Patents Assigned to Tyco Electronics Corporation
  • Patent number: 11027431
    Abstract: An automatic calibration method of a robot system comprises providing a ball-rod member including a connection rod and a sphere connected to the connection rod, fixing the connection rod to an end execution tool mounted on a flange of a robot, providing distance sensors around a target point, and sensing an actual distance from each of the distance sensors to the sphere. The robot is controlled to move a center of the sphere to the target point in different poses based on the actual distances sensed by the distance sensors. A first transformation matrix of the center of the sphere with respect to a center of the flange is calculated based on pose data of the robot at the target point. A second transformation matrix of a center of the end execution tool with respect to the center of the flange is calculated based on the first transformation matrix.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: June 8, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation
    Inventors: Yingcong Deng, Dandan Zhang, Roberto Francisco-Yi Lu, Yun Liu, Lvhai Hu
  • Patent number: 11027315
    Abstract: An ultrasonic cleaning system comprises a cleaning tank containing a cleaning liquid, a moving and holding device configured to move a carrier into the cleaning tank and hold the carrier in the cleaning tank, and an ultrasonic wave generator mounted in the cleaning tank. A plurality of fiber optic ferrules are mounted on the carrier and are immersed in the cleaning liquid when the moving and holding device holds the carrier in the cleaning tank. The ultrasonic wave generator is adapted to emit an ultrasonic wave into the cleaning liquid to clean the fiber optical ferrules immersed in the cleaning liquid.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: June 8, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Innogetic Technology Co., Ltd.
    Inventors: Liming Xin, Yun Liu, Lvhai Hu, Dandan Zhang, Roberto Francisco-Yi Lu, Lei Zhou, Kok Wai Wong
  • Patent number: 11018456
    Abstract: A contact module includes a leadframe having signal contacts arranged in pairs. Each signal contact includes a lead having sides extending between inner and outer edges. The contact module includes a dielectric frame supporting the leadframe having a first side and a second side with windows extending through the dielectric frame between the first side and the second side. The windows exposing to air the sides, the inner edges and the outer edges of the corresponding leads along a majority of lengths of the leads. The contact module includes a shield structure having a first ground shield at the first side and a second ground shield at the second side to provide electrical shielding for the signal contacts.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: May 25, 2021
    Assignees: TE CONNECTIVITY CORPORATION, TYCO ELECTRONICS JAPAN G.K.
    Inventors: David Allison Trout, Douglas Edward Shirk, Justin Dennis Pickel, Timothy Robert Minnick, Margaret Mahoney Fernandes, Tetsuya Katano, Masayuki Aizawa
  • Patent number: 11011858
    Abstract: A multiple bussed termination for connecting a plurality of wires comprises a plurality of splices each having a base and a region for holding some of the plurality of wires. The splices are connected to each other by a conductive strip extending from the base of a first splice of the plurality of splices to a remainder of the plurality of splices. The splices are each capable of being crimped to some of the plurality of wires.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: May 18, 2021
    Assignees: TE Connectivity India Private Limited, Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation
    Inventors: Sheng Li, Kurt Allen Randolph, P. K. Senthil Kumar, Yongjian Huang
  • Patent number: 11000912
    Abstract: An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: May 11, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co. Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Patent number: 10999961
    Abstract: A positioning device including a support tab, two pairs of sliding blocks slidably mounted in the support table, a positioning plate extending vertically from on a top of each sliding block, a base on which the support table is supported, a cylinder installed in a chamber of the base, a ball received in the cylinder, a piston rod slidably mounted in the cylinder that pushes the ball to move upward in a vertical direction, so that the ball drives the two pairs of sliding blocks to move away from each other in the first horizontal direction and the second horizontal direction, respectively, until the positioning plates of the two pairs of sliding blocks abut against four inner walls of the opening of the circuit board, respectively, to allow the electronic device to be received in a positioning slot defined by the positioning plates, and a release mechanism.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: May 4, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (China) Ltd., Shenzhen AMI Technology Co., Ltd.
    Inventors: Zhiyong Dai, Dandan Zhang, Roberto Francisco-Yi Lu, Songping Chen, Xiangyou Hou, Qinglong Zeng, Lvhai Hu, Yun Liu
  • Patent number: 10993360
    Abstract: An assembly system comprises a fixing device configured to fix a housing and a pressing mechanism adapted to assemble a contact into the housing. The pressing mechanism includes a fixing block having a contact guiding slot adapted to receive the contact therein and a movable block movably mounted on the fixing block and adapted to press the contact downward. The movable block is moved downward to press the contact received in the contact guiding slot into a contact installation slot of the housing in a condition in which the contact guiding slot of the fixing block is aligned with the contact installation slot of the housing.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: April 27, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Kunshan League Automechanism Co., Ltd., Tyco Electronics Polska Sp. z.o.o.
