Abstract: A semiconductor package by which contacts are made to both sides of the dice is manufactured on a wafer scale. The back side of the wafer is attached to a metal plate. The scribe lines separating the dice are saw cut to expose the metal plate but the cuts do not extend through the metal plate. A metal layer, which may include a number of sublayers, is formed on the front side of the dice, the metal covering the exposed portions of the metal plate and extending the side edges of the dice. Separate sections of the metal layer may also cover connection pads on the front side of the dice. A second set of saw cuts are made coincident with the first set of saw cuts, using a blade that is narrower than the blade used to make the first set of saw cuts. As a result, the metal layer remains on the side edges of the dice connecting the back and front sides of the dice (via the metal plate).

Abstract: A precision high-frequency capacitor includes a dielectric layer formed on the front side surface of a semiconductor substrate and a first electrode on top of the dielectric layer. The semiconductor substrate is heavily doped and therefore has a low resistivity. A second electrode, insulated from the first electrode, is also formed over the front side surface. In one embodiment, the second electrode is connected by a metal-filled via to a layer of conductive material on the back side of the substrate. In alternative embodiments, the via is omitted and the second electrode is either in electrical contact with the substrate or is formed on top of the dielectric layer, yielding a pair of series-connected capacitors. ESD protection for the capacitor can be provided by a pair of oppositely-directed diodes formed in the substrate and connected in parallel with the capacitor.

Abstract: A semiconductor package by which contacts are made to both sides of the dice is manufactured on a wafer scale. The back side of the wafer is attached to a metal plate. The scribe lines separating the dice are saw cut to expose the metal plate but the cuts do not extend through the metal plate. A metal layer, which may include a number of sublayers, is formed on the front side of the dice, the metal covering the exposed portions of the metal plate and extending the side edges of the dice. Separate sections of the metal layer may also cover connection pads on the front side of the dice. A second set of saw cuts are made coincident with the first set of saw cuts, using a blade that is narrower than the blade used to make the first set of saw cuts. As a result, the metal layer remains on the side edges of the dice connecting the back and front sides of the dice (via the metal plate).

Abstract: A conductive polymer capacitor includes an anode formed from a porous metal body having an anode lead extending therefrom. A dielectric layer is formed by oxidizing a surface of the anode. A solid electrolyte is formed on the dielectric layer and includes first and second polymer layers. The second conductive polymer layer includes a polyaniline layer formed by dipping the metal body having the first conductive layer thereon into a solution of doped polyaniline dissolved in an organic solvent.

Abstract: This semiconductor surface mount package is relatively inexpensive to produce and has a footprint that is essentially the same size as the die. A conductive substrate is attached to the back side of a wafer and is in electrical contact with a terminal on the back side of each die in the wafer. A nonconductive overcoat is formed and patterned on the front side of the wafer, leaving a portion of the passivation layer and the connection pads for the dice exposed, each of the connection pads being coated with a solderable metal layer. The assembly is then sawed in perpendicular directions along the scribe lines between the dice, but the saw cuts do not extend all the way through the substrate, which remains intact at its back side. The parallel cuts in one direction are broken to produce die strips which are mounted, sandwich-like, in a stack, with one side of the strips exposed.

Abstract: An device for use in an electro-pyrotechnic initiator comprises a header, a foil resistive strip, a substrate, and a current source. The substrate is mounted on the header. The foil resistive strip is mounted on the substrate. The energy source is connected to the resistive strip. When current flows through the resistive strip, the resistive strip generates enough heat to spark autoignition of a pyrotechnic material. The pyrotechnic material is in direct contact with the resistive strip. For an energy input of up to 115 microjoules, the resistive strip can cause autoignition in less than 25 microseconds. In a second embodiment, an electro-pyrotechnic initiator for use in a “smart” airbag system comprises a header, a foil resistive strip, a substrate, a current source connected to the resistive strip, and a control circuit. The control circuit is designed such that it will cause current to flow through the resistive strip when the circuit receives an appropriate signal.

Abstract: A package for a semiconductor device is formed by a process which includes forming a metal layer in contact with a connection pad on the front side of a semiconductor die while the die is still a part of a wafer. The metal layer extends into the scribe line between the die and an adjacent die. A nonconductive cap is attached to the front side of the wafer, and the wafer is ground from its back side to reduce its thickness. A cut is made from the back side of the wafer, preferably by sawing and etching, to expose the metal layer. A nonconductive layer is formed on the back side of the wafer and a second metal layer is deposited over the nonconductive layer, the second metal layer extending into the scribe line where it makes contact with the first metal layer through an opening in the nonconductive layer. Preferably, a solder post is formed on the second metal layer to allow the finished package to be mounted on a printed circuit board.

