Abstract: A laser processing apparatus includes: a laser oscillator configured to oscillate a laser pulse; a first laser deflection unit configured to deflect the laser pulse emitted from the laser oscillator in a two-dimensional direction; a second laser deflection unit having a slower operation speed and configured to deflect the laser pulse emitted from the first laser deflection unit in a two-dimensional direction on a same plane; a laser oscillation control unit configured to control the laser oscillator; and first and second laser deflection control units respectively configured to control operations of the first and second laser deflection units. The first laser deflection control unit controls the first laser deflection unit to successively irradiate the laser pulse to multiple sites along a predetermined track in each of the processing positions in turn, and to change energy of the laser pulse emitted therefrom in a middle of repeated irradiation.

Abstract: A purpose of the present invention is to quickly change a focal point of a laser emission system so that processing with high quality and good processing efficiency can be performed. In a laser processing apparatus including: a laser oscillator configured to output a laser pulse; a laser deflector configured to deflect the laser pulse in a two-dimensional direction; and a controller configured to control the laser oscillator and the laser deflector, the laser processing apparatus being configured to emit the laser pulse to a workpiece for processing the workpiece, the laser processing apparatus has a feature in which an electrooptic device capable of, under control of the controller, electrically changing a focal point of the laser pulse to be input to the laser deflector is arranged in an input side of the laser deflector.

Abstract: Provided is a laser processing method for drilling a hole in a glass substrate with using a carbon dioxide laser, including the steps of: irradiating the laser onto a drilling position on the glass substrate from a side of the glass substrate on which a protective sheet is adhered so as to form a blind hole; removing the protective sheet from the glass substrate and performing an annealing treatment; and performing a wet-etching process on a side of the glass substrate not irradiated with the laser so as to convert the blind hole into a through hole.

Abstract: A laser processing apparatus disclosed in the present application includes: an optical deflection unit capable of changing a deflection direction of and outgoing energy of an incoming laser pulse by changes of a frequency of and an amplitude of a driving signal to be supplied; and a control unit configured to supply driving signals with amplitudes corresponding to respective frequencies. In a laser processing apparatus configured to process a workpiece by leading outgoing laser pulse of the optical deflection unit to the workpiece and irradiating the workpiece with the laser pulse, as the amplitude corresponding to each of the frequencies, the control unit supplies an amplitude having the ratio that is close to the lowest ratio among ratios of the outgoing energy with respect to the incoming energy of the laser pulse at an amplitude having the largest outgoing energy of the optical deflection unit.

Abstract: A laser processing apparatus disclosed in the present application includes: an optical deflection unit capable of changing a deflection direction of and outgoing energy of an incoming laser pulse by changes of a frequency of and an amplitude of a driving signal to be supplied; and a control unit configured to supply driving signals with amplitudes corresponding to respective frequencies. In a laser processing apparatus configured to process a workpiece by leading outgoing laser pulse of the optical deflection unit to the workpiece and irradiating the workpiece with the laser pulse, as the amplitude corresponding to each of the frequencies, the control unit supplies an amplitude having the ratio that is close to the lowest ratio among ratios of the outgoing energy with respect to the incoming energy of the laser pulse at an amplitude having the largest outgoing energy of the optical deflection unit.

Abstract: In a substrate processing method in which, for a substrate including a first layer made of a glass substrate and second layers made of a material different from that of the first layer and provided on a front surface and a back surface of the first layer, respectively, an intended mark is formed in each of the second layers, the substrate processing method includes the step of irradiating with a laser beam having an energy density capable of processing the second layers but incapable of processing the first layer from one surface side of the substrate, thereby simultaneously forming the mark at corresponding positions on each of a front surface and a back surface of the substrate.

Abstract: The object of the present invention is to achieve the combination processing that accelerates the processing speed while keeping the accuracy of finishing. In the combination processing consisting combination of stationary processing and synchronization processing, the processing of the section in the rows in an processing area is performed from a first end to a second end of a row, and then from the second end to the first end of the next row so that the processing is performed from side to side. The stationary processing is performed in sections having relatively low processing densities and the synchronization processing is performed in the other sections than the sections for the stationary processing.

