Patents Assigned to Via Mechanics, Ltd.
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Publication number: 20080314625Abstract: The present invention relates to a method of manufacturing a printed circuit board and to a printed circuit board, the method comprising the steps of: preliminarily forming a plurality of test pattern layers 3 and 4 for detecting the depth of an inner layer in a multilayer printed circuit board such that at least a part of a lower test pattern layer is not overlaid with any upper test pattern layer when viewed from a drill entrance side, and preliminarily forming a surface conductor layer 2; applying a voltage between the surface conductor layer 2 and the test pattern layers 3 and 4; performing drilling toward one selected test pattern layer 3 by use of a drill 7 for drilling, and detecting a current produced when the drill comes into contact with the test pattern 3 to measure the depth of the layer (D1); performing drilling toward the other test pattern layer 4 by use of the drill 7, and measuring the depth of the layer (D2); and performing drilling by use of the drill 7 up to just before the conductor-wirinType: ApplicationFiled: June 20, 2008Publication date: December 25, 2008Applicant: Hitachi Via Mechanics, Ltd.Inventors: Kazunori HAMADA, Hiroshi Kawasaki, Tomoaki Ozaki
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Patent number: 7432681Abstract: A scanner system includes a servo control unit. A rotation angle of a rotating shaft supporting a mirror is detected, and an error of the detected value with respect to a commanded value is integrated by an integral compensator so that the detected value is able to track the commanded value. A tracking error proportional compensator is disposed in parallel with the integral compensator so as to add a correction value proportional to the error to the integrated value of the error. A plurality of gains are prepared for each of the integral compensator, the tracking error proportional compensator, a detected value proportional compensator and a detected value differential compensator of the servo control unit. Each gain is changed in accordance with a travel angle of the commanded value. Thus, the mirror can be positioned quickly so that the machining speed can be improved.Type: GrantFiled: August 27, 2004Date of Patent: October 7, 2008Assignee: Hitachi Via Mechanics, Ltd.Inventors: Souichi Toyama, Haruaki Otsuki, Atsushi Sakamoto, Kenta Seki, Yaichi Okubo
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Publication number: 20080237204Abstract: A laser beam machining method for a printed circuit board, for enabling to bring the depth of a bottom surface of grooves within an overlap region, which is irradiated with a laser beam, repetitively, to be nearly equal to that of the bottom surface of grooves within other regions, comprises the following steps of: fixing a line beam 4, which is shaped into a rectangular having a length sufficiently larger than its width, in a cross-section perpendicular to a central axis thereof; executing a belt-like machining on a certain region of the printed circuit board 6, while moving a mask 1 and the printed circuit board 6 in opposite directions, in a direction of the width of the line beam 4 (i.e.Type: ApplicationFiled: February 14, 2008Publication date: October 2, 2008Applicant: Hitachi Via Mechanics, Ltd.Inventors: Goichi Ohmae, Hiroshi Aoyama, Masayuki Shiga, Shigenobu Maruyama
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Publication number: 20080244158Abstract: A drawing apparatus which can create an exposure pattern rapidly. The drawing apparatus has a raster conversion processing module for converting vector images as wiring patterns into bitmap image data, an image cache module for temporarily storing a predetermined-size cached image supplied from the raster conversion processing module, a first compression module for compressing the cached image stored in the image cache module, a second compression module for compressing the cached image stored in the image cache module in a compression ratio differing from that of the first compression module, a comparison module for comparing data sizes of compressed data generated by the first and second compression modules and selecting one having a smaller data size, a memory access module for writing the compressed data selected by the comparison module, into a storage module, and a cache region control module for controlling a compression status of the cached image.Type: ApplicationFiled: February 19, 2008Publication date: October 2, 2008Applicant: Hitachi Via Mechanics, Ltd.Inventors: Terunobu FUNATSU, Yoshihisa OSAKA, Hitoshi IKEGAMI
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Publication number: 20080232421Abstract: The invention provides a method and an apparatus for forming a plurality of ultraviolet-wavelength laser beams, and a laser machining apparatus, in which the machining efficiency can be improved due to easy maintenance and inspection while deterioration of wavelength conversion means can be prevented to reduce the running cost. A laser beam with a near infrared wavelength output from a laser oscillator is branched into a plurality of laser beams by a laser distribution unit. Each branched laser beam is partially converted into a laser beam whose wavelength is ½ of the near infrared wavelength by a wavelength converter.Type: ApplicationFiled: April 29, 2008Publication date: September 25, 2008Applicant: Hitachi Via Mechanics, Ltd.Inventors: Goichi Ohmae, Hiroshi Aoyama
