Patents Assigned to Transound Electronics Co., Ltd.
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Patent number: 11778388Abstract: A speaker includes a speaker body and a diaphragm. The diaphragm is a planar structure. The speaker body includes a positioning structure. The positioning structure has a cavity penetrating front and back sides of the positioning structure. The diaphragm is positioned on the positioning structure. The diaphragm is in the form of a planar structure, instead of a curved or spherical structure. The planar structure of the diaphragm is simplified, so that the manufacturing process of the diaphragm is simpler.Type: GrantFiled: March 15, 2022Date of Patent: October 3, 2023Assignee: Transound Electronics Co., Ltd.Inventors: Tseng-Feng Wen, Huming Zheng, Hui Xue
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Patent number: 11503394Abstract: A TWS bone conduction earphone includes an earphone housing and an earphone body. The earphone housing is configured to accommodate the earphone body. The earphone body includes a storage module, a Bluetooth module and a bone conduction module. The storage module is configured to store a Bluetooth address corresponding to a Bluetooth device to be connected and paired. The Bluetooth module is configured to establish a communication with the corresponding Bluetooth device according to the Bluetooth address to obtain an audio signal from the Bluetooth device. The bone conduction module vibrates according to the audio signal for transmitting sounds through ossicles. Using Bluetooth technology, bone conduction wireless answering is realized, without the restriction of the earphone cable. It is more convenient to use, and the sound transmission is realized through bone conduction without damaging hearing.Type: GrantFiled: October 20, 2020Date of Patent: November 15, 2022Assignee: TRANSOUND ELECTRONICS CO., LTD.Inventors: Tseng-Feng Wen, Huming Zheng
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Patent number: 11451892Abstract: A one-piece speaker having a built-in sound cavity includes a holder, a casing, a diaphragm, a voice coil, a washer, a magnet, a U-shaped cup, and a circuit board assembly. The speaker has its built-in sound cavity, so that the assembly is more convenient and flexible. The overall structure is simpler and easy to be produced. The sound cavity is larger, the sound sensitivity is better, and there is no need to distinguish between mid and low sounds. The bandwidth is larger, the response speed is faster, the signal frequency allowed to pass is high, the signal distortion is small, and the sound quality is better.Type: GrantFiled: January 20, 2021Date of Patent: September 20, 2022Assignee: TRANSOUND ELECTRONICS CO., LTD.Inventors: Tseng-Feng Wen, Hui Xue
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Patent number: 11297436Abstract: A conduction receiver utilizing sound transmission through a solid medium includes an outer casing, a vibration reed, a magnet, a washer, a coil, and a lid. The lid covers surfaces of the outer casing to form a sealed first receiving space. The vibration reed, the magnet, the washer, and the coil are all arranged in the first receiving space. A peripheral surface of the vibration reed is coupled to the outer casing. The magnet is arranged at a side of the vibration reed away from a bottom of the outer casing. The washer is arranged at a side of the magnet away from the vibration reed. A first end of the coil is fixed to an inner surface of the lid, and a second end of the coil extends into the first receiving space and is coiled around the magnet and the washer. An electronic device is also provided.Type: GrantFiled: November 30, 2020Date of Patent: April 5, 2022Assignee: Transound Electronics Co., Ltd.Inventors: Tseng-Feng Wen, Hu-Ming Zheng, Zhi-Jian He, Yan-Fang Chen
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Patent number: 10887681Abstract: A combination of a bone conduction Bluetooth earphone and a charging base includes an earphone body, a PCB, a wireless module, and a rechargeable battery. The PCB, the wireless module and the rechargeable battery are disposed in the earphone body. The wireless module and the rechargeable battery are electrically connected to the PCB. It realizes the design of the bone conduction Bluetooth earphone and solves the problem that an air conduction speaker needs good air tightness, a resonant chamber and tuning and is inconvenient for assembly. The structural design is clever and reasonable, and it is easy for production.Type: GrantFiled: January 6, 2020Date of Patent: January 5, 2021Assignee: TRANSOUND ELECTRONICS CO., LTD.Inventor: Tseng-Feng Wen
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Patent number: 10873815Abstract: An electret condenser microphone with a low noise figure and a method for producing the same are disclosed. An electret variable condenser is first installed into a housing, and then an ASIC amplifier and a printed circuit board are installed into the housing. The ASIC amplifier is electrically connected to the electret variable condenser. It reduces the noise figure effectively and ensures the normal transmission of the effective sound. In particular, it ensures the stability and reliability of the ASIC amplifier during use. The process is simple, the production efficiency is high, and the processing cost is low.Type: GrantFiled: June 24, 2019Date of Patent: December 22, 2020Assignee: TRANSOUND ELECTRONICS CO., LTD.Inventors: Huming Zheng, Tseng-Feng Wen, Yu Zhang, Feng Tong
