Abstract: Under the direction of a controller, taped axial lead components are sequentially advanced to a forming area at which the components are severed from the taped ends of their leads, formed into a hairpin-type configuration, and positively driven into engagement with conveyor-mounted carrier clips for subsequent handling by radial lead apparatus.

Abstract: In accordance with one embodiment of the invention, solder masking material is pressurized by means of a fluid pump to approximately 250 psi and a high speed valve is used to turn the flow on and off rapidly in order that small "shots" of fluid are propelled from a tip, through the air, to selected portions of a circuit board. The selected areas of the circuit board to be masked are situated oppositely from the tip, as by a XY positioning system for the tip and/or the circuit board. The drops of masking material, which form upon impinging of the shots onto the circuit board, may be varied in volume and diameter. Where needed, a continuous bead of masking material may be formed on the circuit board by spacing the dots sufficiently close together.

Abstract: The present invention involves a method and apparatus for feeding axial lead components directly from a sequencer to an insertion head, while eliminating direct supplying of components to the insert head via a prededicated inventory such as reeled tapes or films having components attached thereto in a predetermined sequence. Preferably, an endless chain conveyor carries the components to the insert head in chain clips which positively retain the leads thereof while allowing centering of the bodies and electrical function testing of the components just prior to insertion of the leads into corresponding holes of a circuit board. Direct supply from a sequencer having a series of individually and programmably controlled dispenser heads provides for quick and flexible variation of an input sequence without manual intervention.

Abstract: Described is a machine for pre-gluing raw circuit surfaces of printed circuit boards (P.C. boards) at an adhesive station and properly positioning the P.C. boards at a placement station for placement of leadless electronic components (chips) onto the adhesive. A carousel provides program preselected vertical supply of taped components to a feeder assembly which feeds individual chips onto a nozzle of a turret-type vacuum head at a pick-up station. The turret-type head has four nozzles spaced 90.degree. apart about the central axis of the head. As the turret is rotated, a chip is transported by a nozzle, sequentially, from the pick-up station to a centering and testing station, a centering and orienting station, and a placement station. Located between the testing and orienting stations is a chip removal station for ejecting defective or inverted chips. Sensors are located at the adhesive and placement stations to detect defective P.C. boards so that they may be bypassed.

Abstract: Electrical components of various sizes and shapes are appropriately accommodated and positioned at a gauging station, at which lead straightening and testing of electrical functioning of each component is performed. An alternate embodiment provides for distinguishing between acceptable and unacceptable components by differentiating between component lead tips and a contrasting background, through use of an optical scanner.

Abstract: A method and apparatus is disclosed for handling single in-line packaged (SIP) components wherein the components are individually selected from a plurality of magazine supplies, transported to a gauging station at which the leads thereof are straightened and aligned and electrical functioning of the component is tested, and transferred from the gauging station to an insert station at which the leads thereof are inserted into corresponding holes of a printed circuit board.

Abstract: Under direction of a machine controller, conveyor mounted clips sequentially present electrical components to an unload station while holding the components by their leads, and the components are centered relative to a loader assembly by lateral displacement of the clip relative to a loader axis. Thereafter, a loader assembly clamps the leads of the component and transfers the component to a load station and into engagement with the jaws of an insertion head. The loader assembly is then actuated to drive the leads of the component into the jaws of the insertion head for subsequent insertion of the leads into holes of a printed circuit board. The component, gripped in the jaws of the insert head, is oriented about an insert axis, according to a controller and prior to insertion.

Abstract: A method and apparatus are provided for consistently handling, inserting, and driving wire pins of reduced cross-section into circuit board holes and the like while retaining control of the pins and avoiding breakage of the apparatus due to constraints imposed thereon by such reduced cross-section.

Abstract: A feed assembly is engageable with feed holes spaced along the length of a taped supply of electrical components in order to index the taped components to a pick-up station and aid in transfer of the components from the tape to a turret-type vacuum head at the pick-up station. Cyclical actuation of the feed assembly actuates a cutter for that portion of the tape which has been emptied of the components.

Abstract: The invention is directed to a method and apparatus for handling a component having a body and one or more members protruding therefrom, such that the protruding members are put in proper, mating registration with corresponding holes of a substrate or the like. The components are handled during transport and insertion by gripping of the bodies thereof, and the method and apparatus of the invention compensates for any offset in X, Y, and .theta. between the profile of the body and a particular pattern or location of the protruding members relative to the profile of the body.

