Patents Assigned to Tyco Electronics Corporation
  • Patent number: 11351622
    Abstract: A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: June 7, 2022
    Assignees: TE Connectivity Corporation, Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Co. Ltd
    Inventors: Hongzhou Shen, Dandan Zhang, Roberto Francisco-Yi Lu, George J. Dubniczki, Qinglong Zeng
  • Patent number: 10663419
    Abstract: A silicon oil sensor has a conductive layer made of an organic silicone polymer doped with conductive particles.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: May 26, 2020
    Assignees: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics Corporation
    Inventors: Ting Gao, Zhongxi Huang, Lizhang Yang, Jing Wu
  • Patent number: 10498100
    Abstract: An electrical connector assembly includes a housing having a cavity receiving a stack of contact modules each having a dielectric holder having first and second sides extending between a front and a rear and extending between a top and a bottom. Each contact module includes signal contacts having mating portions and mounting portions extending from the bottom for termination to a circuit board. The dielectric holder includes a press tab extending from the first side proximate to the bottom having press surface pressed downward by a seating tool to press the electrical connector assembly on the circuit board proximate to the bottom of the dielectric holder to seat the mounting portions in vias in the circuit board.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: December 3, 2019
    Assignees: TYCO ELECTRONICS CORPORATION, TYCO ELECTRONICS JAPAN G.K.
    Inventors: David Allison Trout, Douglas Edward Shirk, Masaaki Iwasaki, Yoshihiko Kodaira, Masayuki Aizawa
  • Patent number: 10250024
    Abstract: There is provided a cable breakout support, comprising a clamp for clamping to a trunking, and a clip for clipping to a cable breakout of a cable bundle supported in the trunking. Each clamp comprises at least two trunk fittings for fitting to at least two respective bulbous longitudinal edges of the trunking; and a clip fitting for connecting to a respective clip.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: April 2, 2019
    Assignees: Tyco Electronics UK LTD, Tyco Electronics Corporation India PVT Limited
    Inventors: Jonathan Mark Eyles, Praveen Kurundwad, Dharmendra Jain, Srivani Chandoor, Suresh Kumar Muthuswamy, Shivaprakash Kainthaje
  • Patent number: 9758858
    Abstract: A method of manufacturing a coated structure on a substrate includes positioning a substrate in a vapor deposition chamber having a crucible with source material. The method includes evaporating the source material with electron beams from an irradiation source, the evaporated source material being deposited on the substrate as a coating layer. The method includes ablating the coating layer with the electron beams to selectively remove portions of the coating layer leaving a circuit structure on the substrate. The evaporating and ablating are accomplished in situ within the vapor deposition chamber using the same irradiation source.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: September 12, 2017
    Assignees: TYCO ELECTRONICS CORPORATION, TE CONNECTIVITY GERMANY GMBH
    Inventors: Soenke Sachs, Helge Schmidt, Michael Leidner, Eva Henschel, Dominique Freckmann, Marjorie Myers
  • Publication number: 20170233541
    Abstract: A primer layer comprising a polyvinyl butyral resin enhances adhesion of silver nanoparticle inks onto plastic substrates. The primer layer comprises a polyvinyl butyral (PVB) resin having a polyvinyl alcohol content between about 18 wt. % to about 21 wt. %. The PVB resin may also have a glass transition temperature greater than about 70° C. Optionally, the PVB primer layer may further be enhanced by cross-linking using a melamine-formaldehyde resin. Conductive traces formed on plastic substrates having the PVB primer layer exhibit an acceptable cross-hatch adhesion rating with little to no degradation of adhesion being observed after exposure to 4-days salt mist aging or 1-day high humidity aging.
    Type: Application
    Filed: February 12, 2016
    Publication date: August 17, 2017
    Applicant: Tyco Electronics Corporation
    Inventors: Yiliang Wu, Barry C. Mathews, Michael A. Oar, Miguel A. Morales, Leonard Henry Radzilowski, James Paul Scholz, Bruce Foster Bishop, Jerry L. Moore
  • Publication number: 20170238425
    Abstract: A method of fabricating highly conductive (low resistive) features with silver nanoparticle inks at low processing temperature including room temperature is provided, The method includes 1) printing a silver nanoparticle ink to form a conductive feature on a substrate; 2) drying/annealing the printed feature at a temperature compatible with the substrate; 3) treating the annealed feature in a humidity environment; and 4) optionally drying the treated conductive feature. The silver nanoparticle conductive features exhibit a decrease in resistivity from about a factor of 2 up to about a few orders of magnitude after exposure to the humidity treatment.
