Patents Assigned to Transound Electronics Co., Ltd.
  • Patent number: 12652496
    Abstract: The present disclosure provides a voice coil structure and a loudspeaker. The voice coil structure includes a substrate, a first wiring layer disposed on the substrate, and a first insulation layer disposed on the first wiring layer. The first wiring layer has a winding structure. The first wiring layer further includes a first end and a second end. The first insulation layer defines a through hole and a first notch. The first end is exposed from the through hole, and the second end is exposed from the first notch.
    Type: Grant
    Filed: November 28, 2023
    Date of Patent: June 9, 2026
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventors: Tseng-Feng Wen, Chun-Han Huang, Chung-Hsien Tseng
  • Patent number: 12641373
    Abstract: The present disclosure provides a voice coil structure, a method for manufacturing the voice coil structure, and a loudspeaker. The voice coil structure includes a first insulation layer, a first wiring layer, a second insulation layer, at least one second wiring layer, and a third insulation layer. The second insulation layer extends to wiring gaps of the first wiring layer. The third insulation layer extends to wiring gaps of the at least one second wiring layer. Each of the first wiring layer and the at least one second wiring layer has a winding structure. The first wiring layer is electrically connected in series or in parallel with the at least one second wiring layer and forming two output terminals.
    Type: Grant
    Filed: December 20, 2023
    Date of Patent: May 26, 2026
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventors: Tseng-Feng Wen, Chien-Kai Wen, Chun-Han Huang, Chung-Hsien Tseng
  • Patent number: 12573930
    Abstract: A vibration generator is provided, which includes a housing defining a receiving space, a control assembly fixed in the receiving space, and a vibration assembly received in the receiving space. The control assembly can generate an alternating magnetic field. The vibration assembly is movably received in the receiving space and includes a magnet and a vibration sheet. The vibration sheet is connected to the magnet and the housing. The magnet is configured to vibrate back and forth in the alternating magnetic field and transmits the vibrations to the housing.
    Type: Grant
    Filed: January 18, 2024
    Date of Patent: March 10, 2026
    Assignee: Transound Electronics Co., Ltd.
    Inventors: Tseng-Feng Wen, Hui Xue, Zhi-Jian He, Yan-Fang Chen
  • Patent number: 12317039
    Abstract: A bone conduction receiver includes a housing, a vibrating plate, a bracket, a magnetic loop assembly, a coil, and a protective cover. The vibrating plate is disposed inside the housing and keeps a distance from an inner bottom of the housing. The protective cover is located on one side of the vibrating plate, facing away from the inner bottom of the housing, and covers the opening of the accommodation room. The bracket is located on the side of the vibrating plate, facing away from the inner bottom of the housing. The magnetic loop assembly is secured in the bracket. One end of the coil is fixed to an inner side of the protective cover, and another end of the coil extends into the bracket and surrounds the magnetic loop assembly.
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: May 27, 2025
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventors: Tseng-Feng Wen, Hui Xue, Yangfang Chen
  • Patent number: 12143794
    Abstract: A loudspeaker using a semiconductor voice coil includes a vibrating assembly and a magnetic force assembly. The magnetic force assembly and the vibrating assembly are arranged at an interval. The vibrating component includes a diaphragm and the semiconductor voice coil. The semiconductor voice coil is arranged on a side of the diaphragm. The magnetic force assembly and the semiconductor voice coil are arranged on the same side of the diaphragm. A magnetic gap is defined in the magnetic force assembly. The semiconductor voice coil is arranged in the magnetic gap. The magnetic field lines in the magnetic gap are perpendicular to the direction of current in the semiconductor voice coil. An electronic device including the loudspeaker is also disclosed.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: November 12, 2024
    Assignee: Transound Electronics Co., Ltd.
    Inventors: Tseng-Feng Wen, Hui Xue
  • Patent number: 11778388
    Abstract: A speaker includes a speaker body and a diaphragm. The diaphragm is a planar structure. The speaker body includes a positioning structure. The positioning structure has a cavity penetrating front and back sides of the positioning structure. The diaphragm is positioned on the positioning structure. The diaphragm is in the form of a planar structure, instead of a curved or spherical structure. The planar structure of the diaphragm is simplified, so that the manufacturing process of the diaphragm is simpler.
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: October 3, 2023
    Assignee: Transound Electronics Co., Ltd.