Abstract: Constant supply of electronic components to a processing station is effected by a reservoir and component supply tubes indexed to sequentially unload into the reservoir automatically, as the need arises. Plural component supply tubes are mounted in a cartridge assembly at each station of a multistation processing machine. Upon command of a controller and in response to a low part sensor of a reservoir at each station, the cartridge is indexed to the next tube in order to unload the components of that tube into the reservoir. Each station includes a separate indexing mechanism for each respective cartridge, and a carriage is translated to a position adjacent the indexing mechanism of each station, upon command, in order to effect such indexing.

Abstract: An apparatus is provided for trimming and forming the leads of multi-lead electronic components such as dual in-line package (DIP) components, wherein component leads extending through the holes of a circuit board are trimmed and formed on the underside thereof, with the presence or absence of each lead being detected after trimming and during forming thereof.

Abstract: A method and apparatus is disclosed for sequentially centering off-center bodies of a series of taped electrical components such that the component leads may be formed or bent closely to the bodies to realize denser population of the components on a circuit board. Fragile-lead components are protected by trimming the leads to remove the components from the tapes prior to centering the bodies.

Abstract: A method and apparatus for connecting wire to insulation displacement-type, circuit board-mounted electrical contacts comprises automatic positioning and orienting of individual contacts relative to a wire insertion head. A portion of wire is fed from a supply to the tip of a pusher which inserts this portion into fingers of the contact; another contact is positioned and oriented relative to the pusher to receive a second portion of the wire and provide a wire run between the contacts. The wire run can be terminated at the last contact without repositioning the contact and pusher relative to each other, with the remaining supply wire being prepared for another insertion.

Abstract: Described is a machine for pre-gluing raw circuit surfaces of printed circuit boards (P.C. boards) at an adhesive station and properly positioning the P.C. boards at a placement station for placement of leadless electronic components (chips) onto the adhesive. A carousel provides program preselected vertical supply of taped components to a feeder assembly which feeds individual chips onto a nozzle of a turret-type vacuum head at a pick-up station. The turret-type head has four nozzles spaced 90.degree. apart about the central axis of the head. As the turret is rotated, a chip is transported by a nozzle, sequentially, from the pick-up station to a centering and testing station, a centering and orienting station, and a placement station. Located between the testing and orienting stations is a chip removal station for ejecting defective or inverted chips. Sensors are located at the adhesive and placement stations to detect defective P.C. boards so that they may be bypassed.

Abstract: An apparatus is provided for feeding components by vibration, halting the feed of the components at an unload station, and picking-up the components by an unloader at the unload station in which the pick-up head and the means for stopping the feed of components is isolated from the vibrations of the feeder so that a uniform, accurate pick-up of components by the unloader is facilitated.

Abstract: An apparatus having primary and secondary camming surfaces for controlling the opening and closing of guide jaws of an insertion head, such that a greater population density of a circuit board with electronic components is achieved.

Abstract: Electrical components are processed faster and more reliably with an improved centering device. In one embodiment, thread slack is provided in the relatively slow adjuster used to preset a component processing machine to a particular insertion span, and a faster acting adjuster makes use of this thread slack to vary the preset span and center the component body in the machine.

Abstract: Under direction of a machine controller, an endless chain conveyor is incrementally passed by a plurality of loader heads. The loader heads receive a series of components taped on a reel supplied substrate, sever individual taped components from the supply, and load the individual taped components onto clip carriers of the endless conveyor, on command, in a preferred sequence. The clip carrier mounted components are then indexed past a cutter assembly for trimming the lengths of the leads and removing the substrate, and a positioning disc assembly for positioning the components in the clip carriers before being passed to a rotary transfer assembly. The rotary transfer assembly removes individual components from the conveyor and rotates to an unload position above a linear loader, which laterally transfers the components from the rotary transfer to an insert head assembly.

Abstract: An electronic component lead cutting and clinching mechanism having means for operating substantially simultaneously on a plurality of aligned leads. The cutting edges are angularly oriented to align with the component leads and raised to a position adjacent the undersurface of the wiring board into which the component leads have been inserted. Pneumatic cylinders actuate the mechanism.