Patents Assigned to Unitika Ltd.
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Publication number: 20230272176Abstract: The objective of the present invention is to provide a stretched polyamide film which is excellent in laminatability, lamination strength, mechanical properties and shock resistance property and which has effects to prevent goods being broken and protect a content from vibration and shock at the time of transportation when used a various packaging materials. The present invention relates to a stretched polyamide film, wherein a main constituent is nylon 6; at least one surface layer meets the following conditions (1) and (2); and the stretched polyamide film meets the following condition (3): (1) a relaxation degree of a surface layer orientation measured by IR spectroscopy is within a range of not less than 0.3 and not more than 0.5; (2) a crystallization degree of a surface layer measured by IR spectroscopy is within a range of not less than 1.0 and not more than 1.4; (3) a heat shrinkage rate (%) in TD direction at 160° C. for 10 minutes is within a range of not less than 0.6 and not more than 4.Type: ApplicationFiled: November 16, 2021Publication date: August 31, 2023Applicant: UNITIKA LTD.Inventors: Takashi Okabe, Nobuyasu Okumura, Kumi Ashihara
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Publication number: 20230257539Abstract: [Problem] To provide a method for producing a polyamide resin film by using a poi amide resin obtained through polymerization of a regenerated monomer used as a recycled material. [Solution] Provided is a method for producing a polyamide resin film, including: a step of producing a monomer from a raw material (A) for depolymerization, (2) a step of producing a polyamide resin (B) through polymerization using a raw material containing the monomer, (3) a step of refining the polyamide resin (B), and (4) a step of producing an unstretched film using a starting material containing the refined polyamide resin (B), and stretching the unstretched film.Type: ApplicationFiled: April 28, 2023Publication date: August 17, 2023Applicant: UNITIKA LTD.Inventors: Akiko Kurosawa, Atsuko Noda
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Publication number: 20230249985Abstract: The present invention is a water purifier cartridge to be attached to a container including a water storage portion having an opening at an upper portion thereof, and a lid that has an outlet for discharging water stored in the water storage portion and is configured to close the opening of the water storage portion, the cartridge including: a support including a circumferential wall portion formed in a cylindrical shape and a closing portion that closes one end portion in an axial direction of the circumferential wall portion and in which an air hole is formed, another end portion in the axial direction being open; and a filter member that is supported by the support so as to extend along the circumferential wall portion.Type: ApplicationFiled: June 9, 2021Publication date: August 10, 2023Applicant: UNITIKA LTD.Inventor: Shinji TANIGUCHI
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Publication number: 20230113079Abstract: To provide a biaxially stretched polyester resin film that has excellent properties equal to or better than those of biaxially stretched polyester film that does not use recycled raw material, and in particular that has an excellent flexural resistance in low-temperature environments. A biaxially stretched polyester resin film that characteristically satisfies both of the following properties (1) and (2): (1) in differential scanning calorimetry (DSC), after heating from 25° C. to 300° C. at a heating rate of 20° C./minute and holding for 10 minutes at 300° C., the temperature of crystallization during cooling at a cooling rate of 40° C./minute is 160° C. to 180° C.; and (2) the number of pinholes after the execution of 200 repetitive cycles of a flexural fatigue test in a ?10° C. atmosphere using a Gelbo Flex Tester is not more than 10/500 cm2.Type: ApplicationFiled: March 26, 2021Publication date: April 13, 2023Applicants: UNITIKA LTD., NIPPON ESTER CO., LTD., UNITIKA TRADING CO., LTD.Inventors: Goro Araki, Hiroshi Ashihara, Hazumu Nagano
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Publication number: 20230089078Abstract: A polyester resin comprises a dicarboxylic acid component and a glycol component, wherein the glycol component contains ethylene glycol together with diethylene glycol and triethylene glycol, and a content of triethylene glycol in the glycol component is more than 0.1 mol % and 5.5 mol % or less.Type: ApplicationFiled: February 24, 2021Publication date: March 23, 2023Applicants: UNITIKA LTD., NIPPON ESTER CO., LTD.Inventors: Yumeto Fukubayashi, Yuta Tenma
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Patent number: 11608427Abstract: The present invention provides a resin composition having high heat-resisting properties, with which a shaping can be performed in accordance with designed sizes using a fused deposition modeling method-3D printer, and from which a shaped object having a small warpage and small changes in sizes due to water can be obtained. The present invention relates to a resin composition for a shaping material of a fused deposition modeling method-3D printer, comprising cellulose fibers in a polyamide.Type: GrantFiled: October 29, 2018Date of Patent: March 21, 2023Assignee: UNITIKA LTD.Inventors: Miho Nakai, Azusa Usui, Shohei Kumazawa, Shota Noguchi, Fumio Matsuoka, Hiroo Kamikawa