    Inventors: Tseng-Feng Wen, Huming Zheng, Hui Xue
  • Patent number: 11503394
    Abstract: A TWS bone conduction earphone includes an earphone housing and an earphone body. The earphone housing is configured to accommodate the earphone body. The earphone body includes a storage module, a Bluetooth module and a bone conduction module. The storage module is configured to store a Bluetooth address corresponding to a Bluetooth device to be connected and paired. The Bluetooth module is configured to establish a communication with the corresponding Bluetooth device according to the Bluetooth address to obtain an audio signal from the Bluetooth device. The bone conduction module vibrates according to the audio signal for transmitting sounds through ossicles. Using Bluetooth technology, bone conduction wireless answering is realized, without the restriction of the earphone cable. It is more convenient to use, and the sound transmission is realized through bone conduction without damaging hearing.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: November 15, 2022
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventors: Tseng-Feng Wen, Huming Zheng
  • Patent number: 11451892
    Abstract: A one-piece speaker having a built-in sound cavity includes a holder, a casing, a diaphragm, a voice coil, a washer, a magnet, a U-shaped cup, and a circuit board assembly. The speaker has its built-in sound cavity, so that the assembly is more convenient and flexible. The overall structure is simpler and easy to be produced. The sound cavity is larger, the sound sensitivity is better, and there is no need to distinguish between mid and low sounds. The bandwidth is larger, the response speed is faster, the signal frequency allowed to pass is high, the signal distortion is small, and the sound quality is better.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: September 20, 2022
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventors: Tseng-Feng Wen, Hui Xue
  • Patent number: 11297436
    Abstract: A conduction receiver utilizing sound transmission through a solid medium includes an outer casing, a vibration reed, a magnet, a washer, a coil, and a lid. The lid covers surfaces of the outer casing to form a sealed first receiving space. The vibration reed, the magnet, the washer, and the coil are all arranged in the first receiving space. A peripheral surface of the vibration reed is coupled to the outer casing. The magnet is arranged at a side of the vibration reed away from a bottom of the outer casing. The washer is arranged at a side of the magnet away from the vibration reed. A first end of the coil is fixed to an inner surface of the lid, and a second end of the coil extends into the first receiving space and is coiled around the magnet and the washer. An electronic device is also provided.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: April 5, 2022
    Assignee: Transound Electronics Co., Ltd.
    Inventors: Tseng-Feng Wen, Hu-Ming Zheng, Zhi-Jian He, Yan-Fang Chen
  • Patent number: 10887681
    Abstract: A combination of a bone conduction Bluetooth earphone and a charging base includes an earphone body, a PCB, a wireless module, and a rechargeable battery. The PCB, the wireless module and the rechargeable battery are disposed in the earphone body. The wireless module and the rechargeable battery are electrically connected to the PCB. It realizes the design of the bone conduction Bluetooth earphone and solves the problem that an air conduction speaker needs good air tightness, a resonant chamber and tuning and is inconvenient for assembly. The structural design is clever and reasonable, and it is easy for production.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: January 5, 2021
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventor: Tseng-Feng Wen
  • Patent number: 10873815
    Abstract: An electret condenser microphone with a low noise figure and a method for producing the same are disclosed. An electret variable condenser is first installed into a housing, and then an ASIC amplifier and a printed circuit board are installed into the housing. The ASIC amplifier is electrically connected to the electret variable condenser. It reduces the noise figure effectively and ensures the normal transmission of the effective sound. In particular, it ensures the stability and reliability of the ASIC amplifier during use. The process is simple, the production efficiency is high, and the processing cost is low.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: December 22, 2020
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventors: Huming Zheng, Tseng-Feng Wen, Yu Zhang, Feng Tong
  • Patent number: 10715905
    Abstract: A noise cancelling earphone includes an earphone housing, a filter module, and a speaker. The filter module and the speaker are installed in the earphone housing. The filter module includes a printed circuit board, a microphone, and a filter unit. The microphone and the filter unit are respectively disposed on the printed circuit board. The filter unit is electrically connected between the microphone and the speaker. The filter module is arranged in the earphone. The structural design is reasonable, the space is effectively utilized, the structure is compact, and the assembly is convenient.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: July 14, 2020
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventor: Tseng-Feng Wen
  • Patent number: 10638211
    Abstract: An in-ear headphone having an MMCX socket and a detachable in-ear headphone assembly are provided. The in-ear headphone includes a headphone housing and a speaker assembly disposed in the headphone housing. The headphone housing includes a first housing and a second housing to be connected with each other. The first housing has a first interface portion extending from one end thereof. The second housing has a second interface portion extending from one end thereof. The first interface portion and the second interface portion jointly form an interface.
