Abstract: A handheld device includes at least two NFC antennas provided with different RF transmission directions. The at least two NFC antennas are separated from each other and share one communication unit. In light of this, the handheld device exchange data with an external NFC device through the at least two NFC antennas to have more effective inductive coupling directions.

Abstract: A chip level EMI shielding structure and manufacture method thereof are provided. The chip level EMI shielding structure includes a semiconductor substrate, at least one ground conductor line, a ground layer, and a connection structure. The ground conductor line is disposed on a first surface of the semiconductor substrate, and the ground layer is disposed on a second surface of the semiconductor substrate. The connection structure is formed on a lateral wall of the semiconductor substrate for connecting the ground conductor lines with the ground layer to form a shielding. With such arrangement, the chip level EMI shielding structure can reduce the chip size and the manufacturing cost.

Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.

Abstract: A wireless network configuration method and system for a smart appliance, wherein the smart appliance can start a client mode and an AP mode to connect with a wireless network AP and a portable electronic device separately. When the smart appliance established the connection with the wireless network AP, it will switch from the AP mode to a hidden SSID mode automatically. If an SSID and password of the access point have been stored in the portable electronic device, the portable electronic device will transmit these data to the smart appliance to simplify the operation for wireless network configuration. Besides, the smart appliance will keep connecting with the portable electronic device and disappearing in an available wireless network list of the portable electronic device in the hidden SSID mode. The advantages of this invention are full function and ease of operation.

Abstract: A voltage regulator coupled between a batteryless alternator and a ground includes an under-voltage detection circuit and an exciting current regulating unit. The under-voltage protection circuit includes a voltage detection unit, a plurality of switching circuits, and a power switch. The voltage detection unit generates a first control signal according to an output voltage of the batteryless alternator. The switching circuits are connected in series and controlled by the first control signal. The power switch is coupled to one of the switching circuits and a rotor coil of the batteryless alternator. The exciting current regulating unit controls the operation of the power switch according to the output voltage of the batteryless alternator. The voltage detection unit detects whether the output voltage is lower than a threshold and selectively cuts off the power switch by sequentially controlling the operations of the switching circuits according to the detection result.

Abstract: An electronic device and the manufacturing method thereof are provided. The method comprises providing a module, in which the module includes a substrate, at least one component mounted on the substrate and a molding, and the molding encapsulates the component and a portion of the substrate; forming a first hole to expose a ground pad of the component; forming a first conductive layer which covers the module and is electrically connected to the ground pad.

Abstract: A 3D stacked package structure includes a first unit, a molding unit, a conductive unit and a second unit. The first unit includes a first substrate and at least one first electronic component, and the first substrate has at least one runner and at least one first conductive pad. The molding unit includes a top portion, a frame, and at least one connection connected between the top portion and the frame. The conductive unit includes at least one conductor passing through the frame and electrically connected to the first conductive pad. Therefore, the first unit can be stacked on the second unit through the frame of the molding unit, and the first unit can be electrically connected to the second unit through the conductor of the conductive unit.

Abstract: A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is disposed in the encapsulating member, electrically connecting the ground pad and substantially dividing the encapsulating member into at least two package compartments. The terminal portions of the compartment structure are arranged within the encapsulating member proximal to yet without compromising the peripheral surface. A notch is disposed into the encapsulating member from the peripheral surface corresponding to the location of the terminal portions of the compartment structure to expose the lateral surface thereof across the thickness of the encapsulating member.

Abstract: An exemplary embodiment illustrates an equalization pre-processing method, adapted for characterizing a second sound receptor unit in a sound receiving system based on knowing the internal structure parameters of a first sound receptor unit.

Abstract: A manufacturing method of selective electronic packaging device includes the following. A plurality of electronic components is disposed on a surface of a substrate. A photo-sensitive resin material is formed on the surface of the substrate. UV-light is irradiated to the photo-sensitive resin material to form an embankment structure. An encapsulating material is filled a protective area surrounded by the embankment structure. The encapsulating material covers at least one electronic component. The encapsulating material is solidified to form an encapsulating member, and the encapsulating member covers at least one electronic component.