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Publication number: 20230054022Abstract: To provide a method for producing a polyamide resin film by using a polyamide resin obtained through polymerization of a regenerated monomer used as a recycled material. Provided is a method for producing a polyamide resin film, including: (1) a step of producing a monomer from a raw material (A) for depolymerization, (2) a step of producing a polyamide resin (B) through polymerization using a raw material containing the monomer. (3) a step of refining the polyamide resin (B), and (4) a step of producing an unstretched film using a starting material containing the refined polyamide resin (B), and stretching the unstretched film.Type: ApplicationFiled: January 22, 2021Publication date: February 23, 2023Applicant: UNITIKA LTD.Inventors: Akiko Kurosawa, Atsuko Noda
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Patent number: 11525220Abstract: An object of the present invention is to provide a process for producing fiberous board with which fiberous board exhibiting high bending strength and high stiffness at a wide range of heating temperatures and a wide range of compressing and heating times. In the present invention, fiberous board having an initial flexural modulus of at least 300 MPa in three point bending test is obtained by forming a web by correcting sheath-core composite fibers of which a core component is formed from a copolymer of ethylene glycol and terephthalic acid and the sheath component is formed from ethylene glycol, adipic acid, terephthalic acid, isophthalic acid; and/or diethylene glycol. The web is then compressed in a direction of thickness and heated, so that the sheath component softens and melts and the sheath-core composite fibers are melt bonded together and molded into a flat plate shape.Type: GrantFiled: April 18, 2018Date of Patent: December 13, 2022Assignee: UNITIKA LTD.Inventors: Kazutoshi Hanaya, Masaya Akao, Yusuke Nagatsuka
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Publication number: 20220387935Abstract: The filter module case includes a casing, a cap, a first layer, and a second layer. The casing has a cylindrical shape. The cap has a cylindrical shape and defines a passage providing communication between the inside and the outside of the casing and receives an end portion of the casing and is bonded to the casing. The first layer is closer to an end and faces an outer peripheral surface of the casing and the inner wall surface of the cap. The second layer is closer to the center and faces the outer peripheral surface of the casing and the inner wall surface of the cap. The casing and the cap have organic solvent resistance. The first layer is formed of a first adhesive with organic solvent resistance. The second layer is formed of a second adhesive that has an affinity for hard-to-adhere materials and has a higher elasticity.Type: ApplicationFiled: October 2, 2020Publication date: December 8, 2022Applicant: UNITIKA LTD.Inventor: Kuniko INOUE
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Publication number: 20220380539Abstract: The present invention provides a resin composition capable of giving a molded body having a metallic color tone and excellent in surface hardness, surface glossiness, mechanical properties, and flow mark reducing property. The present invention relates to a polyamide resin composition comprising 100 parts by mass of a polyamide (A), 0.1 to 50 parts by mass of a cellulose fiber (B) having an average fiber diameter of 10 ?m or less and 0.1 to 12 parts by mass of a metallic pigment (C).Type: ApplicationFiled: October 6, 2020Publication date: December 1, 2022Applicant: UNITIKA LTD.Inventors: Tsuyoshi TOMOTOSHI, Shota NOGUCHI, Miho NAKAI, Hiroo KAMIKAWA
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Publication number: 20220356316Abstract: A flexible polyamide film obtained by forming a polyamide including a unit formed from an aliphatic dicarboxylic acid (A1) having 18 or more carbon atoms and/or a unit formed from an aliphatic diamine (B1) having 18 or more carbon atoms, wherein the polyamide has a total content of 10 to 92% by mass of the unit formed from (A1) and the unit formed from (B1), and the film has a melting point of 240° C. or higher.Type: ApplicationFiled: November 10, 2020Publication date: November 10, 2022Applicant: UNITIKA LTD.Inventors: Toshio Taki, Takeshi Maruo, Makoto Nakai, Yusuke Yagi
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Publication number: 20220220256Abstract: A semi-aromatic polyamide film having a thermal shrinkage factor in the longitudinal direction of the film, SMD, of ?1.0 to 1.5% and a thermal shrinkage factor in the width direction of the film, STD, of ?1.0 to 1.5% as measured under the conditions of 250° C. and 5 min, a tensile breaking elongation of 70% or more in the longitudinal direction and the width direction, and a haze of 14% or less.Type: ApplicationFiled: May 13, 2020Publication date: July 14, 2022Applicant: UNITIKA LTD.Inventors: Takashi Okabe, Masafumi Yamamoto, Sumito Kihara
