Patents Assigned to Tyco Electronics Japan G.K.
  • Patent number: 11191161
    Abstract: An electronic circuit includes a first printed wiring board, a second printed wiring board and a third printed wiring board. The second printed wiring board is mounted such that one edge of the second printed wiring board abuts on a part mounting surface of the first printed wiring board on which a part is mounted. The third printed wiring board is mounted such that one edge of the third printed wiring board abuts on the part mounting surface. The second and third printed wiring boards are connected to each other in a state where plate thickness directions thereof are oriented in different directions from each other about a normal line to the part mounting surface. Further, at least one of the second printed wiring board and the third printed wiring board is provided with an antenna pattern.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: November 30, 2021
    Assignees: DENSO CORPORATION, TYCO ELECTRONICS JAPAN G.K.
    Inventors: Shiro Koide, Daisuke Dobashi, Yohei Sakurai
  • Patent number: 11183784
    Abstract: An interposer includes a housing and a contact disposed in the housing. The housing has a first face, a second face opposite the first face, and a passageway penetrating the first face and the second face. The contact has a base portion press-fitted in the passageway, a first contact beam extending obliquely with respect to the first face from the base portion, and a second contact beam extending obliquely with respect to the second face from the base portion. The first contact beam extends outward beyond the first face and has a first contact point portion. The second contact beam extends outward beyond the second face and has a second contact point portion. The first contact point portion and the second contact point portion both extend beyond a penetrated region of the passageway in a direction perpendicular to an insertion direction in which the contact is inserted into the passageway.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: November 23, 2021
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Shinichi Hashimoto, Hiroshi Shirai, Masayuki Aizawa
  • Patent number: 11177604
    Abstract: A lance of a connector housing includes a pressed portion disposed at a free end of the lance, a buckling portion disposed closer to a fixed end of the lance opposite the free end than the pressed portion, and a buckling resisting portion disposed between the pressed portion and the buckling portion. The buckling portion buckles when a force exceeding a predetermined tolerance limit is applied to the pressed portion and the buckling resisting portion permits the buckling portion to buckle while reducing buckling of the pressed portion.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: November 16, 2021
    Assignee: Tyco Electronics Japan G.K.
    Inventor: Yuki Tsutsui
  • Patent number: 11177603
    Abstract: An interposer includes a housing having a plurality of through-holes penetrating a first surface and a second surface and a signal contact pair composed of a pair of signal contacts. Each of the signal contacts includes a base portion press-fitted in one of the through-holes, a first contact beam extending from the base portion beyond the first surface, and a second contact beam extending from the base portion beyond the second surface. The pair of signal contacts are positioned adjacently to each other widthwise and are each asymmetrical with respect to a width direction. A first minimum spacing between the first contact beams of the pair of signal contacts is narrower than a second minimum spacing between the base portions of the pair of signal contacts. The signal contact pair has a plane-symmetrical shape with respect to the width direction.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: November 16, 2021
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Shinichi Hashimoto, Hiroshi Shirai, Masayuki Aizawa
  • Patent number: 11114792
    Abstract: A contact includes a pair of side walls, a front end upper wall extending from the side walls, a rear end upper wall extending from the side walls, a lance extending in a rearward direction from a rear end of the front end upper wall, and an extension piece extending in the rearward direction from a rear end portion of the lance. The lance has a catch portion at the rear end portion of the lance. The catch portion is caught in a housing when the contact is inserted into the housing. The extension piece is positioned under the rear end upper wall.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: September 7, 2021
    Assignee: Tyco Electronics Japan G.K.