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Publication number: 20080223833Abstract: A machining apparatus in which the machining efficiency can be improved even if characters are machined in a printed circuit board. A coordinate transformation unit is provided for transforming central coordinates of each dot d of each character of a character string into coordinates in a machining coordinate system with which the holes will be machined. Prior to machining, based on a character string and position information of the character string described in a machining program, central coordinates of each dot of each character of the character string are transformed into coordinates in the machining coordinate system with which the holes will be machined. Each dot d is regarded as a hole and machined. The number of times of movement of a table can be thus minimized so that the machining efficiency can be improved.Type: ApplicationFiled: February 20, 2008Publication date: September 18, 2008Applicant: Hitachi Via Mechanics, Ltd.Inventor: Yasunobu UENO
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Publication number: 20080223839Abstract: A laser machining apparatus capable of accurately projecting mask patterns onto a work piece and superior in machining accuracy. An auto-focusing unit is provided. The auto-focusing unit includes a television camera for observing alignment marks formed on the surface of the work piece so as to be able to measure the focal length of a projection lens. A main-scanning direction expansion/contraction ratio Ex of the work piece to its design value and a sub-scanning direction expansion/contraction ratio Ey of the work piece to its design value are obtained. The imaging magnification M of the projection lens is corrected to compensate the expansion/contraction ratio Ex. The moving speed of a mask and/or the moving speed of the work piece are corrected in consideration of the imaging magnification M of the projection lens so as to compensate the expansion/contraction ratio Ey.Type: ApplicationFiled: February 20, 2008Publication date: September 18, 2008Applicant: Hitachi Via Mechanics, Ltd.Inventors: Shigenobu Maruyama, Hiroshi Aoyama, Masayuki Shiga, Goichi Ohmae
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Publication number: 20080213705Abstract: A pattern exposure method and a pattern exposure apparatus in which the throughput is improved with an inexpensive apparatus and without a low running cost. Output faces of a plurality of laser beams emitted from a plurality of semiconductor lasers respectively are arranged in two directions. One of the directions is the same direction as the scanning direction of a polygon mirror while the other is a direction crossing the scanning direction of the polygon mirror. In this event, the array pitch of the output faces arranged in the direction crossing the scanning direction of the polygon mirror is made equal to resolution of an exposure pattern. In this event, the wavelength of each laser may be made not longer than 410 nm.Type: ApplicationFiled: April 4, 2008Publication date: September 4, 2008Applicant: Hitachi Via Mechanics Ltd.Inventors: Yoshitada OSHIDA, Yoshitatsu Naito, Mituhiro Suzuki, Bunji Uchiyama, Tsuyoshi Yamaguchi
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Publication number: 20080145567Abstract: A printed circuit board manufacturing method by which the manufacturing time can be shortened and the manufacturing cost can be reduced. A printed circuit board has an insulating layer on its surface. Positions (first positions) of the printed circuit board where lands are disposed are irradiated with a CO2 laser beam (first laser beam) so as to form holes with a depth h from the surface. The printed circuit board is then scanned with an excimer laser beam (second laser beam) through a mask. The beam shape of the excimer laser beam is rectangular. Thus, holes reaching the lands are formed in the positions where the lands are disposed, and grooves for forming lines are formed (second positions). In this case, the holes reaching the lands may be formed by the CO2 laser beam.Type: ApplicationFiled: December 5, 2007Publication date: June 19, 2008Applicant: Hitachi Via Mechanics, Ltd.Inventors: Goichi OHMAE, Hiroshi Aoyama, Yasuhiko Kanaya
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Patent number: 7372478Abstract: A pattern exposure method and a pattern exposure apparatus in which the throughput is improved with an inexpensive apparatus and without a low running cost. Output faces of a plurality of laser beams emitted from a plurality of semiconductor lasers respectively are arranged in two directions. One of the directions is the same direction as the scanning direction of a polygon mirror while the other is a direction crossing the scanning direction of the polygon mirror. In this event, the array pitch of the output faces arranged in the direction crossing the scanning direction of the polygon mirror is made equal to resolution of an exposure pattern. In this event, the wavelength of each laser may be made not longer than 410 nm.Type: GrantFiled: March 9, 2005Date of Patent: May 13, 2008Assignee: Hitachi Via Mechanics, Ltd.Inventors: Yoshitada Oshida, Yoshitatsu Naito, Mituhiro Suzuki, Bunji Uchiyama, Tsuyoshi Yamaguchi
