Abstract: A fixture is provided for making temporary electrical connections with an integrated circuit die having interconnect pads arranged in a predetermined pattern. The fixture includes contact elements carried by a substantially rigid support member in a pattern corresponding to the predetermined pattern of interconnect pads and adapted to engage a single die. An engagement assembly is provided for bringing the interconnect pads and the contact elements together to make nonpermanent temporary simultaneous electrical connections therebetween. The engagement assembly includes a package having leads in a configuration compatible with test, burn-in and handling equipment for conventional integrated circuit packages.

Abstract: A method for testing an integrated circuit die having interconnect pads in a package having leads in a configuration compatible with test, burn-in and handling equipment. The method includes the steps of placing the interconnect pads in direct contact with the leads of the package without forming a permanent connection to the interconnect pads, conducting burn-in tests on the die, electrically testing the integrated circuit of the die and disconnecting the interconnect pads from the leads of the package. In a preferred approach, the die is placed in the package and a nonpermanent pressure contact is made with each of the interconnect pads. In another aspect of the invention, a fixture is provided for making temporary electrical connections with an integrated circuit die having interconnect pads arranged in a predetermined pattern.

Abstract: A semiconductor device which includes device bonding pads exposed through oxide windows formed in a passivation oxide layer providing electrical connections to the metallized regions, a bonding pad of a different material electrically connected to the device bonding pad through a barrier layer, and a protective layer overlying the edges of said passivation oxide layer in contact with the device to seal the edges of the protective layer and a seal formed at said windows whereby the device is protected against the environment without the necessity of a separate metal or ceramic housing.

Abstract: A semiconductor device which includes device bonding pads exposed through oxide windows formed in a passivation oxide layer providing electrical connections to the metallized regions, a bonding pad of a different material electrically connected to the device bonding pad through a barrier layer, and a protective layer overlying the edges of said passivation oxide layer in contact with the device to seal the edges of the protective layer and a seal formed at said windows whereby the device is protected against the environment without the necessity of a separate metal or ceramic housing.

Abstract: A process for forming a lead pack including a frame of electrical insulating material with a plurality of spaced embedded leads extending inwardly and outwardly from said frame. Additionaly connecting the inwardly extending leads to the contact pads of a semiconductor device and the outwardly extending leads to a transport tape for testing.

Abstract: A reusable transport and test tape which includes a plurality of insulated conductors adapted to receive and connect to the leads of the lead pack and to position the lead pack for reception of an integrated circuit for bonding of lead pack leads to the contact pads of the integrated circuit and to move the lead pack and integrated circuit into succeeding processing stations where the circuit is tested and packaged.

Abstract: A lead pack which includes a frame of polymer insulating material and a plurality of leads imbedded in said frame and extending inwardly and outwardly therefrom for attachment to an associated integrated circuit and for attachment of the leaded integrated circuit to an associated printed wiring board or like circuit. The insulating frame serves as a dam or sealing means in an encapsulating process. The same or an additional frame stabilizes and positions the outwardly extending ends of the leads. A reusable transport and test tape which includes a plurality of insulated conductors adapted to receive and connect to the leads of the lead pack and to position the lead pack for reception of an integrated circuit for bonding of lead pack leads to the contact pads of the integrated circuit and to move the lead pack and integrated circuit into succeeding processing stations where the circuit is packaged and tested and lead formed, and then excised.

Abstract: A wedge bonding tool having a shank and a tapered work end including a narrow bonding tip for holding a wire against a surface to which it is to be bonded, a shank secured to said tapered work end for guiding wire to the rear of the tapered work end, and a wire guiding channel or passage for guiding wire from the shank to the narrow bonding tip.

Abstract: A bearing assembly comprising inner and outer rings provided with cooperating axially outwardly and inwardly facing bearing races in which the ring having axially inwardly facing races is split into two portions which are secured to one another to retain bearing races and which are radially and circumferentially positioned and secured to one another. A method of forming a precision bearing assembly as described.

Abstract: A thermally compliant structural interconnection of a support structure and working material components provided by surfaces of the working material components being engaged by surfaces of the support structure. Dissimilar materials or components that are at different temperatures may be interconnected by support structure projections engaging recesses in the components. By providing the recesses in at least two axially displaced rows, the projections expansion or contraction relative to the recesses is compensated for thereby maintaining the projections in engagement with the surfaces of the recesses. Accordingly, relative displacements of the members axes are minimized and distortions circumvented.

Abstract: A bearing mount in which the bearing seat has uniform structure without slots or cutouts. A bearing is snapped into the seat by distorting an unsupported end of the seat. The seat may be distorted beyond its elastic limit, and after aligning the bearing axis of rotation and the seat axis, the distorted end of the seat may grip the bearing in two point contact to prevent rotation of the bearing in the seat.

Abstract: A mount for a spherical bearing in which the bearing is supported from a flange plate by an integral bearing receiving flange which has a spherical bearing receiving surface to support the bearing and allow it to align with an associated shaft.

Abstract: A method for the electrodeposition of osmium, ruthenium or their alloys from alkali metal salts of the same in a nonaqueous solvent capable of permitting dissociation of the salt and having low surface tension (e.g., methanol or dimethyl formamide) or mixtures. A silicone layer chemically bonded to the surface of said electrodeposited layer. Also, a bonding tool having a tip coated by either of the above electrodeposited layer or the silicone layer, or both.

Abstract: A protected bearing mount assembly in which the bearing mount comprises a bearing mounting flange extending from one face of a plate and in which the outer portions of the plate are bent in the same direction as the bearing mounting flange to surround, support and protect the flange together with a cover on the open end of the bearing mount to protect the mounted bearing against the environment to which the bearing mount is exposed.

Abstract: Self-aligning bearing and rod end assembly including a formed race serving to accommodate the internal alignable load bearing.

Abstract: A pillow block for mounting bearings formed from one piece of metal.

Abstract: A one-piece formed metal flange mount for bearings.

Abstract: A method for the electrodeposition of osmium, ruthenium or their alloys from alkali metal salts of the same in a nonaqueous solvent capable of permitting dissociation of the salt and having low surface tension (e.g., methanol or dimethyl formamide) or mixtures. A silicone layer chemically bonded to the surface of said electrodeposited layer. Also, a bonding tool having a tip coated by either of the above electrodeposited layer or the silicone layer, or both.

Abstract: A device for metering the flow of a fluid, such as a lubricating medium, at a controlled rate. The fluid is stored within a reservoir having a resiliently expandable wall which maintains the fluid under pressure. A transparent cover is provided for visual observation of the wall to indicate the volume of fluid in the reservoir. The pressurized fluid is directed from the reservoir through an elongate flow passage having a cross-sectional area which is sized in relation to the passage length to establish a predetermined rate of fluid flow. In one embodiment the device is automatically energized upon threading engagement with the opening of a structure to be lubricated, and can then be disengaged and stored in a partially full condition. In another embodiment the flow rate can be readily varied by changing the length of a circular flow passage, or the device can be energized or de-energized, by rotating the transparent cover.

Abstract: A bearing member positioned between an inner race surface and an outer race surface and urged into constant positive contact with said race surfaces by internal bearing spring forces. Predetermined contact areas are formed on the outer surface of said bearing member for contact with the outer race, and on the inner surface of said bearing for contact with the inner race. The bearing member is flexed between the inner and outer races within the range of elastic deformation of the bearing member material and is configured to cooperate with the inner and outer races to provide either radial or thrust load capability or a combination of both.