Abstract: A package structure with conformal shielding includes a substrate providing electrically connected inner grounding structures, a chip module mounted on the substrate, a molding compound covering the chip module and one surface of the substrate, and a conductive shielding layer covering the molding compound and the lateral sides of the substrate, and electrically connected with a part of the inner grounding structures. The substrate further provides one or multiple independent conductive structures electrically connected with the conductive shielding layer and exposed to the outside. By measuring the resistance value between one independent conductive structure and the conductive shielding layer or another independent conductive structure or one ground contact and then comparing the measured resistance value with a predetermined reference value, the EMI shielding performance of the package structure is determined.

Abstract: A conformal shielding module comprising a substrate, at least one electronic component mounted on the substrate, and a molding compound covering the electronic component. The molding compound includes a vertical channel extending from a surface of the molding component to the electronic component, and an electrically conductive structure formed inside the vertical channel. The electrically conductive structure is electrically connected to the electronic component and includes a testing contact on the surface of the molding compound for in-circuit test of the electronic component.

Abstract: A package structure with conformal shielding includes a substrate providing electrically connected inner grounding structures, a chip module mounted on the substrate, a molding compound covering the chip module and one surface of the substrate, and a conductive shielding layer covering the molding compound and the lateral sides of the substrate, and electrically connected with a part of the inner grounding structures. The substrate further provides one or multiple independent conductive structures electrically connected with the conductive shielding layer and exposed to the outside. By measuring the resistance value between one independent conductive structure and the conductive shielding layer or another independent conductive structure or one ground contact and then comparing the measured resistance value with a predetermined reference value, the EMI shielding performance of the package structure is determined.

Abstract: A method for transmitting data is applied to a receiver and a plurality of transmitters. The steps comprise respectively transmitting a data to the receiver at different first transmission times within a transmission interval by the transmitters. Next, the different first transmission times are respectively added with different accumulated values to become the different second transmission times. The different accumulated values are respectively added with a multiple of the different first transmission times. Finally, the transmitters respectively transmit a next data to the receiver at the different second transmission times within a next transmission interval.

Abstract: An pop noise eliminating circuit includes a power source, a grounding terminal, a speaker, an audio amplifier that has two opposite ends respectively connected with the power source and the first end of the speaker, a delay unit that has one end electrically connected with the power source, a first power control switch that has a control end electrically connected with the delay unit, a first conduction end electrically connected with the other end of the speaker, and a second power control switch that has a control end electrically connected with the delay unit, a first conduction end electrically connected with the grounding terminal, and a second conduction end electrically connected with a second conduction end of the first power control switch.

Abstract: A wireless communication module includes: amounting board including a dielectric frame and a dielectric panel that are stacked together, the frame defining a frame space; at least one electronic component mounted on the mounting board and extending into the frame space; and a plurality of conductive bodies embedded in the dielectric frame and surrounding the frame space so as to prevent electromagnetic interference resulting from the electronic component.

Abstract: A circuit board assembly includes: a circuit board having opposite first and second surfaces and formed with a first through-hole defined by a hole-defining wall that extends between and that terminates at the first and second surfaces and that cooperates with the first and second surfaces to define first and second turns, respectively, the circuit board further having an abutting wall that extends between and that terminates at the first and second surfaces and that cooperates with the second surface to define a third turn; and an electric wire having a fixed end that is soldered to the circuit board, extending through the first through-hole, and passing over the first, second and third turns of the circuit board so as to form an inflection region between the first and second turns.

Abstract: A charging method for a battery includes: enabling a charging device to charge the battery with a first charging voltage having a value that is increasing and a first charging current having a value that is constant; and when it is determined that the value of the first charging voltage is equal to a maximum charging voltage value of the battery, enabling the charging device to charge the battery with a second charging voltage having a value that is equal to a maximum charging voltage value of the battery, and a second charging current having a value that is decreasing. A charging device for realizing the charging method is also disclosed.

Abstract: A removable hard disk device includes a handle, a first holder, a hard disk drive located between the handle and the first holder, and two second holders pivotally connected to ends of the first holder and detachably connected to ends of the handle with the two second holders firmly holding the hard disk drive there between and detachably connected to the disk drive. When the second holders are forced to pivotally move outwardly relative to each other, the second holders will be separated from the first holder and the handle such that the hard disk drive can be dismounted from the first holder without using any tool.

Abstract: A portable electronic device includes: a printed circuit board having opposite first and second surfaces and provided with at least one electronic component, the first surface being provided with at least one conductive pad that is electrically coupled to the electronic component; and a flexible circuit board having a main part stacked on the second surface of the printed circuit board, and an extension part extending and folded from the main part and stacked on the first surface of the printed circuit board. The extension part is provided with at least one conductive bump thereon. An outer surface of the main part is provided with at least one input key that is electrically coupled to the conductive bump. The conductive pad is bonded to the conductive bump.