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Patent number: 10715905Abstract: A noise cancelling earphone includes an earphone housing, a filter module, and a speaker. The filter module and the speaker are installed in the earphone housing. The filter module includes a printed circuit board, a microphone, and a filter unit. The microphone and the filter unit are respectively disposed on the printed circuit board. The filter unit is electrically connected between the microphone and the speaker. The filter module is arranged in the earphone. The structural design is reasonable, the space is effectively utilized, the structure is compact, and the assembly is convenient.Type: GrantFiled: August 12, 2019Date of Patent: July 14, 2020Assignee: TRANSOUND ELECTRONICS CO., LTD.Inventor: Tseng-Feng Wen
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Patent number: 10638211Abstract: An in-ear headphone having an MMCX socket and a detachable in-ear headphone assembly are provided. The in-ear headphone includes a headphone housing and a speaker assembly disposed in the headphone housing. The headphone housing includes a first housing and a second housing to be connected with each other. The first housing has a first interface portion extending from one end thereof. The second housing has a second interface portion extending from one end thereof. The first interface portion and the second interface portion jointly form an interface.Type: GrantFiled: May 6, 2018Date of Patent: April 28, 2020Assignee: TRANSOUND ELECTRONICS CO., LTD.Inventors: Tseng-Feng Wen, Weiguo Zeng, Haijuan Wu, Lin Cheng
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Patent number: 10257607Abstract: The present invention is directed to a headphone device including zones to separate different frequency ranges for enhancing and improving sound quality. The headphone device includes more than one cavities and second auxiliary holes. The second auxiliary holes are configured for most bass or low-frequency to enter a second cavity through the second auxiliary holes and to have a better frequency division effect and to improve the audio quality of the headphone device.Type: GrantFiled: February 7, 2017Date of Patent: April 9, 2019Assignee: TRANSOUND ELECTRONICS CO., LTD.Inventors: Tseng Feng Wen, Jing Luen Wen, Hsin Hao Wen
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Patent number: 10250966Abstract: An electrostatic loudspeaker and an electrostatic headphone are provided. The electrostatic loudspeaker includes a first back grid portion, a second back grid portion, a diaphragm portion, and an audio amplifier circuit module. The two polarized and charged back grid portions are combined with the diaphragm portion to form two alternating electric fields, providing great sound. The structure is simple and can be assembled conveniently.Type: GrantFiled: November 15, 2017Date of Patent: April 2, 2019Assignee: TRANSOUND ELECTRONICS CO., LTD.Inventors: Huming Zheng, Zhijian He, Xiaolin Deng, Tseng-Feng Wen
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Patent number: 10171905Abstract: The present invention is directed to a headphone device including zones to separate different frequency ranges for enhancing and improving sound quality. The headphone device includes more than one cavities and second auxiliary holes. The second auxiliary holes are configured for most bass or low-frequency to enter a second cavity through the second auxiliary holes and to have a better frequency division effect and to improve the audio quality of the headphone device.Type: GrantFiled: June 27, 2018Date of Patent: January 1, 2019Assignee: TRANSOUND ELECTRONICS CO., LTD.Inventors: Tseng Feng Wen, Jing Luen Wen, Hsin Hao Wen
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Publication number: 20180310090Abstract: The present invention is directed to a headphone device including zones to separate different frequency ranges for enhancing and improving sound quality. The headphone device includes more than one cavities and second auxiliary holes. The second auxiliary holes are configured for most bass or low-frequency to enter a second cavity through the second auxiliary holes and to have a better frequency division effect and to improve the audio quality of the headphone device.Type: ApplicationFiled: June 27, 2018Publication date: October 25, 2018Applicant: TRANSOUND ELECTRONICS CO., LTD.Inventors: TSENG FENG WEN, JING LUEN WEN, HSIN HAO WEN
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Patent number: 9860647Abstract: A high sound quality piezoelectric speaker includes a moving coil speaker, a support frame, a vibration plate, and a piezoelectric ceramic plate. The support frame is arranged on the moving coil speaker and the vibration plate is positioned on the support frame. With the piezoelectric ceramic plate being positioned on the vibration plate, the moving coil speaker and the piezoelectric ceramic plate may collaboratively and better handle both high-frequency and low-frequency sounds, exhibiting relatively wide playback band and making sound quality better, to thereby reach the standard of high sound quality and provide users with improved enjoyment of sound perception.Type: GrantFiled: June 23, 2016Date of Patent: January 2, 2018Assignee: TRANSOUND ELECTRONICS CO., LTD.Inventors: Tseng-Feng Wen, Huming Zheng, Zhijian He, Xiaolin Deng
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Publication number: 20170238088Abstract: The present invention is directed to a headphone device including zones to separate different frequency ranges for enhancing and improving sound quality. The headphone device includes more than one cavities and second auxiliary holes. The second auxiliary holes are configured for most bass or low-frequency to enter a second cavity through the second auxiliary holes and to have a better frequency division effect and to improve the audio quality of the headphone device.Type: ApplicationFiled: February 7, 2017Publication date: August 17, 2017Applicant: DONGGUAN TRANSOUND ELECTRONICS CO. LTD.Inventors: TSENG FENG WEN, JING LUEN WEN, HSIN HAO WEN
