Abstract: A bonding pad structure for an optoelectronic device. The bonding pad structure includes a carrier substrate having a bonding pad region and an optoelectronic device region. An insulating layer is disposed on the carrier substrate, having an opening corresponding to the bonding pad region. A bonding pad is embedded in the insulating layer under the opening to expose the top surface thereof. A device substrate is disposed on the insulating layer corresponding to the optoelectronic device region. A cap layer covers the device substrate and the insulating layer excluding the opening. A conductive buffer layer is disposed in the opening to directly contact the bonding pad. The invention also discloses a method for fabricating the same.

Abstract: The invention provides a compact camera module. The compact camera module includes an image sensing device, a set of optical elements, and a zooming device. The set of optical elements connects to the image sensing device, and comprises a lens set. The zooming device connects to the set of optical elements for adjusting a distance between the lens set and the image sensing device. The zooming device directly electrically joins with the image sensing device.

Abstract: An electronic assembly for an image sensing device is disclosed, comprising an image sensing element, a lens set comprising a feet enclosing a cavity to receive the image sensing element and an opaque conductive layer disposed on at least a portion of a top side, a sidewall and a bottom side of the lens set, wherein the opaque conductive layer is electrically connected to a grounding layer to reduce electromagnetic interference (EMI) to the image sensing element.

Abstract: A method for designing an optical device which includes a lens and a microlens array is disclosed. A point spread function (PSF) of the lens including rotationally symmetrical aberration coefficients is formulated, wherein the PSF presents various spherical spot sizes. A virtual phase mask having phase coefficients is provided and the phase coefficients are added to the PSF of the lens, such that the various spherical spot sizes are homogenized. The virtual phase mask is transformed into a polynomial function comprising high and low order aberration coefficients. A surface contour of the lens is determined according to the rotationally symmetrical aberration coefficients and the low order aberration coefficients, and a sag height of each microlens in the microlens array is determined according to the high order aberration coefficients. An optical device using the design method is also disclosed.

Abstract: A camera unit is provided, including a camera lens and a macro lens coupled with the camera lens module along an optical axis. The macro lens comprises a plane substrate and a plano-convex lens structure formed on the plane substrate by wafer level processing, wherein the effective focal length of the macro lens is between 80-150 mm.

Abstract: An image sensor is provided. The image sensor includes a pixel sensor, a color filter array comprising a plurality of color filters formed on the pixel sensor, wherein two adjacent color filters have a gap therebetween, and a gapless microlens array comprising a plurality of microlenses formed on the color filter array. The invention also provides a method for fabricating the image sensor.

Abstract: An image capture lens module includes a first compound lens with a first lens element, a second lens element, and a third lens element arranged in sequence from an object side to an image side. A second compound lens includes a fourth lens element, a fourth lens element, and a fifth lens element arranged in sequence from an object side to an image side. A cover glass for an image sensor is positioned behind the second compound lens, wherein the first compound lens, the second compound lens and the cover glass are arranged in sequence from an object side to an image side.

Abstract: A method for fabricating an image sensor device is disclosed. The method for fabricating an image sensor device comprises forming a photosensitive layer on a substrate. The photosensitive layer is exposed through a first photomask to form an exposed portion and an unexposed portion. The unexposed portion is partially exposed through a second photomask to form a trimmed part, wherein the second photomask comprise a first segment and a second segment that has a transmittance greater than that of the first segment. The trimmed part is removed to form photosensitive structures. The photosensitive structures are reflowed to form a first microlens and a second microlens having different heights.

Abstract: Image capture lens modules and image capture systems are presented. An image capture lens module includes a first compound lens with a first lens element, a second lens element, and a third lens element arranged in sequence from an object side to an image side. A second compound lens includes a fourth lens element, a fourth lens element, and a fifth lens element arranged in sequence from an object side to an image side. A curvature radius of the first lens element is positive, a curvature radius of the third lens element is negative, a curvature radius of the fourth lens element is negative, and a curvature radius of the sixth lens element is negative. An abbe number of the first lens element exceeds 55 and an abbe number of the third lens element is less than 30.

Abstract: The invention provides a camera module and a method for fabricating the same. A camera module includes an image sensor device chip having a plurality of solder balls on a bottom surface thereof. An optical lens is disposed on the image sensor device chip. A metal plate has a part that extending over the bottom surface of the image sensor device. A metal coating layer surrounds vertical surfaces of the optical lens and a top surface of the part of the metal plate. A first light shielding layer covers vertical surfaces of the metal coating layer.