Abstract: A debug device of embedded systems is provided. The embedded system includes an embedded processor for reading a bootloader from a flash memory through a data flash interface. The debug device includes a memory transmission interface, a dada storage module, a data control module and a display module. The memory transmission interface is configured to couple the data flash interface for receiving data to the data storage module. The data control module determines whether the data stored in the data storage module is data from a data bus or from the data flash interface according to whether a data control signal of the data flash interface has been triggered. The display module displays the data of the data storage module.

Abstract: An over-voltage protection device includes a comparison module, a first switch, a second switch and an output switch. The comparison module compares a divided input voltage with a threshold voltage to output a control signal according to the comparison result. The first switch is coupled with the comparison module and controlled by the control signal. The second switch is coupled with the first switch and is controlled by the output signal of the first switch. The output switch is coupled with the second switch, the output switch is coupled with the voltage output terminal, and the output switch is coupled with the voltage input terminal. The output switch is controlled by the output signal of the second switch to cut off the input voltage or pass the input voltage to the voltage output terminal.

Abstract: An embedded package structure module with high-density electrical connections, including: a drive IC structure, an LED array structure and a plurality of conductive structures. The drive IC structure has at least one concave groove. The LED array structure is received in the at least one concave groove of the drive IC structure, and the LED array structure has a plurality of second open grooves formed on its lateral wall and close to the drive IC structure. The conductive structures respectively traverse the second open grooves in order to make the conductive structures electrically connect between the drive IC structure and the LED array structure.

Abstract: A hard disk case for installation in a computer case includes a support frame for installation of a hard disk drive, a base mounted to the support frame, and a handle. The handle has a pivoting end pivotally connected with the base, a first protrusion insertable in an insertion portion of the computer case and pushable against a periphery wall of the insertion portion for enabling engagement of the hard disk drive with the computer case, and a second protrusion spaced from the first protrusion and pushable against a stopping portion of the computer case for enabling disengagement of the hard disk drive from the computer case. As a result, the hard disk case of the present invention is convenient in assembly and disassembly works.

Abstract: A multi-wavelength light-emitting module with high density electrical connections includes a drive IC structure and a multi-wavelength LED array structure. The drive IC structure has a drive IC unit formed on a top surface thereof. The multi-wavelength LED array structure is disposed on the top surface of the drive IC structure, and the multi-wavelength LED array structure has a conductive trace unit formed on an outer surface thereof and electrically connected to the drive IC unit.

Abstract: A method for packaging a multi-wavelength LED array package module includes: forming at least one concave groove on a drive IC structure; arranging a multi-wavelength LED array set in the at least one concave groove; solidifying a plurality of liquid conductive materials to form a plurality of conductive elements that is electrically connected between the drive IC structure and the multi-wavelength LED array set by a printing, a coating, a stamping, or a stencil printing process; arranging the drive IC structure on a PCB with at least one input/output pad; and then forming a conductive structure that is electrically connected between the drive IC structure and the at least one input/output pad.

Abstract: A method and jig structure for positioning bare dice is disclosed. The jig structure for positioning at least one bare dice includes a trap having at least one positioning groove wherein the depth of the positioning groove is less than the height of the bare dice. Basing on the positioning groove formed in the tray, once a bare dice is placed in the positioning groove, the partially exposed bare dice can be located directly and precisely vacuum-grabbed by a sucker, so that the number of positioning steps is reduced.

Abstract: A case unit for a storage device includes a main case having an accommodation chamber, a subsidiary case detachably and drawably mounted in the accommodation chamber of the main case, and a circuit board mounted with the subsidiary case. As long as the subsidiary case is taken out of the accommodation chamber of the main case, the circuit board can be repaired, thereby enhancing convenience of assembly and repair works.

Abstract: An enclosure includes a cover body for covering a housing, and a switch device that includes a lock plate connected pivotally to the cover body and connected to an operating plate mounted movably on the cover body via a connecting bolt extending through the operating plate, the cover body and an inclined guide slot in the lockplate. To switch the enclosure from a locked state, where the lock plate engages a retaining recess in the housing, to an unlocked state, where the lock plate extends into a notch in the housing, the operating plate is moved in a direction so that the lock plate is rotated to disengage the retaining recess, and the cover body is then moved in the direction until the lock plate extends into the notch. When the lock plate extends into the notch, removal of the cover body is allowed.

Abstract: An electromagnetic interference eliminating apparatus includes a multi-stage filter that is composed of inductors, capacitors and resistors, and an active filter. The multi-stage filter receives an input signal and provides an eliminating band to eliminate the noise in the input signal. The active filter is connected with the multi-stage filter for buffering the input signal that has been eliminated and exactly outputting an output signal.