Patents Assigned to Toshiba Hokuto Electronics Corporation
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Publication number: 20220045251Abstract: A light emitting device, according to the present embodiment, has a light emitting panel, a flexible wiring substrate, a mold resin and a protective tape. The light emitting panel has a first substrate, which is transparent to light, a plurality of conductor patterns, which are formed on a surface of the first substrate, a plurality of light emitting elements, which are connected to any of the conductor patterns, and a resin layer, which holds the light emitting elements on the first substrate. The flexible wiring substrate has a circuit pattern that is electrically connected with an exposed part of the conductor patterns. The mold resin covers the exposed part of the conductor patterns and an exposed part of the circuit pattern. The protective tape covers the mold resin, and is wound around a joint part of the light emitting panel and the flexible wiring substrate.Type: ApplicationFiled: October 27, 2021Publication date: February 10, 2022Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATIONInventors: Naoki TAKOJIMA, Kairi MAKITA, Fumio UENO
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Patent number: 11189768Abstract: A light emitting device, according to the present embodiment, has a light emitting panel, a flexible wiring substrate, a mold resin and a protective tape. The light emitting panel has a first substrate, which is transparent to light, a plurality of conductor patterns, which are formed on a surface of the first substrate, a plurality of light emitting elements, which are connected to any of the conductor patterns, and a resin layer, which holds the light emitting elements on the first substrate. The flexible wiring substrate has a circuit pattern that is electrically connected with an exposed part of the conductor patterns. The mold resin covers the exposed part of the conductor patterns and an exposed part of the circuit pattern. The protective tape covers the mold resin, and is wound around a joint part of the light emitting panel and the flexible wiring substrate.Type: GrantFiled: December 13, 2019Date of Patent: November 30, 2021Assignee: Toshiba Hokuto Electronics CorporationInventors: Naoki Takojima, Kairi Makita, Fumio Ueno
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Patent number: 11094859Abstract: Disclosed is a light emitting apparatus including: a first substrate having light transmissive property and flexibility with a conductive layer; a second substrate having light transmissive property and flexibility and arranged to face the first substrate; a plurality of light emitting elements including an electrode connected to the conductive layer and arranged between the first and second substrates; and a resin layer having light transmissive property and flexibility and arranged between the first and second substrates to hold the plurality of light emitting elements. A temperature for a maximum mechanical loss tangent tan ? in dynamic viscoelasticity of the resin layer is 117° C. or higher.Type: GrantFiled: August 21, 2019Date of Patent: August 17, 2021Assignee: Toshiba Hokuto Electronics CorporationInventors: Naoki Takojima, Yojiro Yarimizu, Tsuyoshi Abe
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Publication number: 20210207791Abstract: A decoration device according to this embodiment is a decoration device decorating an object used indoors, including: a light emitting device having light transmittivity and flexibility, including a plurality of light emitting elements emitting light from one surface and the other surface, and being arranged on one side of the object, in which a distance between the object and the light emitting device when an indoor light is turned off is less than or equal to 90 cm.Type: ApplicationFiled: March 25, 2021Publication date: July 8, 2021Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATIONInventors: Koichi MATSUSHITA, Takamasa OOTAKE
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Patent number: 11029003Abstract: A decoration device according to this embodiment is a decoration device decorating an object used indoors, including: a light emitting device having light transmittivity and flexibility, including a plurality of light emitting elements emitting light from one surface and the other surface, and being arranged on one side of the object, in which a distance between the object and the light emitting device when an indoor light is turned off is less than or equal to 90 cm.Type: GrantFiled: July 23, 2019Date of Patent: June 8, 2021Assignee: Toshiba Hokuto Electronics CorporationInventors: Koichi Matsushita, Takamasa Ootake
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Patent number: 10991866Abstract: A light emitting module according to an embodiment includes a first insulation film and a second insulation film with a light transmissivity, a plurality of first double-sided light emitting elements disposed between the first insulation film and the second insulation film, and each including a pair of electrodes on one surface, a plurality of second double-sided light emitting elements disposed between the first insulation film and the second insulation film adjacent to the respective first double-sided light emitting elements, each including a pair of electrodes on one surface, and emitting different light from the first double-sided light emitting element.Type: GrantFiled: December 30, 2019Date of Patent: April 27, 2021Assignee: Toshiba Hokuto Electronics CorporationInventor: Keiichi Maki