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Patent number: 7372632Abstract: An imaging method and imaging system for inspecting features located at a known inter-feature pitch on portions of a target surface. The system includes a lens array having a plurality of lenses wherein the lenses of the lens array have an inter-lens pitch and an inter-field of view pitch corresponding to the inter-feature pitch, and an array of imaging elements having an inter-element pitch corresponding to the inter-feature pitch, whereby the imaging system images only field of view areas of the target surface containing features.Type: GrantFiled: September 7, 2006Date of Patent: May 13, 2008Assignee: Hitachi Via Mechanics, Ltd.Inventor: Todd E. Lizotte
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Patent number: 7364838Abstract: A grayscale mask for imaging operations, including a substrate layer and a mask layer having a plurality of apertures forming a mask pattern to form a grayscale image. Each edge of each aperture includes a plurality segments forming a serrated edge, resulting in mixed edge diffraction. The apertures may be in an irregular and non-symmetric pattern and may be of variable size. A random diffusing layer may be in proximity to or integral with the substrate layer. The grayscale mask may be used for generating an optical element by printing the initial grayscale mask onto a photoresist layer and transferring the photoresist pattern onto a transparent layer and the mask may include areas or layers of variable transmission. Also described are methods for diffractive intensity averaging, diffractive error diffusion, diffractive spatial dithering, and diffractive intensity averaging.Type: GrantFiled: June 29, 2005Date of Patent: April 29, 2008Assignee: Hitachi Via Mechanics, Ltd.Inventor: Todd E. Lizotte
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Publication number: 20080079921Abstract: An illumination apparatus and an exposure apparatus that achieves higher quality exposure to light and higher operating speed even where the ratio Hx/Hy between the transverse dimension Hx and the longitudinal dimension Hy of the plane of optical modulation of a two-dimensional optical space modulator is 1.5 or above, for instance, are to be provided. The focal distance fx in an x-direction and the focal distance fy in a y-direction of a second optical system that guides light emitted from an integrator to a two-dimensional optical space modulator are made different, in a ratio of fx/fy=1.6, for instance. In this way, the number of rod lenses in the integrator can be made equal between transverse and longitudinal directions and the value of Hx/Hy can be made 2.5 by bringing the aspect ratio dx:dy of rod lenses to 1.6:1, close to 1.Type: ApplicationFiled: August 16, 2007Publication date: April 3, 2008Applicant: Hitachi Via Mechanics, ltd.Inventors: Yoshitada Oshida, Kazuo Kobayashi
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Publication number: 20080073329Abstract: A drilling method and a laser machining apparatus which can shorten the measuring time of workpiece surface height and improve the machining efficiency in spite of irregularities of about 10-30 ?m high in the surface of a table. Surface heights of the table is measured at lattice points in advance. Top surface height at a desired point of the workpiece mounted on the table is measured. Surface height of the point is arithmetically obtained using heights of four points surrounding the point. The difference between the measured height and the arithmetically obtained height is set as the plate thickness of the workpiece. Top surface height of the workpiece at a machining position is regarded as the sum of the plate thickness and the height at that position obtained from the table surface heights.Type: ApplicationFiled: August 23, 2007Publication date: March 27, 2008Applicant: Hitachi Via Mechanics, Ltd.Inventors: Hidenori Tateishi, Masaru Futaana, Yuki Saeki, Yasunobu Ueno
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Publication number: 20080053974Abstract: A laser machining method and a laser machining apparatus by which holes excelling in form accuracy can be machined efficiently are to be provided. A first cylindrical lens and/or a second cylindrical lens to correct any deformation of reflective face of a first mirror and/or a second mirror is arranged on an optical axis of a laser beam, and converging positions of the laser beam for an X-component and for a Y-component are coincident with a point on the optical axis.Type: ApplicationFiled: August 22, 2007Publication date: March 6, 2008Applicant: Hitachi Via Mechanics, Ltd.Inventors: Kunio Arai, Yasuhiko Kita, Yasushi Ito