Abstract: An image sensor device is disclosed. The image sensor device includes a semiconductor substrate having a first pixel region and a second pixel region. A first photo-conversion device is disposed within the first pixel region of the semiconductor substrate to receive a first light source. A second photo-conversion device is disposed within the second pixel region of the semiconductor substrate to receive a second light source different from the first light source. The surface of the semiconductor substrate corresponding to the first photo-conversion device and the second photo-conversion device has a first microstructure and a second microstructure, respectively, permitting a reflectivity of the first pixel region with respect to the first light source to be lower than a reflectivity of the second pixel region with respect to the first light source. The invention also discloses a fabrication method of the image sensor device.

Abstract: An anti-reflection structure for transmitting a light source is disclosed. The anti-reflection structure comprises a first dielectric layer of a first refractive index and a second dielectric layer of a second refractive index different from the first refractive index. The first dielectric layer has a plurality of protrusions randomly arranged on a top surface thereof, in which the plurality of protrusions and the intervals therebetween has an average size smaller than the wavelength of the light source. The second dielectric layer has a bottom surface conformally attached to the top surface of the first dielectric layer. The invention also discloses an image sensor device having the anti-reflection structure.

Abstract: Image capture lens modules are presented. An image capture lens module includes a first compound lens with a first element and a second element arranged in sequence from an object side to an image side. The second element is a plano-convex lens with a convex surface facing the image side on a paraxial line. A second compound lens includes a third element, a fourth element, and a fifth element arranged in sequence from an object side to an image side. The third element is a plano-convex lens with a convex surface facing the object side on a paraxial line, and the fifth element is a plano-concave lens with a concave surface facing the image side on a paraxial line. A third compound lens includes a sixth element and a seventh element arranged in sequence from an object side to an image side, wherein the sixth element is a plano-convex lens with a convex surface facing the object side on a paraxial line.

Abstract: Color filter arrays (CFA) and image sensors using same are provided. A color filter array includes a plurality of first color filter patterns respectively interlaced with a plurality of second color filter patterns, wherein the first and second color filter patterns comprise a plurality of color filters of at least three different colors of red (R), green (G) and blue (B) filters, and the first and second color filter patterns are not mirror symmetrical, and a blue (B) filter in one of the first color filter patterns is adjoined by a red (R) filter in one of the second color filter patterns adjacent thereto and/or a red (R) filter in one of the first color filter patterns is adjoined by a blue filter in one of the color filter patterns adjacent thereto.

Abstract: Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device comprises a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.

Abstract: Light emitting devices conformally covered by a luminescent material layer are presented. A light emitting device includes a semiconductor light emitting die attached to a substrate. At least one bond pad is disposed on the semiconductor light emitting die. A luminescent material layer conformally covers the semiconductor light emitting die, wherein the luminescent material layer has at least one opening corresponding to and exposing the at least one bond pad. At least one wirebond is electrically connected to the at least one bond pad and a contact pad on the substrate.

Abstract: A miniature image capture lens is disclosed, comprising a wafer scale lens system, which comprises a first lens group including a first substrate, a first surface disposed on a first side of the first substrate, a second surface disposed on a second side of the first substrate, and a second lens group including a second substrate, a third surface disposed on a first side of the second substrate, and a fourth surface disposed on a second side of the second substrate, wherein the first surface, the second surface, the third surface and the fourth surface are aspherical, one of the first surface and the second surface, and one of the third surface and the fourth surface have a high refraction index Nd_h and a high abbe number Vd_h, another one of the first surface and the second surface, and another one of the third surface and the fourth surface have a low refraction index Nd_l and a low abbe number Vd_l, and the miniature image capture lens meets the following conditions: Nd—h=1.58˜1.62; Nd—l=1.48˜1.

Abstract: An image sensor is provided. The image sensor includes a pixel sensor, a color filter array comprising a plurality of color filters formed on the pixel sensor, wherein two adjacent color filters have a gap therebetween, and a gapless microlens array comprising a plurality of microlenses formed on the color filter array. The invention also provides a method for fabricating the image sensor.

Abstract: A method for forming a lens assembly is provided, including: providing a mold substrate, wherein at least a recess is formed from a surface of the mold substrate; providing a transparent substrate; disposing a lens precursor material on the surface of the mold substrate or on a first surface of the transparent substrate; disposing the mold substrate on the transparent substrate such that at least a portion of the lens precursor material is filled in the recess; disposing a mask on a second surface of the transparent substrate to partially cover the transparent substrate; after the mask is disposed, irradiating a light on the second surface of the transparent substrate to transform at least a portion of the lens precursor material on the first surface of the transparent substrate into a lens; and removing the mask and the mold substrate from the transparent substrate and the lens.

Abstract: According to embodiments of the invention, a lens assembly and method for forming the same is provided. The method includes providing a first lens layer having a first transparent substrate and a first lens on the first transparent substrate, providing a second lens layer having a second transparent substrate and a second lens on the second transparent substrate, forming a spacer structure between the first lens layer and the second lens layer, and thinning the first transparent substrate to a first thickness after the spacer is formed.