Abstract: An improved two layer electrode structure is fabricated on a surface. According to one aspect of the invention, the first layer of the electrode structure is designed to provide electrical contact to a fluid electronic material and the second layer of the electrode structure is formed so as to constrain the fluid electronic material in a precise pattern. Alternatively, the second layer of the two-layer electrode structure includes a low surface energy material to further assist in constraining the fluid electronic material to the desired pattern. In another alternative, the first layer of the electrode structure includes a transparent electrode material, that is coupled to an electro-optical device. The second layer of this electrode structure includes a high conductivity material that is coupled to the first layer of the electrode structure in an area not directly over the electro-optical device to improve the conductivity of the transparent electrode structure.

Abstract: An improved two layer electrode structure is fabricated on a surface. According to one aspect of the invention, the first layer of the electrode structure is designed to provide electrical contact to a fluid electronic material and the second layer of the electrode structure is formed so as to constrain the fluid electronic material in a precise pattern. Alternatively, the second layer of the two-layer electrode structure includes a low surface energy material to further assist in constraining the fluid electronic material to the desired pattern. In another alternative, the first layer of the electrode structure includes a transparent electrode material, that is coupled to an electro-optical device. The second layer of this electrode structure includes a high conductivity material that is coupled to the first layer of the electrode structure in an area not directly over the electro-optical device to improve the conductivity of the transparent electrode structure.

Abstract: Systems and methods associated with a pixel circuit for an OLED element are disclosed herein.

Abstract: An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.