Abstract: An ambient light sensor includes a substrate, a metasurface disposed on the substrate, and an aperture layer disposed on the substrate. The metasurface includes a plurality of nanostructures and a filling layer laterally surrounding the plurality of nanostructures. The aperture layer laterally separates the metasurface into a plurality of sub-meta groups.

Abstract: A solid-state image sensor is provided. The solid-state image sensor includes a semiconductor substrate having photoelectric conversion elements. The photoelectric conversion elements form an N×N pixel array, where N is a positive integer larger than or equal to 3. The solid-state image sensor also includes a modulation layer disposed above the photoelectric conversion elements. The solid-state image sensor further includes a light-adjusting structure disposed on the modulation layer and corresponding to the N×N pixel array. The N×N pixel array includes a first pixel region having at least one first pixel. The N×N pixel array also includes a second pixel region adjacent to the first pixel region in a first direction and in a second direction different from the first direction and having second pixels. The aperture ratio of the first pixel and the aperture ratio of the second pixel are different.

Abstract: An optical device is provided. The optical device has a central region and a first-type region surrounding the central region. The first-type region includes a first sub-region and a second sub-region between the central region and the first sub-region. The optical device includes a substrate. The optical device also includes a meta-structure disposed on the substrate. The meta-structure includes first pillars in the first sub-region and second pillars in the second sub-region. In the cross-sectional view of the optical device along the radial direction of the optical device, two adjacent first pillars have a first pitch, two adjacent second pillars have a second pitch, and the second pitch is greater than the first pitch.

Abstract: An optical device is provided. The optical device includes a time-of-flight (TOF) sensor array, a photon conversion thin film, and a light source. The photon conversion thin film is disposed above the time-of-flight sensor array. The light source emits light with a first wavelength towards the photon conversion thin film to be converted into light with a second wavelength received by the time-of-flight sensor array. The second wavelength is longer than the first wavelength.

Abstract: The present invention provides an image processing method, including: obtaining a first image using a camera under a display screen; processing the first image using a processor; obtaining a second image using the camera under the display screen; processing the second image using the processor; and generating a superimposed image after superimposing the first sub-image and the second sub-image.

Abstract: An image sensor is provided. The image sensor includes a substrate having a first pixel region and a second pixel region. The image sensor also includes a resonator structure disposed over the substrate. The resonator structure includes a first metal layer over the first pixel region and the second pixel region. The resonator structure also includes a first insulating layer over the first metal layer and the first pixel region. The first insulating layer has a first thickness. The resonator structure further includes a second insulating layer over the first metal layer and the second pixel region. The second insulating layer has a second thickness that is greater than the first thickness. In addition, the resonator structure includes a second metal layer over the first insulating layer and the second insulating layer.

Abstract: An optical device is provided. The optical device includes a plurality of IR-cut pixels, a plurality of IR-pass pixels, and a plurality of grids. The grids surround the IR-cut pixels and the IR-pass pixels. Each IR-cut pixel includes a first grating structure. A method for fabricating the optical device is also provided.

Abstract: An apparatus for removing a photoresist layer from at least one alignment mark of a wafer is provided. The apparatus includes a holder, a solvent dispenser, and a suction unit. The holder is used to support the wafer, wherein the alignment mark is formed in a peripheral region of the wafer. The solvent dispenser is used to spray a solvent onto the photoresist layer on the alignment mark of the wafer to generate a dissolved photoresist layer. The suction unit is used to remove the dissolved photoresist layer and the solvent from the wafer through exhausting.

Abstract: An optical device includes a first region and a second region surrounding the first region. The optical device includes a substrate. The optical device also includes a first meta-structure disposed on the substrate and has a plurality of first peripheral pillars in the second region. The optical device further includes a second meta-structure disposed on the substrate and has a plurality of second peripheral pillars corresponding to the plurality of first peripheral pillars. Each of the second peripheral pillars has a first shifting distance with respect to a corresponding first peripheral pillar in the direction extending from the center of the optical device to the edge of the optical device.

Abstract: A biosensor is provided. The biosensor includes a plurality of sensor units. Each of the sensor units includes one or more photodiodes, a first aperture feature disposed above the photodiodes, an interlayer disposed on the first aperture feature, a second aperture feature disposed on the interlayer, and a waveguide disposed above the second aperture feature. The second aperture feature includes an upper grating element and the first aperture feature includes one or more lower grating elements, and a grating period of the upper grating element is less than or equal to a grating period of the one or more lower grating elements. A difference of the absolute values between a first polarizing angle of the upper and lower grating elements in one of the sensor units and a second polarizing angle of the upper and lower grating elements in adjacent one of the sensor units is 90°.