    Inventors: Yingcong Deng, Jaroslaw Kowalski, Andrzej Przybylski, Jaroslaw Grzebski, Dandan Zhang, Lvhai Hu, Fengchun Xie, Yun Liu, Roberto Francisco-Yi Lu, Haidong Wu, Hui Xiao
  • Patent number: 10663419
    Abstract: A silicon oil sensor has a conductive layer made of an organic silicone polymer doped with conductive particles.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: May 26, 2020
    Assignees: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics Corporation
    Inventors: Ting Gao, Zhongxi Huang, Lizhang Yang, Jing Wu
  • Patent number: 10498100
    Abstract: An electrical connector assembly includes a housing having a cavity receiving a stack of contact modules each having a dielectric holder having first and second sides extending between a front and a rear and extending between a top and a bottom. Each contact module includes signal contacts having mating portions and mounting portions extending from the bottom for termination to a circuit board. The dielectric holder includes a press tab extending from the first side proximate to the bottom having press surface pressed downward by a seating tool to press the electrical connector assembly on the circuit board proximate to the bottom of the dielectric holder to seat the mounting portions in vias in the circuit board.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: December 3, 2019
    Assignees: TYCO ELECTRONICS CORPORATION, TYCO ELECTRONICS JAPAN G.K.
    Inventors: David Allison Trout, Douglas Edward Shirk, Masaaki Iwasaki, Yoshihiko Kodaira, Masayuki Aizawa
  • Patent number: 10250024
    Abstract: There is provided a cable breakout support, comprising a clamp for clamping to a trunking, and a clip for clipping to a cable breakout of a cable bundle supported in the trunking. Each clamp comprises at least two trunk fittings for fitting to at least two respective bulbous longitudinal edges of the trunking; and a clip fitting for connecting to a respective clip.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: April 2, 2019
    Assignees: Tyco Electronics UK LTD, Tyco Electronics Corporation India PVT Limited
    Inventors: Jonathan Mark Eyles, Praveen Kurundwad, Dharmendra Jain, Srivani Chandoor, Suresh Kumar Muthuswamy, Shivaprakash Kainthaje
  • Patent number: 9758858
    Abstract: A method of manufacturing a coated structure on a substrate includes positioning a substrate in a vapor deposition chamber having a crucible with source material. The method includes evaporating the source material with electron beams from an irradiation source, the evaporated source material being deposited on the substrate as a coating layer. The method includes ablating the coating layer with the electron beams to selectively remove portions of the coating layer leaving a circuit structure on the substrate. The evaporating and ablating are accomplished in situ within the vapor deposition chamber using the same irradiation source.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: September 12, 2017
    Assignees: TYCO ELECTRONICS CORPORATION, TE CONNECTIVITY GERMANY GMBH
    Inventors: Soenke Sachs, Helge Schmidt, Michael Leidner, Eva Henschel, Dominique Freckmann, Marjorie Myers
  • Publication number: 20170233541
    Abstract: A primer layer comprising a polyvinyl butyral resin enhances adhesion of silver nanoparticle inks onto plastic substrates. The primer layer comprises a polyvinyl butyral (PVB) resin having a polyvinyl alcohol content between about 18 wt. % to about 21 wt. %. The PVB resin may also have a glass transition temperature greater than about 70° C. Optionally, the PVB primer layer may further be enhanced by cross-linking using a melamine-formaldehyde resin. Conductive traces formed on plastic substrates having the PVB primer layer exhibit an acceptable cross-hatch adhesion rating with little to no degradation of adhesion being observed after exposure to 4-days salt mist aging or 1-day high humidity aging.
    Type: Application
    Filed: February 12, 2016
    Publication date: August 17, 2017
    Applicant: Tyco Electronics Corporation
    Inventors: Yiliang Wu, Barry C. Mathews, Michael A. Oar, Miguel A. Morales, Leonard Henry Radzilowski, James Paul Scholz, Bruce Foster Bishop, Jerry L. Moore
  • Publication number: 20170238425
    Abstract: A method of fabricating highly conductive (low resistive) features with silver nanoparticle inks at low processing temperature including room temperature is provided, The method includes 1) printing a silver nanoparticle ink to form a conductive feature on a substrate; 2) drying/annealing the printed feature at a temperature compatible with the substrate; 3) treating the annealed feature in a humidity environment; and 4) optionally drying the treated conductive feature. The silver nanoparticle conductive features exhibit a decrease in resistivity from about a factor of 2 up to about a few orders of magnitude after exposure to the humidity treatment.
