Abstract: A bonding wedge for joining or bonding wire leads to contact areas or elements in the semiconductor and electronic industry including a rectangular wire guiding hole extending therethrough cooperating with a positioning groove formed on the bonding tip.

Abstract: A bearing mount which can be mounted in selected orientations to selectively position a bearing with its normal rotational axis either perpendicular or parallel to a mounting surface.

Abstract: An anti-friction bearing assembly is disclosed which incorporates split race rings secured together by means of a length of adhesive tape. In one embodiment a thin section, double row ball bearing assembly is provided in which the adhesive tape is employed for maintaining the split rings in a preferred circumferential orientation. The tape can flex to accommodate radial excursion of the split rings without inducing distortion forces, while at the same time the tape has sufficient strength to resist axial and torsional forces. The split rings are formed, in different embodiments, in either of the inner or outer race rings. A roller bearing embodiment of the invention employs a race ring comprised of a central segment and opposite end plates which cooperate to define a raceway for the rollers. A pair of adhesive strips secure the end plates to the central segment for handling and installation of the assembly prior to final clamping within a housing or on a shaft.