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Patent number: 9686603Abstract: A freely adjustable ergonomic bone conduction earphone rack and bone conduction earphone using the same are disclosed. The rack includes a head-mounted unit, ear-hung units and mounting units, where the ear-hung unit is respectively configured on the two ends of the head-mounted unit, and the mounting unit is coupled to the ear-hung unit; the mounting unit has a connection section in connection with the ear-hung unit and mounting section for the mounting of a bone conduction vibrator, where at least the connection section is a soft plastic body, and the mounting unit is configured to be adjustable freely multi-directional relatively to the ear-hung unit with the deformation of the connection section.Type: GrantFiled: April 18, 2016Date of Patent: June 20, 2017Assignee: TRANSOUND ELECTRONICS CO., LTD.Inventors: Huming Zheng, Yu Zhang, Tseng-feng Wen
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Patent number: 9602912Abstract: A high bass speaker monomer comprises a framework, a magnetic air loop component and a vibration membrane. The frame work is disposed at a central position of the frame work. A hollow structure is formed on the framework and around the magnetic air loop component. An isolation ring formed on the framework divides the hollow structure into at least one high tone region and bass region respectively located near and far away from the magnetic air loop component. The vibration membrane is disposed on the framework and covers the magnetic air loop component and the two regions. The high bass speaker monomer is disposed in a casing body to construct a high bass earphone structure. The isolation ring separates the high tone from the low tone to prevent them from mixing. Therefore, the sound of the earphone is more stable and the quality of the sound is better.Type: GrantFiled: December 19, 2013Date of Patent: March 21, 2017Assignee: TRANSOUND ELECTRONICS CO., LTD.Inventor: Tsengfeng Wen
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Patent number: 9510102Abstract: A moving iron sounding device includes a casing, a diaphragm sounding system, and a magnetic circuit system. The magnetic circuit system includes a dual-rectangle-shaped magnetic circuit, an inductance coil, and an armature. The diaphragm sounding system includes a support ring and a composite diaphragm. The composite diaphragm includes a diaphragm sheet and a metal sheet. One end of the metal sheet is welded to the vibration portion through a connecting arm, and another end of the metal sheet is connected to the support ring. The present invention achieves a stable connection of the diaphragm sounding system and the magnetic circuit system and ensures the quality of the product. During the process of assembly, the adhesive won't be spilled on the diaphragm.Type: GrantFiled: August 31, 2015Date of Patent: November 29, 2016Assignee: TRANSOUND ELECTRONICS CO., LTD.Inventors: Huming Zheng, Zhijian He, Yu Zhang, Xiaolin Deng, Tseng-feng Wen
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Patent number: 9462403Abstract: A package-integrable high sound quality voice coil loudspeaker structure includes a metal shell, and a diaphragm, voice coil washer, magnet, T iron and PCB packed integrally inside the metal shell; the metal shell has a cylindrical side wall and bottom wall, and a sound output is opened on the bottom wall, with a lengthened cylinder in communication with the first sound output being projected outward integrally from the bottom face of the bottom wall. Therefore, the present invention utilizing the metal shell to pack all components integrally simplifies the assembly process, and has a good waterproof performance. In addition, the configuration of the lengthened cylinder improves the sound quality.Type: GrantFiled: October 19, 2015Date of Patent: October 4, 2016Assignee: TRANSOUND ELECTRONICS CO., LTD.Inventors: Tseng-Feng Wen, Huming Zheng, Hui Xue, Sen Deng
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Patent number: 9344784Abstract: An earphone with dual loudspeakers includes a casing, a retaining member, a tweeter, and a woofer. The casing has a first sound outlet passage and an accommodation space therein. The retaining member is installed in the accommodation space. Two ends of the retaining member are formed with a first accommodation cavity and a second accommodation cavity, respectively. The tweeter and the woofer are respectively installed in the first and second accommodation cavities and then installed in the casing. The tweeter has a sound outlet side facing the first sound outlet passage. A second sound outlet passage is formed between the outer wall of the tweeter and the inner wall of the first accommodation cavity. The second sound outlet passage communicates with the first sound outlet passage. The woofer has a sound outlet side facing the second sound outlet passage.Type: GrantFiled: November 11, 2014Date of Patent: May 17, 2016Assignee: TRANSOUND ELECTRONICS CO., LTD.Inventors: Tsengfeng Wen, Huiguang Yang
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Patent number: D1010610Type: GrantFiled: January 19, 2022Date of Patent: January 9, 2024Assignee: Transound Electronics Co., Ltd.Inventors: Tseng-Feng Wen, Hu-Ming Zheng, Hui Xue, Hua-Quan Che