Abstract: An optical structure is provided. The optical structure includes an optical element and a plurality of protrusions. The optical element has a planarized top surface. The plurality of protrusions are disposed on the planarized top surface, wherein each of the plurality of protrusions independently has a size in the subwavelength dimensions.

Abstract: A biosensor is provided. The biosensor includes a substrate, a first photodiode, a second photodiode, an angle-sensitive filter, and an immobilization layer. The first photodiode and the second photodiode are disposed in the substrate and define a first pixel and a second pixel, respectively. The first pixel and the second pixel receive a light. The angle-sensitive filter is disposed on the substrate. The immobilization layer is disposed on the angle-sensitive filter.

Abstract: An optical device is provided. The optical device includes a substrate, a plurality of color filters and a plurality of spacers. The substrate has a central region and a peripheral region. The plurality of color filters include red color filters, green color filters and blue color filters and are formed on the substrate. The plurality of spacers are formed between the color filters. The refractive index of the spacers reduces gradually from that of the spacer located at the central region to that of the spacer located at the peripheral region of the substrate.

Abstract: The solid-state image sensor includes a semiconductor substrate having first and second photoelectric conversion elements, a color filter layer, and a hybrid layer. The isolation structure is disposed between the first and second photoelectric conversion elements. The color filter layer is disposed above the semiconductor substrate. The hybrid layer is disposed between the semiconductor substrate and the color filter layer. The hybrid layer includes a first partition structure, a second partition structure, and a transparent layer. The first partition structure is disposed to correspond to the isolation structure. The second partition structure is surrounded by the first partition structure. The transparent layer is between the first partition structure and the second partition structure. The refractive index of the first partition structure and the refractive index of the second partition structure are lower than the refractive index of the transparent layer.

Abstract: A biosensor is provided. The biosensor includes a substrate, photodiodes, pixelated filters, an excitation light rejection layer and an immobilization layer. The substrate has pixels. The photodiodes are disposed in the substrate and correspond to one of the pixels, respectively. The pixelated filters are disposed on the substrate. The excitation light rejection layer is disposed on the pixelated filter. The immobilization layer is disposed on the excitation light rejection layer.

Abstract: A solid-state image sensor is provided. The solid-state image sensor includes a plurality of photoelectric conversion elements. The solid-state image sensor also includes a first color filter layer disposed above the photoelectric conversion elements and having a plurality of first color filter segments. The solid-state image sensor further includes a second color filter layer disposed adjacent to the first color filter layer and having a plurality of second color filter segments. The solid-state image sensor includes a first grid structure disposed between the first color filter layer and the second color filter layer. The first grid structure has a first grid height. The solid-state image sensor also includes a second grid structure disposed between the first color filter segments and between the second color filter segments. The second grid structure has a second grid height that is lower than or equal to the first grid height.

Abstract: An optical fingerprint sensor is provided. The optical fingerprint sensor includes a substrate, a plurality of light-shielding layers and a plurality of groups of microlenses. The substrate has a plurality of photoelectric conversion units disposed therein. The light-shielding layers are sequentially disposed on the substrate. Each light-shielding layer includes a plurality of apertures formed therein. Each group of microlenses is disposed above the apertures formed in an uppermost light-shielding layer and overlies one photoelectric conversion unit.

Abstract: A micro light-emitting diode (LED) display panel is provided. The micro LED display panel includes a substrate and a driving layer. The driving layer is disposed on the substrate. The driving layer includes a micro LED and a photo sensor. When the micro LED emits light to a finger of a user, the photo sensor generates a sensing signal.

Abstract: An optical element is provided. The optical element includes a substrate; a plurality of metal grids formed on the substrate; an oxide layer formed on the substrate between the plurality of metal grids; and a plurality of organic layers formed on the plurality of metal grids, wherein the width of the organic layer is greater than the width of the metal grid, and there is at least one gap between the organic layer and the oxide layer.

Abstract: A method forming an image sensor includes: providing a substrate including a plurality of sensing portions; forming a color filter layer on the substrate; forming a micro-lens material layer on the color filter layer; and forming a hard mask pattern on the micro-lens material layer, wherein the hard mask pattern has a first gap and a second gap larger than the first gap. The method includes reflowing the hard mask pattern into a plurality of dome shapes; transferring the plurality of dome shapes into the micro-lens material layer to form a plurality of micro-lenses; and forming a top film conformally on the plurality of micro-lenses.