Abstract: A probe tip according to an embodiment of the disclosure may include: a first plating layer including a first metal; a second plating layer disposed on one surface of the first plating layer and including a second metal of a material different from that of the first metal; and a third plating layer disposed on one surface of the second plating layer and including the first metal, wherein each of the first plating layer, the second plating layer, and the third plating layer extends in a length direction of the probe tip, and wherein the first plating layer, the second plating layer, and the third plating layer are stacked in a thickness direction of the probe tip.

Abstract: A signal transmission connector formed by fastening the lower cover in a state where conductive electrodes supported by cover holes of the lower cover are inserted into frame holes of the upper frame to which the ball guide film is attached. The conductive electrodes may be replaced individually, and the conductive electrodes can operate independently. There is provided a rubber socket type signal transmission connector, which is advantageous for high-speed signal transmission.

Abstract: A test device for a semiconductor package and provides a test device for a semiconductor package for enlarging a pick and place area of a lower package to an entire size of the lower package using a floating plate movably coupled to a pusher and having a silicon pad disposed between the pusher and the floating plate to be moveable by elasticity of the silicon pad.

Abstract: An apparatus for testing a semiconductor package, in which a second test circuit board, which is disposed on an upper socket assembly to form a vacuum line in the related art, is removed, and a vacuum guide including two components disposed between an upper socket and an upper package. The vacuum guide including a conductive guide member made of an inelastic insulating material disposed on a conductive region part to prevent an electrical short circuit, and a peripheral guide member made of a metallic material having rigidity and disposed on a peripheral region portion to prevent deformation of a vacuum line, such that a length of a signal path is significantly decreased, high-speed signal transmission is possible. The stable vacuum line is ensured in the upper socket assembly, and vacuum pressure from a vacuum generation device is smoothly applied to a vacuum picker.

Abstract: A vertical probe pin that includes: an elastic beam part which is disposed between a lower contact portion in contact with a device to be tested and an upper contact point spaced apart at a predetermined distance from the lower contact point and in contact with a test device. The vertical probe pin is composed of a pair of elastic beams having a predetermined gap in order to be elastically deformed by an external force; and a separation prevention protrusion part provided with separation prevention protrusions protruding from at least one of the pair of elastic beams in order to prevent the elastic beam part from being separated through an upper guide hole.

Abstract: The objective of the present disclosure is to provide a semiconductor package test apparatus for testing a semiconductor package by means of connecting a semiconductor package and a test board.

Abstract: A circuit board including an adhesive part, a ceramic board part with the adhesive part, and a printed circuit board part with the adhesive part. The ceramic board and printed circuit board parts are made of different materials. The adhesive part includes: an adhesive layer including an adhesive material, an adhesive part opening, and a conductive paste filled in an inside of the adhesive part opening. A method including providing a ceramic board part, providing a printed circuit board part, and producing an adhesive part. Batch-bonding the printed circuit board part, the adhesive part, and the ceramic board part with one another. Producing the adhesive part includes: bonding a protection layer on two surfaces of an adhesive layer, forming an adhesive part opening penetrating the adhesive layer and the protection layer, filling the adhesive part opening with a conductive paste, and removing the protection layer.

Abstract: A probe pin having an improved gripping structure is disclosed. The disclosed probe pin includes a pin body including a plurality of holes and positioned at one side, a first extension portion extending upward from an outer side of the pin body, a second extension portion elongated from the other end of the first extension portion, further extending than the pin body in the other direction, and spaced apart from the pin body, and a tip part integrated with the second extension portion and having an end sharply protruding upward from an outer upper end of the second extension portion, in which the second extension portion includes a plurality of elasticity provision holes formed in parallel with an outer peripheral surface of the second extension portion and having different shapes to provide an elastic force that moves a portion of a needle of the tip part.

Abstract: The present disclosure relates to a test apparatus for a package-on-package type semiconductor package including a lower test socket mounted on a tester, and connected to a lower package to electrically connect the lower package to the tester; a pusher configured to be able to be moved vertically by receiving a driving force from a driving unit; an upper test socket mounted on the pusher, and having an electro-conductive part installed below the upper package to be electrically connected to the upper package; a vacuum picker mounted on the upper test socket to be able to vacuum-adsorb the lower package; and an inelastic insulating sheet installed between the upper test socket and the upper package, having a through hole formed at a position thereof corresponding to the terminal of the upper package and the electro-conductive part.

Abstract: A test apparatus for testing image sensor packages. The test apparatus is configured to stably vacuum-absorb an image sensor package in a surface manner, wherein when a vacuum adsorption sheet having a package adsorption hole in the shape of a wide square surface is coupled to the bottom of the floating plate at which an upper socket is seated, a vacuum line is formed by connecting the cover vacuum hole of the pusher, the board vacuum hole of the upper circuit board, the plate vacuum hole of the floating plate, and the package adsorption hole of the vacuum adsorption sheet together.

Abstract: Provided is a rubber socket having a structure with a built-in component. In the rubber socket with a built-in component, a connection sheet having components attached to an upper surface, a lower surface, or upper and lower surfaces of a conductive sheet composed of a conductive part and an insulating part is detachably coupled to the upper surface, the lower surface, or the upper and lower surfaces, and a guide sheet made of an inelastic insulating material is attached to an upper side, a lower side, or upper and lower sides of the connection sheet, and characteristics of a tester or a device to be tested may be tested using the components.