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Patent number: 7336816Abstract: The present invention provides a bump shape measuring apparatus comprising an illumination optical system which illuminates bumps arranged on a board with illumination light of a low tilt angle to a surface of the board; a detection optical system where reflected light from the bumps is condensed for detection of image signals of the bumps by a high tilt angle to the surface of the board; an image processing unit where an outline of the tip and the base of each of the bumps is calculated based on the image signals of each of the bumps, and geometric characteristics including at least a position and height of each of the bumps are calculated based on the outline of the tip and the base of each of the bumps; and a main control unit where information on the calculated geometric characteristics of the bumps is displayed on a display unit.Type: GrantFiled: October 15, 2004Date of Patent: February 26, 2008Assignee: Hitachi Via Mechanics, Ltd.Inventors: Hideaki Sasazawa, Mineo Nomoto, Masatoshi Yamaga, Chikara Iwata, Masashi Uehara
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Publication number: 20080036309Abstract: A rocking actuator and a laser machining apparatus which can suppress a temperature rise of a permanent magnet in a moving-magnet actuator. Even when a steerable mirror is positioned by rapid and continuous motions, highly reliable machining can be performed without degrading machining throughput or hole position accuracy. A cooling jacket for cooling a casing and heat transfer units brought into contact with a coil and the casing are provided. Heat generated in the coil is introduced to the casing through the heat transfer bypass units. Thus, the temperature rise of the coil is suppressed. Radial grooves are provided in the permanent magnet opposed to the coil so as to prevent an eddy current from appearing therein. Groove depth is made not smaller than skin depth expressed by a function of volume resistivity and permeability of the permanent magnet and a fundamental frequency of a current applied to the coil.Type: ApplicationFiled: August 3, 2007Publication date: February 14, 2008Applicants: Hitachi Via Mechanics, Ltd., National University Corporation Nagoya Institute of TechnologyInventors: Souichi Toyama, Kounosuke Kitamura, Akira Doi, Hiromu Hirai, Kenta Seki, Yoshiaki Kano
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Patent number: 7321114Abstract: An apparatus and method for maintaining a desired position of a collimated light beam are provided. An optical system includes one or more passive optical elements movably positioned in the beam path. Beam position is responsive to movement of at least one of the passive optical elements. The actual position of the beam is detected and compared with the desired beam position. An error signal is generated and the beam path is altered responsive to movement of one or more of the passive optical elements. In further aspects, beam shaping optics, such diffractive optics, are provided to shape the sensed beam portion. In still other aspects, thermal conditions of the laser may be monitored and a thermal map is provided to automatically compensate for estimated beam drift due to thermal conditions.Type: GrantFiled: March 10, 2005Date of Patent: January 22, 2008Assignee: Hitachi Via Mechanics, Ltd.Inventors: Todd E. Lizotte, Orest P. Ohar
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Publication number: 20080008854Abstract: A composite sheet whose product price can be reduced with a smaller number of manufacturing processes. A laser oscillator outputs a pulsed beam at a frequency f. A mask shapes the outer shape of the beam into a triangular, quadrangular or hexagonal shape. N pieces of time-sharing means time-share the beam to form N beams having a frequency f/N. N pairs of positioning means position the time-shared beams. A condensing lens condenses the beams. A rotating drum displaces a workpiece. A control means controls the time-sharing means, the N pairs of positioning means and a pedestal. The N pairs of positioning means are positioned to irradiate predetermined positions with the beams. The pedestal is moved. The time-sharing means are thereupon operated in predetermined order. The workpiece is machined to make holes whose outer shapes depend on the mask so that distances between sides of adjacent holes are equal to one another.Type: ApplicationFiled: June 7, 2007Publication date: January 10, 2008Applicant: Hitachi Via Mechanics, Ltd.Inventors: Kunio Arai, Tadashi Matsumoto, Hiromi Nishiyama, Kazuhisa Ishii
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Publication number: 20070279609Abstract: A parallel glass which is a prism having a parallelogram-shaped cross section in an x-y direction, and parallel glasses which are prisms having a parallelogram-shaped cross section in the x-y direction and each include grooves formed in one surface in a z direction perpendicular to the x-y direction, are stacked in direct contact with each other such that the grooves are located on the inside, and light trying to enter the grooves is subjected is total reflection, thereby changing incident parallel beams with a pitch of 13 mm into emergent parallel beams with a pitch of 1 mm.Type: ApplicationFiled: May 30, 2007Publication date: December 6, 2007Applicant: Hitachi Via Mechanics, Ltd.Inventors: Yoshitada OSHIDA, Yoshitatsu Naito, Mituhiro Suzuki, Tsuyoshi Yamaguchi, Shigenobu Maruyama