Abstract: A test socket according to the present disclosure is provided in a test apparatus in which a device under inspection having a terminal is connected to a tester, which generates a test signal, for testing the device under inspection, the test socket includes a nonelastic insulating housing formed of a nonelastic insulating material and provided with a plurality of housing holes formed therein to pass therethrough in a thickness direction; and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, the electrically-conductive part having a lower end portion connected to a signal electrode of the tester placed below the nonelastic insulating housing and an upper end portion disposed in the housing hole to be connected to the terminal of the device under inspection placed on the nonelastic insulating housing.

Abstract: The present invention relates to a history management pad of a semiconductor test socket, a manufacturing method thereof, and a semiconductor test device including the history management pad.

Abstract: The present invention relates to a history management pad of a semiconductor test socket, a manufacturing method thereof, and a semiconductor test device including the history management pad.