Abstract: An electrical property testing device of an evaluation board includes a main circuit board, a voltage detecting unit, a storing unit, a processing unit and an adapter board. The voltage detecting unit is configured to detect a plurality of voltage values of the signal pads. The storing unit stores a plurality of standard voltage values corresponding to the signal pads. The processing unit is electrically connected to the voltage detecting unit and the storing unit. The processing unit receives the voltage values and determines whether the voltage values match the standard voltage values to generate a determining result. The adapter board includes a plurality of conductive pads. The conductive pads are correspondingly connected to the signal pads of the evaluation board. The voltage detecting unit detects the voltage values of the signal pads of the evaluation board via the conductive pads.

Abstract: A power module is disclosed. The power module includes a first conductive plate, a first power component, and a second power component. The first conductive plate has a first side and a second side opposite to the first side; The first power component is disposed at the first side. The second power component is disposed at a first location of the second side distinct from a second location of the second side. The second location is configured to transfer most heat from the first power component to the second power component if the second power component is disposed at the second location.

Abstract: An excitation source planning method for an electrical stimulation is proposed to plan an excitation source. A layout importing step is performed to drive a processing unit to import a PCB layout to an electromagnetic simulation software module. A port establishing step is performed to set the excitation source to be vertically disposed between a signal layer and a main ground layer. A model generating step is performed to perform the electrical simulation according to the excitation source to generate a three-dimensional simulation model corresponding to the PCB layout. When the signal layer is not electrically connected to the main ground layer, the electromagnetic simulation software module executes an extending step. The extending step is performed to provide a first metal unit to be connected to the signal layer, and reset the excitation source to be vertically disposed between the first metal unit and the main ground layer.

Abstract: A wireless switch control device and method are provided. The wireless switch control device includes a flexible printed circuit (FPC) board, a load switch, and a wireless control circuit. The FPC board has a first electrode region, a second electrode region, and a component placement region, where the first electrode region is in electrical contact with an anode of the battery module, and the second electrode region is in electrical contact with a cathode of the battery module. The load switch is provided in the component placement region, and coupled to a power supply circuit between the battery module and the electronic product. The wireless control circuit is provided in the component placement region, and coupled to both the load switch and the anode of the battery module. The wireless control circuit receives a setting instruction wirelessly, and controls the load switch according to the setting instruction.

Abstract: An ultra wideband (UWB) dynamic positioning method and a system thereof are provided. A target UWB device detecting step includes driving a host UWB device to detect whether a target UWB device or at least one first-order seeking UWB device is around the host UWB device, and then a detecting result is generated. A host UWB device operation deciding step includes deciding an operating mode of the host UWB device according to the detecting result. When the target UWB device is around the host UWB device, the operating mode includes calculating a moving direction from the host UWB device to the target UWB device. When there is the first-order seeking UWB device around the host UWB device without the target UWB device, the operating mode includes switching on the first-order seeking UWB device to enter a seeking mode.

Abstract: A vehicle driving device is driven by a power unit. A three-phase motor includes a first stator winding and a second stator winding. The first stator winding is connected in parallel to the second stator winding, and the first stator winding and the second stator winding are synchronized with each other. A first current sensor is coupled to the first stator winding for measuring a first-phase current. A second current sensor is coupled to the first stator winding for measuring a second-phase current. A third-phase current of the first stator winding is generated according to a calculating procedure of the first-phase current and the second-phase current. A duty cycle between a first power module and a second power module is controlled according to a feedback compensation of the first-phase current, the second-phase current and the third-phase current.

Abstract: A power detecting device includes a vehicle driving system, a battery detecting module and a controlling module. A first stator winding and a second stator winding are synchronized and connected in parallel with each other. A first end of a first current sensor is coupled to a first-phase winding end of the first stator winding for measuring a first-phase current. A first end of a second current sensor is coupled to a second-phase winding end of the first stator winding for measuring a second-phase current. The battery detecting module is coupled to a first power supply for measuring a current signal and a voltage signal. A controller generates a first power according to the current signal and the voltage signal and generates a second power according to a plurality of data from a database. The controller compares the first power with the second power to generate a detecting result.