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Patent number: 10985144Abstract: Disclosed is a light emitting apparatus including: first and second substrates having light transmissive property and flexibility arranged to face each other; a plurality of light emitting element groups arranged along a predetermined straight line between the first and second substrates and each of the light emitting element groups includes a first light emitting element and a second light emitting element; and a conductor pattern formed on the first substrate and including respective individual line patterns individually connected to the first and second light emitting elements and a common line pattern commonly connected to the first and second light emitting elements. The individual line patterns are routed to one side and the other side of the straight line centered on at least a part of the common line pattern.Type: GrantFiled: August 5, 2019Date of Patent: April 20, 2021Assignee: Toshiba Hokuto Electronics CorporationInventor: Tomotsugu Jingi
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Publication number: 20210066261Abstract: A light-emitting device according to an embodiment is provided with: a light-emitting panel including a first board that is light transmissive and flexible, a plurality of conductor patterns formed on a surface of the first board, a plurality of light-emitting elements connected to one of the conductor patterns, and a second board that is light transmissive and flexible and that holds the light-emitting elements relative to the first board; and a flexible wiring board including a circuit pattern that is electrically connected via an anisotropic conductive layer to an exposed part of the conductor patterns formed on the first board, the exposed part being exposed by the end of the second board.Type: ApplicationFiled: August 10, 2020Publication date: March 4, 2021Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATIONInventors: Kairi MAKITA, Fumio UENO
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Patent number: 10910539Abstract: A light emitting device includes a first light transmissive supportive substrate having a first light transmissive insulator and a conductive circuitry layer provided on a surface of the first light transmissive insulator, a second light transmissive supportive substrate having a second light transmissive insulator and disposed in such a way that a surface of the second light transmissive insulator faces the conductive circuitry layer and so as to have a predetermined gap from the first light transmissive supportive substrate, a light emitting diode having a main body, and first and second electrodes provided on a surface of the main body and electrically connected to the conductive circuitry layer via a conductive bump, and laid out between the first and second light transmissive supportive substrates, and a third light transmissive insulator embedded in a space between the first light transmissive supportive substrate and the second light transmissive supportive substrate.Type: GrantFiled: October 15, 2019Date of Patent: February 2, 2021Assignee: Toshiba Hokuto Electronics CorporationInventor: Keiichi Maki
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Patent number: 10884367Abstract: There is provided a heater according to an embodiment including a heat generating unit configured to generate heat by electric conduction; and a plurality of electrodes configured to be respectively disposed at facing side edges of the heat generating unit so as to be electrically connected to the heat generating unit and at least one side of the side edges is formed by cutting out a part thereof.Type: GrantFiled: March 3, 2020Date of Patent: January 5, 2021Assignees: TOSHIBA TEC KABUSHIKI KAISHA, TOSHIBA HOKUTO ELECTRONICS CORPORATIONInventor: Osamu Takagi
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Patent number: 10879438Abstract: According to one embodiment, a light emitting module includes a first insulating film having optical transparency, a second insulating film arranged facing the first insulating film and having optical transparency, a conductor layer formed on the first insulating film, and a plurality of light emitting elements arranged between the first insulating film and the second insulating film and connected to the conductor layer in a first surface on one side. Each of the plurality of light emitting elements including a first electrode in which a height from a second surface opposite to the first surface is a first height and a second electrode in which a height from the second surface is a second height. The plurality of light emitting elements are arranged such that a distance between the first electrodes of adjacent light emitting elements is smaller than a distance between the second electrodes.Type: GrantFiled: February 22, 2019Date of Patent: December 29, 2020Assignee: Toshiba Hokuto Electronics CorporationInventor: Tsuyoshi Abe
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Patent number: 10879442Abstract: A light-emitting device according to embodiments of the invention includes a film having light transmissive property to visible light; a conductor layer formed on one surface of the film; and a light-emitting element having electrodes connected to the conductor layer via bumps protruding toward the film. The curvature of the film curved on the outer edge of a contact area of the conductor layer contacting the bumps is defined by a radius of a circle contacting the conductor layer at at least three points on the outer edge of the contact area, and the radius of this circle is 13 ?m or larger.Type: GrantFiled: February 21, 2019Date of Patent: December 29, 2020Assignee: Toshiba Hokuto Electronics CorporationInventors: Naoki Takojima, Yojiro Yarimizu, Tsuyoshi Abe, Kouji Tanaka
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Patent number: 10864749Abstract: According to one embodiment, a thermal print head includes a heat sink; a head substrate placed on the heat sink and having a plurality of heat generating elements arranged in a primary scanning direction; a circuit board placed on the heat sink so as to be adjacent to the head substrate in an auxiliary scanning direction and provided with a connection circuit; and a control element electrically connected to the heat generating element via a first bonding wire and electrically connected to the connection circuit via a second bonding wire, in which at least one of the first bonding wire and the second bonding wire includes any of a copper wire, a copper alloy wire, and a wire mainly made of copper and coated with a metal different from copper.Type: GrantFiled: December 7, 2018Date of Patent: December 15, 2020Assignee: Toshiba Hokuto Electronics CorporationInventors: Megumi Yamauchi, Seiichi Noro, Masakatsu Doi, Tsuyoshi Yamamoto, Yoshihide Abe, Tomonori Suzuki, Yuuki Komori
