode formed from the first heat storage layer to the substrate and electrically connected to the heat generator; and a barrier layer that covers the electrode and is formed by a CVD method.
    Type: Application
    Filed: February 18, 2020
    Publication date: September 24, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventors: Megumi YAMAUCHI, Takuji TSUNOO, Masakatsu DOI, Masanori UCHITSUBO
  • Patent number: 10777720
    Abstract: A light emitting module includes a first light transmissive insulator, a conductive circuitry layer formed on a surface of the first light transmissive insulator, a second light transmissive insulator disposed so as to face the conductive circuitry layer, a light emitting element disposed between the first light transmissive insulator and the second light transmissive insulator, and connected to the conductive circuitry layer, and a third light transmissive insulator which is disposed between the first light transmissive insulator and the second light transmissive insulator, and which is thermosetting.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: September 15, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Publication number: 20200279983
    Abstract: A light emitting device, according to the present embodiment, has a first insulator, which is transparent to light, a first conductor layer, which is provided on a surface of the first insulator, a second insulator, which is transparent to light and arranged to oppose the first conductor layer, a light emitting element, which is arranged between the first insulator and the second insulator, and connected to the first conductor layer, and a third insulator, which is transparent to light and arranged between the first insulator and the second insulator, and the tensile storage elastic modulus of the third insulator is 1.0×109 Pa or greater, up to 1.0×1010 Pa, at 0° C., and 1.0×106 Pa or greater, up to 6.0×108 Pa, at 130° C.
    Type: Application
    Filed: February 27, 2020
    Publication date: September 3, 2020
    Applicant: Toshiba Hokuto Electronics Corporation
    Inventors: Naoki Takojima, Fumio Ueno
  • Publication number: 20200279986
    Abstract: A light emitting device, according to the present embodiment, has a first insulator, which is transparent to light, a first conductor layer, which is provided on a surface of the first insulator, a second insulator, which is transparent to light and arranged to oppose the first conductor layer, a light emitting element, which is arranged between the first insulator and the second insulator, and connected to the first conductor layer, and a third insulator, which is transparent to light and arranged between the first insulator and the second insulator, and the contact pressure between the first conductor layer and the light emitting element is 0.02 N or greater, up to 6 N.
    Type: Application
    Filed: February 27, 2020
    Publication date: September 3, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Akira ISHIGAI
  • Publication number: 20200249607
    Abstract: A heater includes an insulator substrate, a heat generating section in which a plurality of divided regions are formed in a longitudinal direction on a first surface of the insulator substrate, electrodes formed at both end portions of the heat generating section to correspond to the plurality of divided regions, and electric conductors connected to at least one of the electrodes and formed over a surface different from the first surface of the insulator substrate.
    Type: Application
    Filed: March 10, 2020
    Publication date: August 6, 2020
    Applicants: TOSHIBA TEC KABUSHIKI KAISHA, TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Osamu TAKAGI