Patents Assigned to Toshiba Hokuto Electronics Corporation
  • Publication number: 20200251630
    Abstract: A light-emitting device includes a pair of light-transmissive insulator sheets disposed opposite to each other and two types of light-transmissive electroconductive layers disposed on a common one of or separately on one and the other of the pair of light-transmissive insulator sheets, and at least one light-emitting semiconductor each provided with a cathode and an anode which are individually and electrically connected to the two types of the light-transmissive electroconductive layers. The electrical connection and mechanical bonding between the members are improved by a light-transmissive elastomer which is between the pair of light-transmissive insulator sheets. A method in which a light-emitting semiconductor element and a light-transmissive electroconductive member are subjected to vacuum hot-pressing.
    Type: Application
    Filed: April 22, 2020
    Publication date: August 6, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Keiichi MAKI
  • Patent number: 10734365
    Abstract: A light-emitting device according to an embodiment includes a light-emitting part and an external wiring. The light-emitting part includes: a pair of insulating substrates that has light transmissive property and flexibility; a plurality of light-emitting elements arranged between the pair of insulating substrates; an internal wiring pattern that is provided between the pair of insulating substrates, and is connected to the light-emitting elements; and a resin layer that has light transmissive property and insulating property, and is provided between the pair of insulating substrates. An end of the external wiring is divided into a plurality of wirings having a line width that is narrower than a line width of the internal wiring pattern. An end of the internal wiring pattern is bonded, at an end of the insulating substrates, to the end of the external wiring that is divided into a plurality of wirings by an anisotropic conductive adhesive.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: August 4, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Patent number: 10707192
    Abstract: A light emitting panel according to this embodiment includes a plurality of light emitting modules, and the plurality of light emitting modules each include: a first insulation film that is light transmissive; a second insulation film which is disposed so as to face the first insulation film, and which is light transmissive; a conductive layer formed on at least either one of the first insulation film or the second insulation film; and a plurality of light emitting elements which is disposed between the first insulation film and the second insulation film, is disposed so as to form a predetermined pattern, and is connected to the conductive layer.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: July 7, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Tomotsugu Jingi
  • Patent number: 10688807
    Abstract: According to one embodiment, a thermal print head includes a heat sink, a head substrate having a plurality of heat generating elements placed on the heat sink and disposed in a primary scanning direction, a circuit board placed on the heat sink so as to be adjacent to the head substrate in an auxiliary scanning direction and provided with a connection circuit, and a control element electrically connected to the heat generating element via a first bonding wire and electrically connected to the connection circuit via a second bonding wire, wherein a plurality of first bonding wires is disposed in parallel in the primary scanning direction, and among the first bonding wires, the first bonding wire having a length of at least 2 mm or more is a metal wire having a Young's modulus greater than that of gold.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: June 23, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventors: Megumi Yamauchi, Seiichi Noro, Masakatsu Doi, Yoshihide Abe, Tomonori Suzuki, Yuuki Komori, Tsuyoshi Yamamoto
  • Publication number: 20200194645
    Abstract: A light emitting device, according to the present embodiment, has a light emitting panel, a flexible wiring substrate, a mold resin and a protective tape. The light emitting panel has a first substrate, which is transparent to light, a plurality of conductor patterns, which are formed on a surface of the first substrate, a plurality of light emitting elements, which are connected to any of the conductor patterns, and a resin layer, which holds the light emitting elements on the first substrate. The flexible wiring substrate has a circuit pattern that is electrically connected with an exposed part of the conductor patterns. The mold resin covers the exposed part of the conductor patterns and an exposed part of the circuit pattern. The protective tape covers the mold resin, and is wound around a joint part of the light emitting panel and the flexible wiring substrate.
    Type: Application
    Filed: December 13, 2019
    Publication date: June 18, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventors: Naoki TAKOJIMA, Kairi Makita, Fumio Ueno
  • Publication number: 20200168588
    Abstract: A light emitting module according to an embodiment includes a first insulation film and a second insulation film with a light transmissivity, a plurality of first double-sided light emitting elements disposed between the first insulation film and the second insulation film, and each including a pair of electrodes on one surface, a plurality of second double-sided light emitting elements disposed between the first insulation film and the second insulation film adjacent to the respective first double-sided light emitting elements, each including a pair of electrodes on one surface, and emitting different light from the first double-sided light emitting element.
