Abstract: DIP components are released from storage in a generally vertical chute when a spring-biased first finger blocking the chute exit is pivoted away. A second finger presses laterally on a prong of the second lowest stored component and limits dispensing to a single component for each actuation of the first finger.
Abstract: An apparatus for placement of electronic components on a fluxed hybrid circuit substrate. In accordance with an automated program, the apparatus at a single work station places with high precision a plurality of chips of various types and physical and electrical sizes on a single substrate. Components are successively placed by a pair of hollow pick and placement spindles operating alternately and having motion in the X-Y planes. Precise location of stored chips is not required; the apparatus orients and centers each chip after selection and prior to placement.
Type:
Grant
Filed:
December 8, 1977
Date of Patent:
May 1, 1979
Assignee:
Universal Instruments Corporation
Inventors:
Phillip A. Ragard, Roy M. Whiting, Michael D. Snyder
Abstract: An apparatus for simultaneously cutting and clinching both parallel rows of leads of DIP type electronic components. The apparatus operating adjacent the undersurface of a printed circuit board into which component leads have been inserted includes a cutter capable of clinching the lead rows either inward toward each other or outward.
Abstract: An electronic component lead cutting and clinching mechanism having means for operating substantially simultaneously on a plurality of aligned leads. The cutting edges are angularly oriented to align with the component leads and raised to a position adjacent the undersurface of the wiring board into which the component leads have been inserted. Pneumatic cylinders actuate the mechanism.
Abstract: A device for centering chip components attached to the tip of a pick and place spindle after selection from storage and prior to placement on a substrate. The need for precisely stored component chips is eliminated. A vacuum in the hollow spindle tip holds the component chip, while, in turn, cam-driven feet and fingers attached to the spindle housing push the component chip to a centered position on the spindle.
Abstract: A computer controls a plurality of satellite machines in real time via a single bus comprised of undedicated, continuous transmission lines terminated at both ends in matching impedances. Each machine coupled to the bus is addressed and commanded during every computer cycle, responding only to signals directed to its address. When a machine is not electrically powered the computer provides an internal signal; computer cycles are never interrupted; continuous control of all other machines is maintained. Any number and mixed types of machines may operate from the bus simultaneously. Machines may be added or removed from bus, and machine programs may be added, removed or modified without interrupting operation of the other machines. Automatic safety reset is provided for machine or computer failure.
Type:
Grant
Filed:
April 4, 1977
Date of Patent:
November 7, 1978
Assignee:
Universal Instruments Corporation
Inventors:
Gary D. Johnson, Michael M. Levie, Donald R. Freese, Robert W. Lee, Eldred H. Paufve
Abstract: A digitally controlled two legged bridge comprising a component under test and a reference resistor selected from a decade ladder as a function of the exponent of the value of the component under test. A drive signal, whose amplitude is a function of the significant digits of the value of the component under test, and a reference signal are connected to selected points on the bridge in the appropriate waveform as a function of the component under test. The output of the bridge is fed back to the drive signal to balance the bridge and is compared with acceptable percentage error levels, for the component under test.
Abstract: An apparatus for sequentially feeding non-axial lead electrical components in their manufacturing strips from a magazine to a forming station where they are removed, bent into a substantially axial lead configuration and taped between two pairs of continuous ribbons of tape. The leads are straightened while in the manufacturing strip by being placed under tension.
Type:
Grant
Filed:
September 1, 1976
Date of Patent:
June 14, 1977
Assignee:
Universal Instruments Corporation
Inventors:
Albert W. Zemek, Robert H. Holmes, David L. Merithew
Abstract: A pair of pivoting, spring-loaded blades positioned in the path of travel of a series of electronic components on a continuous conveyor, center the components on the conveyor; and a plurality of free-moving fingers rest on the components in order to maintain a centered condition as the components are conveyed into the taping mechanism of a component taping machine.
Type:
Grant
Filed:
May 14, 1976
Date of Patent:
May 3, 1977
Assignee:
Universal Instruments Corporation
Inventors:
Erwin Frederick Bates, Roy Marvin Whiting
Abstract: An apparatus for receiving a plurality of electrical components having a body portion and coaxial leads extending in opposite directions therefrom and securing said components in lengths of heat sealed tape on their extremities.
Abstract: A crimping tool for splicing clips is provided with rows of opposed hammers attached to pivoted handles aligned adjacent an anvil assembly on which a splicing clip and two belts of electronic components to be spliced are positioned. Pivoting the handles together causes the hammers and anvil assembly to translate, bending and crimping the clip around the belts.
Abstract: An apparatus for sequentially feeding non-axial lead electrical components in their manufacturing strips from a magazine to a forming station where they are removed, bent into a substantially axial lead configuration and taped between two pairs of continuous ribbons of tape. The leads are straightened while in the manufacturing strip by being placed under tension.
Type:
Grant
Filed:
January 20, 1976
Date of Patent:
October 26, 1976
Assignee:
Universal Instruments Corporation
Inventors:
Albert W. Zemek, Robert H. Holmes, David L. Merithew
Abstract: An apparatus for selecting predesignated transistor components from a plurality of loading stacks, transporting them to a pickup position by a shuttle mechanism, transferring them to an insertion head collet member, inserting them into a circuit board and clinching the leads thereof. The apparatus includes an X-Y axis positioning mechanism and a rotary holder for the circuit board that allows the components to be inserted into the circuit board at 0.degree., 90.degree., 180.degree. and 270.degree. orientations.
Type:
Grant
Filed:
October 29, 1974
Date of Patent:
August 3, 1976
Assignee:
Universal Instruments Corporation
Inventors:
Albert W. Zemek, Matthew R. Valla, Frederick G. Tomko
Abstract: An apparatus for sequentially feeding axial lead electrical components to a first plane, severing surplus lead material, bending one lead so that said component and said other lead are perpendicular to the first plane, preforming the end of the other lead into an L-shape, bending the remaining section of the one lead to be perpendicular to the first plane and inserting the leads into holes in a circuit board.
Type:
Grant
Filed:
February 3, 1975
Date of Patent:
March 23, 1976
Assignee:
Universal Instruments Corporation
Inventors:
Roy M. Whiting, Henry J. Soth, Phillip A. Ragard
Abstract: An axial lead component dispensing apparatus having a simultaneously adjustable pair of guide plates, advancing mechanism and lead severing mechanism mounted on a support. Two racks and a pinion actuate and synchronize the simultaneous lateral adjustment of the guide plates.
Type:
Grant
Filed:
September 26, 1974
Date of Patent:
March 23, 1976
Assignee:
Universal Instruments Corporation
Inventors:
Albert W. Zemek, Frank Joseph Orzelek, Mike L. Ziemba
Abstract: A device for preparing lengths of material used for circuit board wrapping posts characterized by two pairs of swaging members which act to narrow adjacent cross-sections of the length of material down to a truncated pyramid form suitable for severing and for wire wrapping requirements.
Type:
Grant
Filed:
August 13, 1974
Date of Patent:
February 17, 1976
Assignee:
Universal Instruments Corporation
Inventors:
Phillip Anthony Ragard, Keith Alan Young