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Publication number: 20220195187Abstract: A polyamide resin composition including a semi-aromatic polyamide (A) having a melting point of 290 to 330° C. and a fibrous reinforcing material (B), wherein the polyamide resin composition has an amount of creep strain of 2.0% or less in the flow direction after a lapse of 100 hours under the measurement conditions of a temperature of 100° C. and a tensile load of 75 MPa.Type: ApplicationFiled: April 17, 2020Publication date: June 23, 2022Applicant: UNITIKA LTD.Inventors: Miho Asai, Junichi Mii
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Patent number: 11326032Abstract: Provided is a polyamide film which is a stretched film including a polyamide resin composition containing 1 to 10% by mass of a polyester thermoplastic elastomer, wherein the polyamide film satisfies all of the following conditions (A) to (C): (A) elastic moduli in MD and TD of the film are each 1.0 to 2.3 GPa; (B) a ratio between the elastic moduli in MD and TD of the film (MD/TD) is 0.9 to 1.5; and (C) a haze of the film is 7% or less.Type: GrantFiled: December 26, 2018Date of Patent: May 10, 2022Assignee: Unitika Ltd.Inventors: Takayoshi Okuzu, Akiko Hamamoto, Ken Akamatsu
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Publication number: 20220106435Abstract: The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule.Type: ApplicationFiled: January 21, 2020Publication date: April 7, 2022Applicant: UNITIKA LTD.Inventors: Ayumi YANAKA, Yumeto FUKUBAYASHI, Takatoshi MURAKAMI
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Publication number: 20220088910Abstract: A laminate including one or more layers of a layer consisting of a polyimide resin and a layer consisting of a polyamide resin, respectively, in which a puncture strength is 0.60 N/?m or more, and a retention rate of edge tear resistance measured at a bent portion after a bend test is 70% or more.Type: ApplicationFiled: December 25, 2019Publication date: March 24, 2022Applicant: UNITIKA LTD.Inventors: Guangzhu Li, Toshihiro Ogino, Atsuko Noda
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Publication number: 20220073731Abstract: The present invention provides a polyarylate resin composition sufficiently excellent in heat resistance, transparency, heat discoloration resistance and moist heat resistance, and a molded article made of the same. The present invention relates to a polyarylate resin composition containing 0.005˜5 parts by mass of a silane compound (C) with a boiling point of 200° C. or more, based on 100 parts by mass of the total of a polyarylate resin (A) and a polycarbonate resin (B), a content ratio of the polyarylate resin (A) and the polycarbonate resin (B) being 5/95 to 95/5 (mass ratio).Type: ApplicationFiled: February 12, 2020Publication date: March 10, 2022Applicant: UNITIKA LTD.Inventors: Toshiki NAGAHATA, Takatoshi MURAKAMI
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Publication number: 20220064443Abstract: A polyamide resin composition including 100 parts by mass of a polyamide (A), 3.0 to 10.0 parts by mass of a polyalcohol (B), and 0.0 to 4.0 parts by mass of an aromatic polycarboxylic acid (C), wherein the total amount of a carboxyl group of (A) and (C) is 80 to 600 mmol per 1 kg in total of (A), (B), and (C).Type: ApplicationFiled: May 13, 2020Publication date: March 3, 2022Applicant: UNITIKA LTD.Inventors: Yusuke Yagi, Yuki Takubo, Tatsunori Masaki
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Publication number: 20220056229Abstract: A laminated film having a resin layer laminated on at least one surface of a base film. The laminated film is characterized by: the base film being a semi-aromatic polyamide film that has been at least uniaxially stretched; the resin layer having a thickness of 0.03 to 0.5 ?m; and the close adhesion between the base film and the resin layer, according to the cross-cut method described in JIS K 5600, being 95% or more.Type: ApplicationFiled: February 19, 2020Publication date: February 24, 2022Applicant: UNITIKA LTD.Inventors: Takashi Okabe, Nobuyasu Okumura, Masafumi Yamamoto, Kumi Ashihara, Midori Shimomura, Yoshimi Ueno
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Patent number: 11254814Abstract: The present invention is to provide a resin composition capable of producing a molded product sufficiently excellent in hydrolysis resistance and mold release characteristics and having an excellent balance between heat resistance and fluidity, even if a heat stabilizer and a mold release agent are contained. The present invention relates to a resin composition, comprising: (A) a polyarylate resin; (B) a melt-polymerized polycarbonate resin; (C) a specific phosphite compound; and (D) a dipentaerythritol fatty acid ester, a mass ratio (A/B) of the (A) polyarylate resin and the (B) melt-polymerized polycarbonate resin being from 2/98 to 98/2, and the resin composition having a Vicat softening point of 140° C. or higher.Type: GrantFiled: April 21, 2020Date of Patent: February 22, 2022Assignee: UNITIKA LTD.Inventor: Yutaka Nabeshima