    Type: Application
    Filed: December 30, 2019
    Publication date: May 28, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Keiichi MAKI
  • Publication number: 20200154564
    Abstract: A light-emitting module according to an embodiment includes a first insulating film with light transmissive property, a plurality of mesh patterns including a plurality of first line patterns and a plurality of second line patterns, a light-emitting element, and a resin layer. The first line patterns are formed on the first insulating film and are parallel to one another. The second line patterns intersect with the first line patterns and are parallel to one another. The light-emitting element is connected to any two of a plurality of the mesh patterns. The resin layer holds the light-emitting element to the first insulating film. A first mesh pattern and a second mesh pattern adjacent to one another among the plurality of mesh patterns have a boundary. Line patterns projecting from the first mesh pattern to the boundary and line patterns projecting from the second mesh pattern to the boundary are collocated along the boundary in a state of being adjacent to one another.
    Type: Application
    Filed: January 9, 2020
    Publication date: May 14, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Keiichi MAKI
  • Publication number: 20200136000
    Abstract: A light transmissive first insulating film having light transmissive property to visible light, a second insulating film arranged opposite to the first insulating film, a plurality of conductor patterns formed of, for example, mesh patterns having the light transmissive property to the visible light and formed on a surface of at least one of the first insulating film and the second insulating film, a plurality of first light-emitting devices connected to any two conductor patterns of the plurality of conductor patterns, and a resin layer arranged between the first insulating film and the second insulating film to hold the first light-emitting devices are included.
    Type: Application
    Filed: December 24, 2019
    Publication date: April 30, 2020
    Applicant: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi MAKI
  • Patent number: 10629570
    Abstract: A light emitting module according to an embodiment includes a first insulation film with a light transmissivity, a second insulation film disposed so as to face the first insulation film, a first double-sided light emitting element disposed between the first insulation film and the second insulation film, and comprising an electrode, a second double-sided light emitting element disposed between the first insulation film and the second insulation film adjacent to the first double-sided light emitting element, comprising an electrode, and emitting different light from the first double-sided light emitting element, and a conductor pattern formed on a surface of the first insulation film, and connected to the respective electrodes of the first double-sided light emitting element and the second double-sided light emitting element.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: April 21, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Patent number: 10620573
    Abstract: There is provided a heater according to an embodiment including a heat generating unit configured to generate heat by electric conduction; and a plurality of electrodes configured to be respectively disposed at facing side edges of the heat generating unit so as to be electrically connected to the heat generating unit and at least one side of the side edges is formed by cutting out a part thereof.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: April 14, 2020
    Assignees: TOSHIBA TEC KABUSHIKI KAISHA, TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Osamu Takagi
  • Publication number: 20200075663
    Abstract: A light emitting device according to this embodiment, includes: a first substrate having light transmittivity and flexibility, a conductor layer being formed on the first substrate; a second substrate having light transmittivity and flexibility, and being arranged to face the first substrate; a plurality of light emitting elements including an electrode connected to the conductor layer, and being arranged between the first substrate and the second substrate into the shape of a matrix; and a resin layer having light transmittivity and flexibility, and retaining the plurality of light emitting elements by being arranged between the first substrate and the second substrate, the plurality of light emitting elements configuring a point light source, in which a distance between the point light sources adjacent to each other is 0.3 cm to 3.2 cm.
    Type: Application
    Filed: June 27, 2019
    Publication date: March 5, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventors: Koichi MATSUSHITA, Akira ISHIGAI, Takamasa OOTAKE
  • Publication number: 20200075874
    Abstract: Disclosed is a light emitting apparatus including: a first substrate having light transmissive property and flexibility with a conductive layer; a second substrate having light transmissive property and flexibility and arranged to face the first substrate; a plurality of light emitting elements including an electrode connected to the conductive layer and arranged between the first and second substrates; and a resin layer having light transmissive property and flexibility and arranged between the first and second substrates to hold the plurality of light emitting elements. A temperature for a maximum mechanical loss tangent tan ? in dynamic viscoelasticity of the resin layer is 117° C. or higher.
    Type: Application
    Filed: August 21, 2019
    Publication date: March 5, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventors: Naoki Takojima, Yojiro Yarimizu, Tsuyoshi Abe
  • Publication number: 20200072448
    Abstract: A decoration device according to this embodiment is a decoration device decorating an object used indoors, including: a light emitting device having light transmittivity and flexibility, including a plurality of light emitting elements emitting light from one surface and the other surface, and being arranged on one side of the object, in which a distance between the object and the light emitting device when an indoor light is turned off is less than or equal to 90 cm.
    Type: Application
    Filed: July 23, 2019
    Publication date: March 5, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventors: Koichi MATSUSHITA, Takamasa OOTAKE
  • Publication number: 20200075824
    Abstract: A light-emitting device according to embodiments of the invention includes a film having light transmissive property to visible light; a conductor layer formed on one surface of the film; and a light-emitting element having electrodes connected to the conductor layer via bumps protruding toward the film. The curvature of the film curved on the outer edge of a contact area of the conductor layer contacting the bumps is defined by a radius of a circle contacting the conductor layer at at least three points on the outer edge of the contact area, and the radius of this circle is 13 ?m or larger.