Abstract: An electronic module includes a circuit board, a plurality of electronic components, a plurality of molding layers, at least one first conductive layer, at least one insulating filler, and one second conductive layer. The circuit board has a first plane and at least one grounding pad on the first plane. The electronic components are mounted on the first plane and electrically connected with the circuit board. The molding layers cover the electronic components and the first plane. The trench appears between two adjacent molding layers. The grounding pad is positioned at the bottom of the trench. The first conductive layer covers the sidewall of the trench and the grounding pad. The grounding pad electrically connected with the first conductive layer. The insulating filler is positioned in the trench. The second conductive layer covers the molding layers and the insulating filler, and electrically connects with the first conductive layer.

Abstract: A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.

Abstract: A wireless network configuration method and system for a smart appliance, wherein the smart appliance can start a client mode and an AP mode to connect with a wireless network AP and a portable electronic device separately. When the smart appliance established the connection with the wireless network AP, it will switch from the AP mode to a hidden SSID mode automatically. If an SSID and password of the access point have been stored in the portable electronic device, the portable electronic device will transmit these data to the smart appliance to simplify the operation for wireless network configuration. Besides, the smart appliance will keep connecting with the portable electronic device and disappearing in an available wireless network list of the portable electronic device in the hidden SSID mode. The advantages of this invention are full function and ease of operation.

Abstract: A wireless module includes a flex substrate, an antenna integrated in the flex substrate and electrically connected to a signal layer and a ground layer of the flex substrate, a first rigid substrate stacked on one side of the flex substrate remote from the antenna, and a communication unit mounted on the first rigid substrate and electrically connected to the signal layer. Thus, the flex substrate and the first rigid substrate are laminated into a Rigid-Flex board. Further, the signal layer and the ground layer are continuously arranged in the same flex substrate, It will be helpful in decreasing the uncertainty and loss of RF signal transmission path, reducing component costs, facilitating optimization of the antenna and reducing the module size.

Abstract: A soft-start circuit composed of active components and passive components and a soft-start voltage regulator based on this soft-start circuit are disclosed. The soft-start voltage regulator is coupled to a generator, a battery and a starter. When the starter is started, the soft-start voltage regulator receives the voltage of the battery to generate a soft-start signal, enabling the generator to establish a voltage. Further, after the generator established the voltage, the soft-start voltage regulator is shut off and the soft-start signal is outputted.

Abstract: The present disclosure provides a control circuitry used in a computing system, for enabling or disabling a standby module of a power supply. The control circuitry is electrically coupled to two nodes of the standby module, and comprises a determination circuit, a transistor, and an optical coupler. The present disclosure further provides a power saving method used in a computing system is illustrated. Whether the computing system is turned off is determined. If the computing system is turned off, a setting that whether the turned off computing system requires the standby voltage is judged. If the turned off computing system does not require the standby voltage, a standby module of a power supply is disabled.

Abstract: The present invention provides an antenna module and an antenna thereof. The antenna includes a first radiation element, a second radiation element, a third radiation element, and a short-circuit portion. The second radiation element has one end connected with the first radiation element. The third radiation element connected with the other end of the second radiation element, and includes a first connection section, a second connection section, and a third connection section. The first connection section is perpendicular to the second radiation element. The second connection section connected with the first connection section. The third connection section is connected with the second connection section and located at an internal side of the second connection section. The short-circuit portion connected with the second connection section and located at an external side of the second connection portion.

Abstract: A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon.

Abstract: A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is disposed in the encapsulating member, electrically connecting the ground pad and substantially dividing the encapsulating member into at least two package compartments. The terminal portions of the compartment structure are arranged within the encapsulating member proximal to yet without compromising the peripheral surface. A notch is disposed into the encapsulating member from the peripheral surface corresponding to the location of the terminal portions of the compartment structure to expose the lateral surface thereof across the thickness of the encapsulating member.

Abstract: A voltage regulator coupled between a batteryless alternator and a ground includes an under-voltage detection circuit and an exciting current regulating unit. The under-voltage protection circuit includes a voltage detection unit, a plurality of switching circuits, and a power switch. The voltage detection unit generates a first control signal according to an output voltage of the batteryless alternator. The switching circuits are connected in series and controlled by the first control signal. The power switch is coupled to one of the switching circuits and a rotor coil of the batteryless alternator. The exciting current regulating unit controls the operation of the power switch according to the output voltage of the batteryless alternator. The voltage detection unit detects whether the output voltage is lower than a threshold and selectively cuts off the power switch by sequentially controlling the operations of the switching circuits according to the detection result.