    Type: Grant
    Filed: May 6, 2018
    Date of Patent: April 28, 2020
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventors: Tseng-Feng Wen, Weiguo Zeng, Haijuan Wu, Lin Cheng
  • Patent number: 10257607
    Abstract: The present invention is directed to a headphone device including zones to separate different frequency ranges for enhancing and improving sound quality. The headphone device includes more than one cavities and second auxiliary holes. The second auxiliary holes are configured for most bass or low-frequency to enter a second cavity through the second auxiliary holes and to have a better frequency division effect and to improve the audio quality of the headphone device.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: April 9, 2019
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventors: Tseng Feng Wen, Jing Luen Wen, Hsin Hao Wen
  • Patent number: 10250966
    Abstract: An electrostatic loudspeaker and an electrostatic headphone are provided. The electrostatic loudspeaker includes a first back grid portion, a second back grid portion, a diaphragm portion, and an audio amplifier circuit module. The two polarized and charged back grid portions are combined with the diaphragm portion to form two alternating electric fields, providing great sound. The structure is simple and can be assembled conveniently.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: April 2, 2019
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventors: Huming Zheng, Zhijian He, Xiaolin Deng, Tseng-Feng Wen
  • Patent number: 10171905
    Abstract: The present invention is directed to a headphone device including zones to separate different frequency ranges for enhancing and improving sound quality. The headphone device includes more than one cavities and second auxiliary holes. The second auxiliary holes are configured for most bass or low-frequency to enter a second cavity through the second auxiliary holes and to have a better frequency division effect and to improve the audio quality of the headphone device.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: January 1, 2019
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventors: Tseng Feng Wen, Jing Luen Wen, Hsin Hao Wen
  • Publication number: 20180310090
    Abstract: The present invention is directed to a headphone device including zones to separate different frequency ranges for enhancing and improving sound quality. The headphone device includes more than one cavities and second auxiliary holes. The second auxiliary holes are configured for most bass or low-frequency to enter a second cavity through the second auxiliary holes and to have a better frequency division effect and to improve the audio quality of the headphone device.
    Type: Application
    Filed: June 27, 2018
    Publication date: October 25, 2018
    Applicant: TRANSOUND ELECTRONICS CO., LTD.
    Inventors: TSENG FENG WEN, JING LUEN WEN, HSIN HAO WEN
  • Patent number: 9860647
    Abstract: A high sound quality piezoelectric speaker includes a moving coil speaker, a support frame, a vibration plate, and a piezoelectric ceramic plate. The support frame is arranged on the moving coil speaker and the vibration plate is positioned on the support frame. With the piezoelectric ceramic plate being positioned on the vibration plate, the moving coil speaker and the piezoelectric ceramic plate may collaboratively and better handle both high-frequency and low-frequency sounds, exhibiting relatively wide playback band and making sound quality better, to thereby reach the standard of high sound quality and provide users with improved enjoyment of sound perception.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: January 2, 2018
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventors: Tseng-Feng Wen, Huming Zheng, Zhijian He, Xiaolin Deng
  • Patent number: 9686603
    Abstract: A freely adjustable ergonomic bone conduction earphone rack and bone conduction earphone using the same are disclosed. The rack includes a head-mounted unit, ear-hung units and mounting units, where the ear-hung unit is respectively configured on the two ends of the head-mounted unit, and the mounting unit is coupled to the ear-hung unit; the mounting unit has a connection section in connection with the ear-hung unit and mounting section for the mounting of a bone conduction vibrator, where at least the connection section is a soft plastic body, and the mounting unit is configured to be adjustable freely multi-directional relatively to the ear-hung unit with the deformation of the connection section.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: June 20, 2017
    Assignee: TRANSOUND ELECTRONICS CO., LTD.
    Inventors: Huming Zheng, Yu Zhang, Tseng-feng Wen
  • Patent number: D1010610
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: January 9, 2024
    Assignee: Transound Electronics Co., Ltd.
    Inventors: Tseng-Feng Wen, Hu-Ming Zheng, Hui Xue, Hua-Quan Che