Abstract: A multi-wavelength light-emitting module that includes a PCB, a drive IC structure, a conductive structure, a multi-wavelength LED array set, a plurality of conductive elements, and an optical amplifier structure. The PCB has at least one input/output pad. The drive IC structure is disposed on the PCB and having at least one concave groove formed on top surface thereof. The conductive structure is electrically connected between the drive IC structure and the at least one input/output pad. The multi-wavelength LED array set is received in the at least one concave groove. The conductive elements are electrically connected between drive IC structure and the multi-wavelength LED array set, respectively. The optical amplifier structure is disposed over the multi-wavelength LED array set for receiving light sources from the multi-wavelength LED array set.

Abstract: The stacked-substrate structure includes a first substrate having a first die embedded therein, a second substrate having a second die embedded therein, a plurality of soldering elements, and a third die. The soldering elements are disposed between the first and the second substrates and connected to the first and the second substrates. The first and the second substrates are electrically connected via the soldering elements. The first substrate, the second substrate, and the soldering elements define an accommodating space. The third die is arranged in the accommodating space and is connected to one surface of the first substrate. The third die is electrically connected to the first and the second dies via the first substrate. Thus, the thickness of the stacked-substrate structure can be reduced, and the first and the second dies of the stacked-substrate structure can be test separately in different platforms.

Abstract: An electromagnetic interference (EMI) shielding structure for integrated circuit (IC) substrate includes a plurality of conductive contacts, a covering layer, and a sputtered layer. The conductive contacts are formed at the perimeter of a chip area on the IC substrate. The covering layer is formed on the conductive contacts and covers the chip area. A groove is formed on the covering layer for exposing the conductive contacts. The sputtered layer is formed on the covering layer and connected to the conductive contacts. The EMI shielding structure can restrain the interference in the chip area.

Abstract: An electromagnetic interference (EMI) shielding structure, which includes: a substrate, at least one chip unit, a packing layer, and an EMI shielding unit. The chip unit is disposed on the surface of the substrate and electrically coupled thereto. The packing layer is formed on the substrate and covers the chip unit. The EMI shielding unit includes: a first, second, and third shielding layer. The first shielding layer covers the outer surface of the packing layer and the lateral surface of the substrate. The second and third shielding layer respectively covers the outer surface of the first and second shielding layer. Based on the instant disclosure, the EMI shielding unit uses the methods of sputtering and electroless plating, to increase the adhesion strength of the EMI shielding unit and make the thickness of the shielding layer uniform. The instant disclosure raises the EMI shielding efficiency and lowers the manufacturing cost.

Abstract: A wafer-level electromagnetic interference (EMI) shielding structure, which includes: a wafer, an exposed circuit unit, and an EMI shielding unit. The exposed circuit unit is disposed on the top surface of the wafer. At least one conductor is disposed on the exposed circuit unit. The EMI shielding unit has a first EMI shielding layer set around the surrounding surface of the wafer, and a second EMI shielding layer coated to the bottom surface of the wafer. Based on the wafer-level manufacturing process of the instant disclosure, the EMI shielding structure is miniaturized, and each individual wafer is protected against the EMI effect.

Abstract: A miniaturized electromagnetic interference (EMI) shielding structure is disclosed, which includes a substrate and a plurality of chip modules disposed thereon. The substrate has a plurality of ground portions formed thereon. Each chip module includes: at least one chip unit disposed on the substrate and connected electrically thereto; at least one conductive bump disposed on the substrate adjacent to the chip unit and connected electrically to the corresponding ground portion; an encapsulation layer arranged on the substrate and covers the chip unit and the conductive bump; and an EMI shielding layer covering the encapsulation layer and electrically connected with an exposed surface of the conductive bump, to allow the EMI shielding layer be electrically connected to the ground portion. The disclosure of the present invention allows each chip module to have its own EMI shielding capability.

Abstract: A detecting device for a cash drawer is used for detecting a status of the cash drawer. The detecting device includes an operation logic circuit and a switch element. The operation logic circuit has a first input terminal, a second input terminal and an output terminal. The first input terminal and the second input terminal are respectively coupled with a micro switch. The first input terminal and the second input terminal are respectively inputted with a high level voltage. When the first input terminal and the second input terminal have the same logic voltage levels, the operation logic circuit outputs a first logic level to the output terminal. When the first input terminal and the second input terminal have different logic voltage levels, the operation logic circuit outputs a second logic level to the output terminal. The switch element is coupled between an electromagnetic switch and the first input terminal.

Abstract: A chip stacked structure is provided. The chip stacked structure includes a first die and a second die stacked on the first die. The first die has a plurality of connection structures each which has a through hole, a connection pad and a solder bump. The connection pad has a terminal connected to the through hole. The solder bump is disposed on the connection pad and located around the through hole. The second die has a plurality of through holes which are aligned and bonded to the solder bump respectively. The chip stacked structure may simplify the process and improve the process yield rate.

Abstract: A chip level EMI shielding structure and manufacture method thereof are provided. The chip level EMI shielding structure includes a semiconductor substrate, at least one ground conductor line, a ground layer, and a connection structure. The ground conductor line is disposed on a first surface of the semiconductor substrate, and the ground layer is disposed on a second surface of the semiconductor substrate. The connection structure is formed on a lateral wall of the semiconductor substrate for connecting the ground conductor lines with the ground layer to form a shielding. With such arrangement, the chip level EMI shielding structure can reduce the chip size and the manufacturing cost.