    Inventor: Yoshihiko Shindo
  • Patent number: 11088477
    Abstract: A board-mounting type shield connector includes a contact, a housing supporting the contact and having a mating opening, a shield shell surrounding the housing and having a first board connection portion in a vicinity of a rear end portion of the shield shell, an enclosure having a plugging passage for plugging of a mating connector, and a ground member supported on the enclosure in a vicinity of a front end portion of the enclosure. The plugging passage opens in a frontward direction and communicates with the mating opening. The first board connection portion is connected to a ground pattern on a circuit board. The ground member has a second board connection portion connected to the ground pattern.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: August 10, 2021
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Tohru Yamamoto, Hitoshi Horita
  • Publication number: 20210242633
    Abstract: A connection module includes a first assembly and a second assembly. The first assembly has a rest portion for resting thereon an exposed portion of a covered electrical wire for differential signal transmission. A cable accommodates the covered electrical wire in a jacket. The exposed portion is not covered with the jacket, exposing a covering of the covered electrical wire. The second assembly has a presser portion pressing the exposed portion rested on the rest portion against the rest portion. A position of the exposed portion is determined by combining the first assembly with the second assembly.
    Type: Application
    Filed: January 28, 2021
    Publication date: August 5, 2021
    Applicant: Tyco Electronics Japan G.K.
    Inventor: Kentaro Yoshimura
  • Publication number: 20210234299
    Abstract: A bracket includes an upper bracket and a lower bracket. The upper bracket and the lower bracket support a supported body from above and below between the upper bracket and the lower bracket. The lower bracket has a pair of lateral lower bracket sidewall portions overlapping with a pair of lateral upper bracket sidewall portions of the upper bracket. The lateral lower bracket sidewall portions catch with the lateral upper bracket sidewall portions to catch the lower bracket on the upper bracket.
    Type: Application
    Filed: January 21, 2021
    Publication date: July 29, 2021
    Applicant: Tyco Electronics Japan G.K.
    Inventors: Tatsuki Watanabe, Katsuhiko Kobayashi
  • Patent number: 11038301
    Abstract: A connector assembly includes a plurality of circuit boards and a bracket retaining the plurality of circuit boards. The circuit boards each have a plugging portion to be plugged into a mating connector and each have a first main face facing a second main face of an adjacent circuit board of the plurality of circuit boards. The bracket retains the plurality of circuit boards with the plugging portions facing downward and with each of the circuit boards capable of making a predetermined amount of independent movement in a pair of directions in a horizontal plane.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: June 15, 2021
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Tatsuki Watanabe, Katsuhiko Kobayashi
  • Publication number: 20210159617
    Abstract: A contact includes a base portion, a cold-weld portion extending upward from the base portion and having a cold-weld slot into which an electric wire is configured to be cold-welded, a trailing portion extending downward by being folded back downward from an upper end of the cold-weld portion, and a contact portion extending from a lower end of the trailing portion. The trailing portion has a press-fitted portion below the cold-weld slot that is press-fitted into the housing. The contact portion makes contact with a mating contact by receiving the mating contact in a space between the contact portion and the base portion.
    Type: Application
    Filed: November 23, 2020
    Publication date: May 27, 2021
    Applicant: Tyco Electronics Japan G.K.
    Inventors: Tatsuo Yasui, Hiroaki Kikuchi, Masaaki Iwasaki, Chihiro Hikage
  • Publication number: 20210159623
    Abstract: A circuit board includes a terminal area projecting from an end face of the circuit board. The terminal area is flush with a front side and a back side of the circuit board and has a thickness equal to the circuit board. The terminal area has a plurality of sides covered with an electrically conductive material, the sides including a first surface flush with a front side of the circuit board, a second surface flush with a back side of the circuit board, and a pair of side surfaces that intersect the first surface and the second surface.
    Type: Application
    Filed: February 4, 2021
    Publication date: May 27, 2021
    Applicant: Tyco Electronics Japan G.K.
    Inventors: Yohei Sakurai, Daisuke Dobashi
  • Patent number: 11018456
    Abstract: A contact module includes a leadframe having signal contacts arranged in pairs. Each signal contact includes a lead having sides extending between inner and outer edges. The contact module includes a dielectric frame supporting the leadframe having a first side and a second side with windows extending through the dielectric frame between the first side and the second side. The windows exposing to air the sides, the inner edges and the outer edges of the corresponding leads along a majority of lengths of the leads. The contact module includes a shield structure having a first ground shield at the first side and a second ground shield at the second side to provide electrical shielding for the signal contacts.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: May 25, 2021
    Assignees: TE CONNECTIVITY CORPORATION, TYCO ELECTRONICS JAPAN G.K.