    Type: Application
    Filed: February 12, 2016
    Publication date: August 17, 2017
    Applicant: Tyco Electronics Corporation
    Inventors: Barry C. Mathews, Yiliang Wu, Miguel A. Morales, Michael A. Oar, Leonard Henry Radzilowski, Juliana B. De Guzman
  • Publication number: 20170236610
    Abstract: An alkoxysilane comprising a functional group is used as an additive in the silver nanoparticle ink, and as an adhesion promoter (or primer layer) on the surface of the substrate in order to enhance the adhesion of silver nanoparticle inks on temperature-sensitive plastic substrates. The combination of the functionalized alkoxysilane both in the ink and on the substrate's surface provides enhanced adhesion after annealing the ink at a low temperature. The adhesion of the annealed films improves from a 0B-3B level to 4B-5B when tested according to ASTM D3359. No degradation of adhesion and no change of color are observed after aging the annealed films in a humidity chamber.
    Type: Application
    Filed: February 12, 2016
    Publication date: August 17, 2017
    Applicant: Tyco Electronics Corporation
    Inventors: Yiliang Wu, Barry C. Mathews, Miguel A. Morales, Leonard Henry Radzilowski, Michael A. Oar, Ranjan Deepak Deshmukh, James Paul Scholz, Bruce Foster Bishop, Jerry L. Moore
  • Publication number: 20170226389
    Abstract: An adhesive arrangement includes an adhesive formed from an adhesive composition, the adhesive composition having a fluoropolymeric material, a functionalized fluoropolymeric material, and a thermoplastic material, and a base layer in contact with the adhesive, the base layer being a perfluoropolymeric material, a composite material, a metal material, or a metallic material. The thermoplastic material is selected from the group consisting of polyamide (PA), polyphenylenesulfide (PPS), polyetheretherketone (PEEK), polyimide (PI), polyimide derivatives such as polyetherimide (PEI), polyaryletherketone (PAEK), polyaryletherketone derivatives, polysulfone, polyethersulfone (PES), polysulfone derivatives, and combinations thereof.
    Type: Application
    Filed: February 10, 2016
    Publication date: August 10, 2017
    Applicant: Tyco Electronics Corporation
    Inventors: Lei Wang, Hyo Chang Yun, Peter J. Dutton
  • Patent number: 9626753
    Abstract: A programmable digital machine vision inspection system is disclosed having a programmable automatic feeding system that supplies elements to be inspected, a programmable robot system, a programmable inspection system, a qualified product receiving container, and an unqualified product receiving container. The programmable robot system has a first vision system with an inspection area, and a robot that grips the supplied element and moves the gripped element to and from the inspection area. The programmable inspection system has a second vision system that identifies features of the elements in the inspection area, and determines whether the element is a qualified product based on the identified features. The qualified product receiving container receives identified qualified products from the robot, and the unqualified product receiving container that receives identified unqualified products from the robot.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: April 18, 2017
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics Corporation, Shenzhen AMI Technology Co. Ltd.
    Inventors: Yingcong Deng, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Zinglong Zeng
  • Publication number: 20170105287
    Abstract: Electronic components and processes of producing electronic components are disclosed. A process of producing a component includes positioning a substrate having a non-planar surface, applying a metalizing material on the surface, and energetically beam-melting the metalizing material to produce a metalized electrical contact on the component. A component includes a substrate having a non-planar surface, and a printed and energetically beam-melted metalized electrical contact positioned on the non-planar surface. Additionally or alternatively, a component includes a substrate having a surface, and a rotationally-applied and energetically beam-melted metalized electrical contact positioned on the substrate.
    Type: Application
    Filed: October 12, 2015
    Publication date: April 13, 2017
    Applicant: Tyco Electronics Corporation
    Inventors: Michael A. Oar, Shallu Soneja, Gokce Gulsoy
  • Publication number: 20170100744
    Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate, a first layer on the substrate, a rapidly solidified layer on the first layer and a conductive layer positioned on the rapidly solidified layer. The rapidly solidified layer includes a metastable phase.
    Type: Application
    Filed: October 12, 2015
    Publication date: April 13, 2017
    Applicant: Tyco Electronics Corporation
    Inventors: Shallu Soneja, Min Zheng, Dov Nitzan, Lavanya Bharadwaj, Barry C. Mathews, Michael A. Oar, Gokce Gulsoy
  • Publication number: 20170100916
    Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.