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Patent number: 10859954Abstract: A heater includes an insulating substrate, a heat generating section formed in the insulating substrate and including a plurality of divided regions in a longitudinal direction, temperature sensors detecting temperature of the heat generating section and a wiring pattern for power feed to the temperature sensors, each formed in a layer different from a layer in which the heat generating section is formed in the insulating substrate. The heat generating section, the temperature sensors, and the wiring pattern are layer stacked.Type: GrantFiled: December 2, 2019Date of Patent: December 8, 2020Assignees: TOSHIBA TEC KABUSHIKI KAISHA, TOSHIBA HOKUTO ELECTRONICS CORPORATIONInventor: Osamu Takagi
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Patent number: 10854582Abstract: Disclosed is a light-emitting module including: a first insulation film having light transmissive property; a conductor layer provided on the first insulation film; a second insulation film disposed to face the first insulation film; a plurality of light-emitting elements interposed between the first insulation film and the second insulation film and have one surface on which a pair of electrodes connected to the conductor layer are provided; and a board that is connected to the first insulation film and has a circuit connected to the conductor layer.Type: GrantFiled: June 19, 2018Date of Patent: December 1, 2020Assignee: Toshiba Hokuto Electronics CorporationInventor: Keiichi Maki
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Publication number: 20200298588Abstract: Certain embodiments provide a thermal print head including: a first heat storage layer formed on a substrate; a heat generator formed on the first heat storage layer; an electrode formed from the first heat storage layer to the substrate and electrically connected to the heat generator; and a barrier layer that covers the electrode and is formed by a CVD method.Type: ApplicationFiled: February 18, 2020Publication date: September 24, 2020Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATIONInventors: Megumi YAMAUCHI, Takuji TSUNOO, Masakatsu DOI, Masanori UCHITSUBO
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Patent number: 10777720Abstract: A light emitting module includes a first light transmissive insulator, a conductive circuitry layer formed on a surface of the first light transmissive insulator, a second light transmissive insulator disposed so as to face the conductive circuitry layer, a light emitting element disposed between the first light transmissive insulator and the second light transmissive insulator, and connected to the conductive circuitry layer, and a third light transmissive insulator which is disposed between the first light transmissive insulator and the second light transmissive insulator, and which is thermosetting.Type: GrantFiled: April 23, 2019Date of Patent: September 15, 2020Assignee: Toshiba Hokuto Electronics CorporationInventor: Keiichi Maki
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Publication number: 20200279983Abstract: A light emitting device, according to the present embodiment, has a first insulator, which is transparent to light, a first conductor layer, which is provided on a surface of the first insulator, a second insulator, which is transparent to light and arranged to oppose the first conductor layer, a light emitting element, which is arranged between the first insulator and the second insulator, and connected to the first conductor layer, and a third insulator, which is transparent to light and arranged between the first insulator and the second insulator, and the tensile storage elastic modulus of the third insulator is 1.0×109 Pa or greater, up to 1.0×1010 Pa, at 0° C., and 1.0×106 Pa or greater, up to 6.0×108 Pa, at 130° C.Type: ApplicationFiled: February 27, 2020Publication date: September 3, 2020Applicant: Toshiba Hokuto Electronics CorporationInventors: Naoki Takojima, Fumio Ueno
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Publication number: 20200279986Abstract: A light emitting device, according to the present embodiment, has a first insulator, which is transparent to light, a first conductor layer, which is provided on a surface of the first insulator, a second insulator, which is transparent to light and arranged to oppose the first conductor layer, a light emitting element, which is arranged between the first insulator and the second insulator, and connected to the first conductor layer, and a third insulator, which is transparent to light and arranged between the first insulator and the second insulator, and the contact pressure between the first conductor layer and the light emitting element is 0.02 N or greater, up to 6 N.Type: ApplicationFiled: February 27, 2020Publication date: September 3, 2020Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATIONInventor: Akira ISHIGAI
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Publication number: 20200249607Abstract: A heater includes an insulator substrate, a heat generating section in which a plurality of divided regions are formed in a longitudinal direction on a first surface of the insulator substrate, electrodes formed at both end portions of the heat generating section to correspond to the plurality of divided regions, and electric conductors connected to at least one of the electrodes and formed over a surface different from the first surface of the insulator substrate.Type: ApplicationFiled: March 10, 2020Publication date: August 6, 2020Applicants: TOSHIBA TEC KABUSHIKI KAISHA, TOSHIBA HOKUTO ELECTRONICS CORPORATIONInventor: Osamu TAKAGI