    Inventors: David Allison Trout, Douglas Edward Shirk, Justin Dennis Pickel, Timothy Robert Minnick, Margaret Mahoney Fernandes, Tetsuya Katano, Masayuki Aizawa
  • Publication number: 20210126394
    Abstract: A socket includes a flat-plate-shaped housing, a plurality of contacts supported by the flat-plate-shaped housing, a frame attached to the flat-plate-shaped housing and extending along the flat-plate-shaped housing, a plurality of first solder balls disposed on a lower surface of the flat-plate-shaped housing and facing a circuit board, and a plurality of second solder balls disposed on the lower surface of the flat-plate-shaped housing. The frame defines, in an in-plane direction of the flat-plate-shaped housing, a position of an electronic component having a lower surface including a plurality of pads configured to contact the contacts upon the electronic component being mounted. The first solder balls electrically connect to each of the contacts and electrically connect to the circuit board. The second solder balls are not electrically connected to the contacts.
    Type: Application
    Filed: October 29, 2020
    Publication date: April 29, 2021
    Applicant: Tyco Electronics Japan G.K.
    Inventors: Naoki Hashimoto, Shinichi Hashimoto
  • Publication number: 20210126384
    Abstract: A crimp structure includes a crimp section having an insulated ferrule disposed inside an outer conductor of a shielded cable. The outer conductor and a ground contact placed on an outer periphery of the outer conductor are crimped.
    Type: Application
    Filed: October 26, 2020
    Publication date: April 29, 2021
    Applicant: Tyco Electronics Japan G.K.
    Inventor: Kazuhiro Mizukami
  • Patent number: 10985489
    Abstract: A connector comprises a terminal member, an elastic member, and a housing having a cavity receiving the terminal member and the elastic member. The terminal member has a contacting face and a back face opposite to the contacting face. The contacting face has a serration region with a serration formed thereon and adapted to contact an electrical wire. The elastic member is adapted to press a pressed region of the back face opposite to the serration region.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: April 20, 2021
    Assignee: Tyco Electronics Japan G.K.
    Inventor: Ken Sakai
  • Patent number: 10978820
    Abstract: An integrated circuit socket includes a housing having a flat plate portion and a plurality of contacts disposed in the housing. The contacts each have a contact beam projecting outwardly from a first surface of the housing and a retained portion disposed in a passageway in the flat plate portion. The contact beam extends from the retained portion. The retained portion has a base portion with a flat-plate shape and a pair of side portions extending at an angle with respect to the base portion on a pair of opposite sides of the base portion. A cross-section of the retained portion parallel to the first surface has a U-shape.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: April 13, 2021
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Shinichi Hashimoto, Masayuki Aizawa, Hiroshi Shirai, Naoki Hashimoto
  • Publication number: 20210091482
    Abstract: A connector includes a contact and a housing having a first confirmation window. The contact is not visible through the first confirmation window prior to reaching a predetermined plug-in reference position upon being plugged into the housing. A front end of the contact is visible though the first confirmation window upon reaching the predetermined plug-in reference position.
    Type: Application
    Filed: September 17, 2020
    Publication date: March 25, 2021
    Applicant: Tyco Electronics Japan G.K.
    Inventor: Tadashi Kumamoto
  • Patent number: D926691
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: August 3, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics Japan G.K.
    Inventors: Ken Sakai, Ramachandra Pai B. Rajendra, Yulin Feng, Lei Pan, Tian Xia
  • Patent number: D926692
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: August 3, 2021
    Assignees: Tyco Electronics Japan G.K., Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Ken Sakai, Ramachandra Pai B. Rajendra, Yulin Feng, Lei Pan, Tian Xia
  • Patent number: D926700
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: August 3, 2021
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Keita Terajima, Takashi Shimoyasu