Abstract: Provided is a laser processing method for drilling a hole in a glass substrate with using a carbon dioxide laser, including the steps of: irradiating the laser onto a drilling position on the glass substrate from a side of the glass substrate on which a protective sheet is adhered so as to form a blind hole; removing the protective sheet from the glass substrate and performing an annealing treatment; and performing a wet-etching process on a side of the glass substrate not irradiated with the laser so as to convert the blind hole into a through hole.

Abstract: In a laser oscillator, a pair of electrodes is disposed in a housing into which a gas is sealed, a waveguide is formed by the pair of electrodes, and a laser beam is configured to be extracted from an end of the housing. The laser oscillator includes a mirror holder attached to an end of the electrode, the end serving as an end of the waveguide, and a reflection mirror attached to the mirror holder and reflecting a laser beam generated in the waveguide. In the laser oscillator, a passage through which a cooling medium is passed is formed inside each of the pair of electrodes.

Abstract: A laser machining method for cutting or cutting grooves on a workpiece using an apparatus having an X-Y table for mounting the workpiece, a laser source emitting a continuous wave or a quasi-continuous wave laser beam, modulator forming a pulsed laser beam by a high-speed modulation of the continuous wave or quasi-continuous wave laser beam, and an optical system capable of converging the pulsed laser beam on the workpiece, wherein the method comprising cutting with the pulsed laser beams along a locus including a portion where the moving speed of the X-Y table is decreased, and the pitch of holes machined with said laser pulses is kept constant by adjusting the intervals between successive said laser pulses in accordance with the moving speed of said workpiece, the method further comprising increasing the pulse widths of the laser pulses in accordance with the decrease in moving speed of the X-Y table in the portion where the moving speed of the X-Y table is decreased.

Abstract: In a substrate processing method in which, for a substrate including a first layer made of a glass substrate and second layers made of a material different from that of the first layer and provided on a front surface and a back surface of the first layer, respectively, an intended mark is formed in each of the second layers, the substrate processing method includes the step of irradiating with a laser beam having an energy density capable of processing the second layers but incapable of processing the first layer from one surface side of the substrate, thereby simultaneously forming the mark at corresponding positions on each of a front surface and a back surface of the substrate.

Abstract: In a laser oscillator, a pair of electrodes is disposed in a housing into which a gas is sealed, a waveguide is formed by the pair of electrodes, and a laser beam is configured to be extracted from an end of the housing. The laser oscillator includes a mirror holder attached to an end of the electrode, the end serving as an end of the waveguide, and a reflection mirror attached to the mirror holder and reflecting a laser beam generated in the waveguide. In the laser oscillator, a passage through which a cooling medium is passed is formed inside each of the pair of electrodes.

Abstract: The present invention aims to provide a backdrilling method and a backdrilling apparatus that can ensure the backdrilling depth accuracy. Using a multilayer printed wiring board in which a reference depth detection region is allocated where a reference depth detection layer is formed in the same layer with an internal wiring layer electrically connected to a stub, the thickness and the depth of the reference depth detection layer are measured in the reference depth detection region using a drill bit. The drill bit is moved relative to the multilayer printed wiring board to a backdrilling portion. The drilling is performed using the drill bit to the depth which is calculated using the ratio of the depth of the reference depth detection layer to the thickness of the multilayer printed wiring board in the reference depth detection region.

Abstract: Variation in hole diameter due to heating effects is minimized even if the shortest machining route is set, and machining quality is improved. A printed circuit board to be scanned by a laser beam is divided into a plurality of scan areas (S1). An order of drilling within the scan area is sorted to obtain a scanning route with the shortest distance (S2). The order of the (N+1)th hole and the (N+2)th hole is swapped in each scanning area if it is determined that the distance between the Nth hole and the (N+1)th hole (here, N is an integer in a range of 1?N?“the maximum number of holes to be drilled in the area”?1?) is less than a predetermined threshold value, and that N+1 is not correspond to the maximum number of holes to be drilled in the scanning area (S3).