Abstract: An apparatus for deburring boards includes a platform, on which first and second guiding rail units perpendicular to each other are fixed, a deburring unit mounted on the first guiding rail unit, a carrying unit adapted for carrying the boards and mounted movably on the second guiding rail unit perpendicular to the first guiding rail unit, and a driving unit disposed on the platform and operable to drive the carrying unit to move between a loading/unloading zone, where the carrying unit is spaced apart from the deburring unit, and a processing zone, where the carrying unit is disposed between opposite deburring members of the deburring unit so that opposite deburred edges of each board contact respectively the deburring members. The driving unit further drives the carrying unit to move back and forth within the processing zone a predetermined number of times, thereby deburring the boards.

Abstract: A chip stacked structure and method of fabricating the same are provided. The chip stacked structure includes a first chip and a second chip stacked on the first chip. The first chip has a plurality of metal pads disposed on an upper surface thereof and grooves disposed on a side surface thereof. The metal pads are correspondingly connected to upper openings of the grooves. The second chip has a plurality of grooves on a side surface of the second chip, locations of which are corresponding to that of the grooves on the side surface of the first chip. Conductive films are formed on the grooves of the first chip and the second chip and the metal pads to electronically connect the first chip and second chip. The chip stacked structure may simplify the process and improve the process yield rate.

Abstract: A micro band-pass filter is disclosed. The micro band-pass filter includes a first resonator having a first inter-digital unit and a second inter-digital unit, which is connected to a first wavelength-impedance converter, on two ends thereof, and a second resonator having a third inter-digital unit and a fourth inter-digital, which is connected to a second wavelength-impedance converter unit on two ends thereof. The second inter-digital unit is adapted to face the third inter-digital unit when forming a first inter-digital coupling structure along with the third inter-digital unit, and the first inter-digital unit is adapted to face the fourth inter-digital unit when forming a second inter-digital coupling structure.

Abstract: A multi band-pass filter includes a first resonator and a second resonator. The first resonator has a first frequency pass band and a second frequency pass band. Moreover, the second resonator is electromagnetically coupled to another end of the first resonator. The second resonator has a third frequency pass band and a fourth frequency pass band, wherein the third frequency pass band overlaps (or is congruous with) the first frequency pass band and the fourth frequency pass band overlaps the second frequency pass band.

Abstract: A boot test system applied to test a cold boot in a target computer is provided. The boot test system includes a host computer and an autorun module. The host computer is used to test the target computer to turn power on/off and output a power-on signal and a power-off signal to the target computer based on a feedback signal. The autorun module installed in the target computer is used to output the feedback signal to the host computer during the boot of the target computer. Whereby, the present invention retains a fail result of the boot of the target computer for debugging by a worker.

Abstract: A portable networking device has a casing, a power connector, a power adapting unit, a circuit board, and a networking interface disposed on the circuit board. A receiving space is formed on an exterior side surface of the casing, and the power connector is fixed inside the casing. The power adapting unit is fixed inside the casing and electrically connected to the power connector, where the power connector can selectively connected to a detachable power plug or a power cord having a connector. The detachable power plug has a pair of conducting pins, which can be rotatably received inside the receiving space of the casing. The circuit board is disposed in the casing. The instant disclosure includes the detachable power plug having concealable conducting pins, and no external power adapter is needed. All of which allow for easy stowing and transport for the user.

Abstract: A portable electronic device includes a main casing having a battery-receiving groove for receiving a battery therein, and two aligned resilient abutting tongues flanking the battery-receiving groove. A cover is mounted removably on the main casing for covering the battery-receiving groove. Two anchoring members are mounted rotatably on the cover, extends into the main casing, and is operable so as to switch between a releasing state, where the abutting tongues are spaced respectively apart from the battery, and a clamping state, where the abutting tongues are pressed respectively against the battery.

Abstract: A power supply device and a wireless communication system are provided. The power supply device includes a data input port, a power over Ethernet control module, a network port, a decoder circuit and a signal strength indicator unit. The power over Ethernet control module is configured for receiving a data signal from the data input port to generate a data signal with power. The network port is configured for transmitting the data signal with power to the main board and receiving a signal in relation to a signal receiving strength state of the wireless communication device. The decoder circuit is connected to the network port and configured for generating a signal strength indicator signal. The signal strength indicator unit is connected to the decoder circuit and configured for receiving the signal strength indicator signal to display the signal receiving strength state of the wireless communication device.

Abstract: An electromagnetic shielding device includes a metal frame mounted on a circuit board and having a looped surrounding wall configured with an inner space divided into first and second space portions by a partition wall unit. A cover is mounted fittingly into the inner space in the metal frame, and includes a dielectric cover body, and a conductive material layer attached to an outer surface of the cover body. The cover body has a looped surrounding wall extending downwardly from a periphery of a top wall and disposed in proximity to the looped surrounding wall of the metal frame such that the conductive material layer is in electrical contact with the looped surrounding wall of the metal frame. The cover cooperates with the metal frame to define first and second cavities having different depths and corresponding respectively to the first and second space portions.

Abstract: A method for forming solder bodies on a substrate includes: positioning a first mask plate, which is formed with at least one first through-hole, on the substrate; filling the first through-hole with a first solder paste so as to form a first solder body on the substrate; positioning a second mask plate, which is formed with at least one second through-hole and at least one recess spaced apart from the second through-hole, on the substrate in such a manner that the first solder body is received in the recess; and filling the second through-hole with a second solder paste so as to form a second solder body on the substrate.

Abstract: A host computer formed of a motherboard, a power supply unit with a power switch, a data storage device and an external interface is disclosed to have a transfer switch switchable between a first switch position and a second switch position, the transfer switch having three contacts in the first switch position for electrically connecting the motherboard to the power supply unit and the data storage device to the power supply unit and the motherboard to the external interface, and two contacts in the second switch position for electrically connecting the data storage device to the external interface through a data transmission interface and the data storage device to said power supply unit respectively. This design allows access to the data storage device, achieving the effect of sharing the data storage device without booting the computer system.