    Type: Application
    Filed: February 21, 2019
    Publication date: March 5, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventors: Naoki Takojima, Yojiro Yarimizu, Tsuyoshi Abe, Kouji Tanaka
  • Publication number: 20200075558
    Abstract: Disclosed is a light emitting apparatus including: first and second substrates having light transmissive property and flexibility arranged to face each other; a plurality of light emitting element groups arranged along a predetermined straight line between the first and second substrates and each of the light emitting element groups includes a first light emitting element and a second light emitting element; and a conductor pattern formed on the first substrate and including respective individual line patterns individually connected to the first and second light emitting elements and a common line pattern commonly connected to the first and second light emitting elements. The individual line patterns are routed to one side and the other side of the straight line centered on at least a part of the common line pattern.
    Type: Application
    Filed: August 5, 2019
    Publication date: March 5, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Tomotsugu JINGI
  • Patent number: 10580949
    Abstract: A light emitting module according to an embodiment includes a first insulation film and a second insulation film with a light transmissivity, a plurality of first double-sided light emitting elements disposed between the first insulation film and the second insulation film, and each including a pair of electrodes on one surface, a plurality of second double-sided light emitting elements disposed between the first insulation film and the second insulation film adjacent to the respective first double-sided light emitting elements, each including a pair of electrodes on one surface, and emitting different light from the first double-sided light emitting element.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: March 3, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Patent number: 10575400
    Abstract: A light-emitting module according to an embodiment includes a first insulating film with light transmissive property, a plurality of mesh patterns including a plurality of first line patterns and a plurality of second line patterns, a light-emitting element, and a resin layer. The first line patterns are formed on the first insulating film and are parallel to one another. The second line patterns intersect with the first line patterns and are parallel to one another. The light-emitting element is connected to any two of a plurality of the mesh patterns. The resin layer holds the light-emitting element to the first insulating film. A first mesh pattern and a second mesh pattern adjacent to one another among the plurality of mesh patterns have a boundary. Line patterns projecting from the first mesh pattern to the boundary and line patterns projecting from the second mesh pattern to the boundary are collocated along the boundary in a state of being adjacent to one another.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: February 25, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Publication number: 20200044130
    Abstract: A light emitting device includes a first light transmissive supportive substrate having a first light transmissive insulator and a conductive circuitry layer provided on a surface of the first light transmissive insulator, a second light transmissive supportive substrate having a second light transmissive insulator and disposed in such a way that a surface of the second light transmissive insulator faces the conductive circuitry layer and so as to have a predetermined gap from the first light transmissive supportive substrate, a light emitting diode having a main body, and first and second electrodes provided on a surface of the main body and electrically connected to the conductive circuitry layer via a conductive bump, and laid out between the first and second light transmissive supportive substrates, and a third light transmissive insulator embedded in a space between the first light transmissive supportive substrate and the second light transmissive supportive substrate.
    Type: Application
    Filed: October 15, 2019
    Publication date: February 6, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Keiichi Maki
  • Patent number: 10553769
    Abstract: A light transmissive first insulating film having light transmissive property to visible light, a second insulating film arranged opposite to the first insulating film, a plurality of conductor patterns formed of, for example, mesh patterns having the light transmissive property to the visible light and formed on a surface of at least one of the first insulating film and the second insulating film, a plurality of first light-emitting devices connected to any two conductor patterns of the plurality of conductor patterns, and a resin layer arranged between the first insulating film and the second insulating film to hold the first light-emitting devices are included.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: February 4, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Publication number: 20200013763
    Abstract: A light-emitting device according to an embodiment includes a light-emitting part and an external wiring. The light-emitting part includes: a pair of insulating substrates that has light transmissive property and flexibility; a plurality of light-emitting elements arranged between the pair of insulating substrates; an internal wiring pattern that is provided between the pair of insulating substrates, and is connected to the light-emitting elements; and a resin layer that has light transmissive property and insulating property, and is provided between the pair of insulating substrates. An end of the external wiring is divided into a plurality of wirings having a line width that is narrower than a line width of the internal wiring pattern. An end of the internal wiring pattern is bonded, at an end of the insulating substrates, to the end of the external wiring that is divided into a plurality of wirings by an anisotropic conductive adhesive.
    Type: Application
    Filed: September 20, 2019
    Publication date: January 9, 2020
    Applicant: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi MAKI