Abstract: A method of manufacturing a System in Package (SiP) module includes: welding required electronic units by the SiP module onto a top surface of a Printed Circuit Board (PCB), with welding spots being reserved on a bottom surface of the PCB for obtaining a PCB assembly (PCBA) of the SiP module; pasting tightly a functional film on a surface of the electronic units of the PCBA; filling on plastic materials on the top surface of the PCBA, ensuring that the plastic materials covers the electronic units and the functional film on the top surface of the PCBA, and obtaining solidified PCBA after the plastic materials are solidified; and cutting the solidified PCBA for obtaining a plurality of the SiP modules.

Abstract: A manufacturing method of a system in package (SiP) module based on double plastic-sealing, including: welding electronic units required by the SiP module onto a top surface of a Printed Circuit Board (PCB), with welding spots being reserved on a bottom surface of the PCB to obtain a PCB assembly (PCBA); implementing a first-time filling to fill on plastic materials on a top surface of the PCBA, ensuring that the plastic materials cover the electronic units, and obtaining a first-time plastic-sealing PCBA after the plastic materials are solidified; pasting tightly a functional film on a top surface of the first-time plastic-sealing PCBA to obtain a film-pasted PCBA; and implementing a second-time filling to fill on plastic materials on the film-pasted PCBA, ensuring that the plastic materials cover a top surface and a periphery of the film-pasted PCBA, and obtaining the SiP module after the plastic materials are solidified.

Abstract: The present disclosure relates to a test socket for a chip, which comprises: a recess for receiving the chip and two push mechanisms. The recess is surrounded by four sections. The two push mechanisms are respectively arranged at two adjacent sections. Each of the two push mechanisms comprises: a push button, wherein a bottom of the push button is connected to a vertical elastic member; a pusher cooperated with the push button, wherein one end of the pusher extends into the recess and the opposite end of the pusher is connected to a lateral elastic member. When the push button is upwardly pushed by the vertical elastic member, a top of the push button protrudes from a top surface of the section and the pusher will be engaged with the push button. When the push button is pressed and moves downwardly, the lateral elastic member pushes the pusher to move toward the recess.

Abstract: A test device with a built-in test antenna is provided. The test device is applicable to a device under test having an antenna under test. The test device with a built-in test antenna includes: a test base board, a test socket, and an antenna assembly. The test base board is electrically connected to a test apparatus. The test socket is disposed on the test base board. The device under test is to be disposed on the test socket. The antenna assembly includes a test antenna and an antenna board. The antenna assembly is disposed inside the test socket so as to be coupled to the test antenna. The antenna board is electrically connected to the test base board, and the position of the test antenna corresponds to that of the antenna under test.

Abstract: Disclosed is a server system having a hot plug motherboard. The server system includes a motherboard module, at least one midplane board and at least one hard disk module. The motherboard module includes a plurality of motherboards. The midplane board is coupled by means of hot plugging to each of the motherboards. The midplane board includes at least one Peripheral Component Interconnect Express (PCIe) slot, and the PCIe slot is configured to be plugged with a PCIe card. The hard disk module includes a plurality of hard disks being coupled to the PCIe card through a signal wire.

Abstract: A cloud data transmission system, comprising a static relay server, a dynamic relay server and a cloud server. The static relay server facilitates a plurality of user devices to conduct peer-to-peer data transmission. The dynamic relay server switches a working mode according to a working load of the static relay server and shares the working load of the static relay server. The cloud server dynamically coordinates the linkage among the static relay server, the dynamic relay server and the plurality of user devices. The dynamic relay server switches from a standby mode to an active mode when the working load of the static relay server is heavier than a predetermined load. At least two of the plurality of user devices are connected to a dynamic relay server to conduct data transmission through the dynamic relay server.

