Headset

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Description

FIG. 1 is a front perspective view of a headset showing our new design;

FIG. 2 is a rear perspective view of the headset in FIG. 1.

FIG. 3 is a front elevation view of the headset in FIG. 1.

FIG. 4 is a rear elevation view of the headset in FIG. 1.

FIG. 5 is a left side elevation view of the headset in FIG. 1.

FIG. 6 is a right side elevation view of the headset in FIG. 1.

FIG. 7 is a top plan view of the headset in FIG. 1; and,

FIG. 8 is a bottom plan view of the headset in FIG. 1.

The broken lines in the drawings are employed to show unclaimed portions of the headset, and form no part of the claimed design.

Claims

The ornamental design for a headset, as shown and described.

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Patent History
Patent number: D1010610
Type: Grant
Filed: Jan 19, 2022
Date of Patent: Jan 9, 2024
Assignee: Transound Electronics Co., Ltd. (Dongguan)
Inventors: Tseng-Feng Wen (Dongguan), Hu-Ming Zheng (Dongguan), Hui Xue (Dongguan), Hua-Quan Che (Dongguan)
Primary Examiner: Paula Allen Greene
Application Number: 29/823,729
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)