    Type: Application
    Filed: February 12, 2016
    Publication date: August 17, 2017
    Applicant: Tyco Electronics Corporation
    Inventors: Barry C. Mathews, Yiliang Wu, Miguel A. Morales, Michael A. Oar, Leonard Henry Radzilowski, Juliana B. De Guzman
  • Publication number: 20170236610
    Abstract: An alkoxysilane comprising a functional group is used as an additive in the silver nanoparticle ink, and as an adhesion promoter (or primer layer) on the surface of the substrate in order to enhance the adhesion of silver nanoparticle inks on temperature-sensitive plastic substrates. The combination of the functionalized alkoxysilane both in the ink and on the substrate's surface provides enhanced adhesion after annealing the ink at a low temperature. The adhesion of the annealed films improves from a 0B-3B level to 4B-5B when tested according to ASTM D3359. No degradation of adhesion and no change of color are observed after aging the annealed films in a humidity chamber.
    Type: Application
    Filed: February 12, 2016
    Publication date: August 17, 2017
    Applicant: Tyco Electronics Corporation
    Inventors: Yiliang Wu, Barry C. Mathews, Miguel A. Morales, Leonard Henry Radzilowski, Michael A. Oar, Ranjan Deepak Deshmukh, James Paul Scholz, Bruce Foster Bishop, Jerry L. Moore
  • Publication number: 20170226389
    Abstract: An adhesive arrangement includes an adhesive formed from an adhesive composition, the adhesive composition having a fluoropolymeric material, a functionalized fluoropolymeric material, and a thermoplastic material, and a base layer in contact with the adhesive, the base layer being a perfluoropolymeric material, a composite material, a metal material, or a metallic material. The thermoplastic material is selected from the group consisting of polyamide (PA), polyphenylenesulfide (PPS), polyetheretherketone (PEEK), polyimide (PI), polyimide derivatives such as polyetherimide (PEI), polyaryletherketone (PAEK), polyaryletherketone derivatives, polysulfone, polyethersulfone (PES), polysulfone derivatives, and combinations thereof.
    Type: Application
    Filed: February 10, 2016
    Publication date: August 10, 2017
    Applicant: Tyco Electronics Corporation
    Inventors: Lei Wang, Hyo Chang Yun, Peter J. Dutton
  • Patent number: 9626753
    Abstract: A programmable digital machine vision inspection system is disclosed having a programmable automatic feeding system that supplies elements to be inspected, a programmable robot system, a programmable inspection system, a qualified product receiving container, and an unqualified product receiving container. The programmable robot system has a first vision system with an inspection area, and a robot that grips the supplied element and moves the gripped element to and from the inspection area. The programmable inspection system has a second vision system that identifies features of the elements in the inspection area, and determines whether the element is a qualified product based on the identified features. The qualified product receiving container receives identified qualified products from the robot, and the unqualified product receiving container that receives identified unqualified products from the robot.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: April 18, 2017
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics Corporation, Shenzhen AMI Technology Co. Ltd.
    Inventors: Yingcong Deng, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Zinglong Zeng
  • Publication number: 20170105287
    Abstract: Electronic components and processes of producing electronic components are disclosed. A process of producing a component includes positioning a substrate having a non-planar surface, applying a metalizing material on the surface, and energetically beam-melting the metalizing material to produce a metalized electrical contact on the component. A component includes a substrate having a non-planar surface, and a printed and energetically beam-melted metalized electrical contact positioned on the non-planar surface. Additionally or alternatively, a component includes a substrate having a surface, and a rotationally-applied and energetically beam-melted metalized electrical contact positioned on the substrate.
    Type: Application
    Filed: October 12, 2015
    Publication date: April 13, 2017
    Applicant: Tyco Electronics Corporation
    Inventors: Michael A. Oar, Shallu Soneja, Gokce Gulsoy
  • Publication number: 20170100744
    Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate, a first layer on the substrate, a rapidly solidified layer on the first layer and a conductive layer positioned on the rapidly solidified layer. The rapidly solidified layer includes a metastable phase.
    Type: Application
    Filed: October 12, 2015
    Publication date: April 13, 2017
    Applicant: Tyco Electronics Corporation
    Inventors: Shallu Soneja, Min Zheng, Dov Nitzan, Lavanya Bharadwaj, Barry C. Mathews, Michael A. Oar, Gokce Gulsoy
  • Publication number: 20170100916
    Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.
    Type: Application
    Filed: October 12, 2015
    Publication date: April 13, 2017
    Applicants: Tyco Electronics Corporation, TE Connectivity Germany GmbH
    Inventors: Lavanya Bharadwaj, Barry C. Mathews, Dominique Freckmann, Shallu Soneja, Michael A. Oar, Gokce Gulsoy, Helge Schmidt, Michael Leidner, Soenke Sachs
  • Patent number: 9620869
    Abstract: An electrical contact for an electric connector is disclosed having a looped spring portion. The looped spring portion has a connecting end, a contacting end curved back towards the connecting end, and at least one contacting region positioned on the contacting end.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: April 11, 2017
    Assignees: Tyco Electronics Corporation, TE Connectivity Germany GmbH
    Inventors: Martin Listing, David James Rhein