Abstract: An apparatus for testing a package-on-package type semiconductor package includes an upper test socket on which an upper package is mounted, the upper test socket being mounted on a pusher and connected to the lower package; a lower test socket mounted on a tester and connected to the lower package; and an adsorption pad coupled to the pusher and configured to adsorb and pressurize the lower package using a vacuum pressure, wherein the adsorption pad comprises a body part having a vacuum pressure passage formed therein; and an adsorption part having an adsorption hole corresponding to the vacuum pressure passage, and the body part is attached on a central portion of an upper surface of the adsorption part and an outer oil overflow-preventing part configured to trap silicon oil eluted from the body part is formed at an outer periphery the adsorption part.

Abstract: A test socket including: a testing probe including a lower plunger in contact with a pad; an upper plunger coupled to the lower plunger; a spring probe made of a cylindrical spring for applying elasticity to the lower plunger and the upper plunger; and a contact probe with an upper side contacting a terminal of a test device and a lower side contacting the upper plunger; a socket housing that provides housing holes and accommodates the contact probe and the spring probe so that an upper side of the contact probe protrudes at each housing hole; and a cover that provides cover holes and is fastened to the socket housing so that a lower side of the lower plunger protrudes at each cover hole, wherein the upper plunger provides a sliding groove, the lower plunger provides a pair of sliding protrusions inserted into the sliding groove.

Abstract: A signal transmission connector including a frame base in which a first through hole and a second through hole are alternately formed and a frame including a frame top plate having a third through hole at each position corresponding to the first through hole and covering a top surface of the frame base. A frame bottom plate having a fourth through hole at each position corresponding to the first through hole and covering a bottom surface of the frame base and a conductive part disposed on a conductive part hole including a first through hole, a third through hole, and a fourth through hole and being in the form of a plurality of conductive particles in the elastic insulating material, wherein the frame is made of an inelastic insulating material. An air layer is formed in the second through hole sealed by the frame top plate and the frame bottom plate.

Abstract: An apparatus for testing a semiconductor package, in which a second test circuit board, which is disposed on an upper socket assembly to form a vacuum line in the related art, is removed, and a vacuum guide including two components disposed between an upper socket and an upper package. The vacuum guide including a conductive guide member made of an inelastic insulating material disposed on a conductive region part to prevent an electrical short circuit, and a peripheral guide member made of a metallic material having rigidity and disposed on a peripheral region portion to prevent deformation of a vacuum line, such that a length of a signal path is significantly decreased, high-speed signal transmission is possible. The stable vacuum line is ensured in the upper socket assembly, and vacuum pressure from a vacuum generation device is smoothly applied to a vacuum picker.

Abstract: In an apparatus for testing a package-on-package (POP) type semiconductor package according to the present disclosure, a vacuum picker has vacuum holes that communicate with an insulation pad hole, the vacuum picker includes a body part made of silicone or rubber, and a socket contact part and a package contact part made of any one of polyimide film, engineering plastic, and synthetic resin, and the socket contact part is attached to a mounting groove by means of an adhesive tape, such that the vacuum picker is coupled to an upper socket.

Abstract: A probe tip according to an embodiment of the disclosure may include: a first plating layer including a first metal; a second plating layer disposed on one surface of the first plating layer and including a second metal of a material different from that of the first metal; and a third plating layer disposed on one surface of the second plating layer and including the first metal, wherein each of the first plating layer, the second plating layer, and the third plating layer extends in a length direction of the probe tip, and wherein the first plating layer, the second plating layer, and the third plating layer are stacked in a thickness direction of the probe tip.

Abstract: The purpose of the present disclosure is to provide electro-conductive particles and a signal-transmitting connector having same, wherein the electro-conductive particles are improved to prevent the phenomenon of irregular scrub between the electro-conductive particles and to have improved signal delivery characteristics. Electro-conductive particles according to the present disclosure are provided on a signal-transmitting connector having multiple electroconductive portions supported by an insulating portion made of an elastic insulating material to be spaced apart from each other such that the signal-transmitting connector can be connected to an electronic component and can transmit electric signals.

Abstract: A probe pin having an improved gripping structure is disclosed. The disclosed probe pin includes a pin body including a plurality of holes and positioned at one side, a first extension portion extending upward from an outer side of the pin body, a second extension portion elongated from the other end of the first extension portion, further extending than the pin body in the other direction, and spaced apart from the pin body, and a tip part integrated with the second extension portion and having an end sharply protruding upward from an outer upper end of the second extension portion, in which the second extension portion includes a plurality of elasticity provision holes formed in parallel with an outer peripheral surface of the second extension portion and having different shapes to provide an elastic force that moves a portion of a needle of the tip part.

Abstract: A vertical probe pin that includes: an elastic beam part which is disposed between a lower contact portion in contact with a device to be tested and an upper contact point spaced apart at a predetermined distance from the lower contact point and in contact with a test device. The vertical probe pin is composed of a pair of elastic beams having a predetermined gap in order to be elastically deformed by an external force; and a separation prevention protrusion part provided with separation prevention protrusions protruding from at least one of the pair of elastic beams in order to prevent the elastic beam part from being separated through an upper guide hole.