    Type: Application
    Filed: October 12, 2015
    Publication date: April 13, 2017
    Applicants: Tyco Electronics Corporation, TE Connectivity Germany GmbH
    Inventors: Lavanya Bharadwaj, Barry C. Mathews, Dominique Freckmann, Shallu Soneja, Michael A. Oar, Gokce Gulsoy, Helge Schmidt, Michael Leidner, Soenke Sachs
  • Patent number: 9620869
    Abstract: An electrical contact for an electric connector is disclosed having a looped spring portion. The looped spring portion has a connecting end, a contacting end curved back towards the connecting end, and at least one contacting region positioned on the contacting end.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: April 11, 2017
    Assignees: Tyco Electronics Corporation, TE Connectivity Germany GmbH
    Inventors: Martin Listing, David James Rhein
  • Patent number: 9586342
    Abstract: A method of injecting a sealing gel into a recess of a work piece, comprising steps of: injecting the sealing gel into the recess and stopping the injection of the sealing gel when the sealing gel reaches a first depth less than the total depth of the recess; after the sealing gel has cooled and solidified, continuing the injection of the sealing gel into the recess and stopping the injection of the sealing gel when the sealing gel reaches another depth higher than the first depth; and repeatedly performing the previous step until the cooled and solidified sealing gel in the recess has a top surface beyond a sealing interface surface of the work piece.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: March 7, 2017
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics Corporation
    Inventors: Robert Neil Shaddock, Fengchun Xie, Dandan Zhang, Lvhai Hu
  • Patent number: 9590366
    Abstract: Cable assembly including a mating connector having a plurality of communication terminals. The mating connector is configured to mate with a system connector of a communication system during a loading operation. The cable assembly includes a trailing sub-assembly having an intermediate connector and an external cable that is terminated to the intermediate connector. The cable assembly also includes a flexible cable extension having signal pathways that are terminated to and extend from the intermediate connector to the mating connector. The intermediate connector communicatively interconnects the signal pathways and the external cable. The mating connector is configured to engage a guide track when inserted into the communication system and slide along the guide track toward the system connector along a non-linear path. The flexible cable extension permits the signal pathways to bend while transferring an operative force for mating the system connector and the mating connector.
    Type: Grant
    Filed: July 1, 2015
    Date of Patent: March 7, 2017
    Assignee: Tyco Electronics Corporation
    Inventors: Arash Behziz, Michael David Herring
  • Publication number: 20170057026
    Abstract: An electronic apparatus production system is disclosed. The electronic apparatus production system comprises a transmission rail in the form of a substantially closed loop, a plurality of storage trays circulating on the transmission rail, each of the storage trays comprising a plurality of holding portions to hold a plurality of components with different shapes, an automatic distributor configured to mount the components with different shapes on respective holding portions, and an automatic assembler configured to grip the components on the storage tray.
    Type: Application
    Filed: November 14, 2016
    Publication date: March 2, 2017
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Co. Ltd., Tyco Electronics Corporation, Zhuhai Yingzhi Tech Co., Ltd.
    Inventors: Hongzhou Shen, Dandan Zhang, Kok Wai Wong, George Dubniczki
  • Publication number: 20170056931
    Abstract: An automatic distributor is disclosed. The automatic distributor comprises a base, a storage device mounted on the base to store a plurality of components with different shapes thereon, a recognition device configured to recognize the components stored on the storage device, and a pickup device configured to pick up the components based on a recognition result of the recognition device.
    Type: Application
    Filed: November 14, 2016
    Publication date: March 2, 2017
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Co. Ltd., Tyco Electronics Corporation, Zhuhai Yingzhi Tech Co. Ltd.
    Inventors: Hongzhou Shen, Dandan Zhang, Kok Wai Wong, Roberto Francisco-Yi Lu, George Dubniczki
  • Publication number: 20170050319
    Abstract: A programmable machine vision device includes: an I/O (input/output) layer adapted to connect with various cameras, controllers of various external executing mechanisms and various databases; an algorithm and control layer adapted to process images captured by various cameras and perform an internal logic control; and a GUI (graphic user interface) layer through which a user interacts with the programmable machine vision device. The algorithm and control layer receives the image captured by the camera through the I/O layer, processes and analyzes the received image, makes a judgment, and sends processing, analyzing and judging results to the controller of the external executing mechanism, so as to control the external executing mechanism to execute various machine vision tasks. The programmable machine vision device is adapted to various different brands of cameras, controllers of various different brands of external executing mechanisms, and various different kinds of databases and has good commonality.
    Type: Application
    Filed: August 17, 2016
    Publication date: February 23, 2017
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics Corporation
    Inventors: Lei Zhou, Dandan Zhang, Roberto Francisco-Yi Lu
  • Patent number: 9578767
    Abstract: A cover for an electronic module that has a housing holding a electrical component and a circuit board for operating the electrical component includes a cover plate having an interior surface and an exterior surface. The cover plate has a dielectric body. A majority of at least one of the interior surface and the exterior surface includes a conductive layer to provide electrical shielding for the cover plate. A connector portion is formed integrally with the cover plate defining a unitary structure. The connector portion includes a plurality of contact channels and a shroud extending from the exterior surface that surrounds a receptacle configured to receive a plug connector therein. Contacts are held in corresponding contact channels that have mating ends positioned in the receptacle and mounting ends exposed beyond the interior surface for mounting to the circuit board.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: February 21, 2017
    Assignee: TYCO ELECTRONICS CORPORATION
    Inventor: Charles Raymond Gingrich, III