Abstract: A galvanoscanner including: a rotor including a shaft as a rotational center, and permanent magnets disposed around the shaft and polarized to a plurality of poles in a circumferential direction of the shaft; and a stator disposed in the outside of the rotor through a clearance and including coils, a yoke, and an outer casing so that the rotor swings in a predetermined angle range; wherein: the permanent magnets are provided with grooves which are formed in a direction of the rotation shaft so as to straddle circumferentially adjacent magnetic poles of the permanent magnets; and the permanent magnets are parted into at least two parts per pole by parting lines. Thus, the ratio of the torque constant to the moment of inertia can be improved so that the current required for driving can be reduced and reduction of power consumption at driving time can be attained.

Abstract: A galvanoscanner including: a rotor including a shaft as a rotational center, and permanent magnets disposed around the shaft and polarized to a plurality of poles in a circumferential direction of the shaft; and a stator disposed in the outside of the rotor through a clearance and including coils, a yoke, and an outer casing so that the rotor swings in a predetermined angle range; wherein: the permanent magnets are provided with grooves which are formed in a direction of the rotation shaft so as to straddle circumferentially adjacent magnetic poles of the permanent magnets; and the permanent magnets are parted into at least two parts per pole by parting lines. Thus, the ratio of the torque constant to the moment of inertia can be improved so that the current required for driving can be reduced and reduction of power consumption at driving time can be attained.

Abstract: The present invention aims to prevent, in a gas laser resonator, the deterioration in quality of discharge by reduction of the change of the pressure in a discharge chamber and the inflow of impurity gases, such as air, into the discharge chamber. A bracket 6 is attached to one end of a tube 1 interposing a gasket 13 only for sealing an opening of the discharge chamber 2 only and a gasket 14 for sealing both openings of the discharge chamber 2 and a buffer chamber 12. Also, a glass plate 8 and further a bracket 9 are attached to the other end of the tube 1 interposing a gasket 15 only for sealing the opening of the discharge chamber 2 and a gasket 16 for sealing both openings of the discharge chamber 2 and the buffer chamber 12. The pressure in the buffer chamber 12 is set lower than that of the discharge chamber 2 or set higher than the atmospheric pressure to decrease the inflow of the impurity gases to the discharge chamber 2.

Abstract: A laser machining method for cutting or cutting grooves on a workpiece using an apparatus having an X-Y table for mounting the workpiece, a laser source emitting a continuous wave or a quasi-continuous wave laser beam, modulator forming a pulsed laser beam by a high-speed modulation of the continuous wave or quasi-continuous wave laser beam, and an optical system capable of converging the pulsed laser beam on the workpiece, wherein the method comprising cutting with the pulsed laser beams along a locus including a portion where the moving speed of the X-Y table is decreased, and the pitch of holes machined with said laser pulses is kept constant by adjusting the intervals between successive said laser pulses in accordance with the moving speed of said workpiece, the method further comprising increasing the pulse widths of the laser pulses in accordance with the decrease in moving speed of the X-Y table in the portion where the moving speed of the X-Y table is decreased.

Abstract: A positioning control system for positioning a moving element on a basis of position command data is provided with a feedback loop. The system is also provided with a loop gain modifier for determining a loop gain, which is to be used in a following positioning operation, on a basis of a difference between an amount of overshoot measured in a current positioning operation and a predetermined tolerance or on a basis of a difference between an amount of overshoot measured in a current positioning operation and a first predetermined tolerance and a difference between an amount of undershoot measured in the current positioning operation and a second predetermined tolerance. The first and second tolerances may preferably be the same in absolute value. The moving element may specifically be a steerable mirror for drilling holes in a work by reflecting a laser beam. Also disclosed is a laser drilling machine including the system.

Abstract: A galvanoscanner including: a rotor including a shaft as a rotational center, and permanent magnets disposed around the shaft and polarized to a plurality of poles in a circumferential direction of the shaft; and a stator disposed in the outside of the rotor through a clearance and including coils, a yoke, and an outer casing so that the rotor swings in a predetermined angle range; wherein: the permanent magnets are provided with grooves which are formed in a direction of the rotation shaft so as to straddle circumferentially adjacent magnetic poles of the permanent magnets; and the permanent magnets are parted into at least two parts per pole by parting lines. Thus, the ratio of the torque constant to the moment of inertia can be improved so that the current required for driving can be reduced and reduction of power consumption at driving time can be attained.