Abstract: A semiconductor device package includes a substrate, a component on a surface of the substrate, a package body encapsulating the component, and an electromagnetic interference (EMI) shield conformally formed on the package body, where the EMI shield has a side portion defining an opening.

Abstract: The present disclosure discloses an automatic scrubbing apparatus for an electronic module and an automatic scrubbing method thereof. The automatic scrubbing apparatus for an electronic module comprises: a fixing mechanism for limiting and fixing the electronic module, a cleaning brush, a driving mechanism, and a spraying mechanism for spraying the bromine-based cleaning agent on the surface of the electronic module. The fixing mechanism comprises a carrier for providing a groove to hold the electronic module, and the depth of the groove is smaller than the height of the electronic module to expose debris on the side surface of the electronic module. The fixing mechanism further comprises a fixing frame, the fixing frame locates above the electronic module to limit the electronic module. The debris on the side surface and the foreign body on the back of the product can be effectively cleaned, so that the cleaning quality is improved.

Abstract: The present disclosure provides an electronic module. The electronic module comprises an IC, a substrate and an antenna. The substrate has a top surface, a bottom surface and a lateral surface. The IC is electrically connected to the bottom surface. The antenna is disposed on at least two of the top surface, the bottom surface and the lateral surface.

Abstract: A screw locking control system includes a host, a control unit controlled by the host, an electric screw driver and a holder. The control unit includes a processor, a voltage detecting module, a power outlet for providing electricity to the electric screw driver, and a lighting signal control module electrically connected to a plurality of indicator lamps of the holder. As a result, the control unit can turn on the indicator lamps sequentially via the light signal control module, guiding operators to carry out each screw locking operation and detecting a voltage variance of the electric screw driver to determine whether each screw locking operation is qualified. Thus, the quality of the manufacturing process is consistently maintained.

Abstract: The present disclosure relates to a test socket for a chip, which comprises: a recess for receiving the chip and two push mechanisms. The recess is surrounded by four sections. The two push mechanisms are respectively arranged at two adjacent sections. Each of the two push mechanisms comprises: a push button, wherein a bottom of the push button is connected to a vertical elastic member; a pusher cooperated with the push button, wherein one end of the pusher extends into the recess and the opposite end of the pusher is connected to a lateral elastic member. When the push button is upwardly pushed by the vertical elastic member, a top of the push button protrudes from a top surface of the section and the pusher will be engaged with the push button. When the push button is pressed and moves downwardly, the lateral elastic member pushes the pusher to move toward the recess.

Abstract: A battery-driven electronic device includes a battery for outputting a battery voltage, a plurality of loads, a system unit, and a battery energy manager which is electrically connected with the battery, the loads and the system unit. The battery energy manager is adapted for detecting the battery voltage and set with a cutoff threshold, and a low-voltage threshold higher than the cutoff threshold. When the battery voltage is equal to or lower than the low-voltage threshold, the battery energy manager stops supplying power from the battery to at least one of the loads, and outputs a suspension command for the system unit to perform suspension process. When the battery voltage is equal to or lower than the cutoff threshold, the battery energy manager stops supplying power to the loads and the system unit.

Abstract: A dual-band antenna module is provided. The dual-band antenna module includes a circuit board, a ground coupling portion electrically connected to a reference ground plane of the circuit board, a first antenna, and a second antenna spaced from the first antenna. The first antenna and the ground coupling portion are disposed on the circuit board and configured to couple each other. The first antenna includes a first radiation unit, a U-shaped conductive frame, and a first feeding portion. The U-shaped conductive frame is disposed on the first radiation unit and opens toward the circuit board. The second antenna includes a second radiation unit, a high-frequency impedance portion, and a second feeding portion. The second radiation unit and the high-frequency impedance portion are respectively disposed on two opposite surfaces of the circuit board to resonate to each other. The second radiation unit includes a ground extension portion electrically grounded.