Abstract: This semiconductor surface mount package is relatively inexpensive to produce and has a footprint that is essentially the same size as the die. A conductive substrate is attached to the back side of a wafer and is in electrical contact with a terminal on the back side of each die in the wafer. A nonconductive overcoat is formed and patterned on the front side of the wafer, leaving a portion of the passivation layer and the connection pads for the dice exposed, each of the connection pads being coated with a solderable metal layer. The assembly is then sawed in perpendicular directions along the scribe lines between the dice, but the saw cuts do not extend all the way through the substrate, which remains intact at its back side. The parallel cuts in one direction are broken to produce die strips which are mounted, sandwich-like, in a stack, with one side of the strips exposed.

Abstract: An electrical resistor which is fabricated from traces of resistive material on a substrate of insulating material. The traces are interconnected electrically in series by first links and in parallel by second alternating links, which are connected to different terminals on the substrate. The second links are cut, preferably by laser trimming, so as to select the value of resistance of the resistor by reducing the number of traces connected in parallel and increasing the number of traces connected in series. Where the resistance of each trace is "R", the value of the resistance is adjustable by severing the second links from R/n to nR, where n is the number of traces.

Abstract: A precision resistor exhibiting a temperature coefficient of resistance which is very low and which is virtually independent of time, and capable of accepting high power, comprises a resistive foil applied to a substrate by means of an appropriate cement, wherein the coefficient of thermal expansion of the substrate is either at zero or as close to zero as is possible, and wherein the resistivity versus temperature characteristic of the foil selected is adjusted so as to compensate for the thermal strain induced change in resistance which results when the temperature of the assembly changes, and the device is reacting to the application of power virtually without creating a transient phenomenon due to the flow of heat. Also a method for producing such a precision resistor.

Abstract: A precision resistor of the type formed by defining a resistive path in a thin foil of resistance material attached to a substrate. Metallic interface layers are deposited on terminal pads between which the resistive path extends, so that when solder-coated copper leads are spot-welded to the terminal pads, the junction between the copper leads and the terminal pads is both a spot-weld and a solder connection.

Abstract: A precision resistor using a resistance metal film etched into a long serpentine strip cemented to a substrate. This substrate is a composite of rigid materials and plastics. The composite thermal coefficient of expansion of the substrate is given a non-linearity which in turn induces a stress related non-linear resistance change in the cemented film when the temperature changes. This stress-induced non-linear change is of approximately the same shape as the inherent non-linearity of the resistance versus temperature of the metal film, but opposite in polarity, over a wide range of resistor operating temperatures. Over the range, a much closer approximation to complete temperature compensation is obtained than previously.

Abstract: Improved resistive electrical components are disclosed comprising an insulating or insulated substrate, a resistive foil bonded to the substrate having photoetched therein a pair of terminal pads for making electrical connections to the component and a system of resistive paths interconnecting the terminal pads, said system including an unadjustable section or sections and a plurality of adjustable sections, each having an adjustment tab associated therewith, said tab being removable to modify said section resistance and thereby altering the total resistance presented by the component between its terminal pads, the configurations of the sections differing from each other in a modified geometric progression so that the total resistance of said component is altered by a differing amount depending on which of the sections is modified by removal of its associated adjustment tab, whereby the total resistance of the component may be systematically varied in a sequence of successive steps to achieve a desired ultima

Abstract: Qualitative as well as quantitative evaluation of bite characteristics is performed by subjecting to bite forces pieces of material which exhibits photoelastic memory and studying the resulting impression with a polariscope. A permanent record can also be obtained.

Abstract: A precision resistor using a resistance metal film etched into a long serpentine strip cemented to a substrate. This substrate is a composite of rigid materials and plastics. The composite thermal coefficient of expansion of the substrate is given a non-linearity which in turn induces a stress related non-linear resistance change in the cemented film when the temperature changes. This stress-induced non-linear change is of approximately the same shape as the inherent non-linearity of the resistance versus temperature of the metal film, but opposite in polarity, over a wide range of resistor operating temperatures. Over that range, a much closer approximation to complete temperature compensation is obtained than previously.

Abstract: A precision resistor has a thin resistive foil cemented to a much thicker rigid substrate. The foil has formed therein a pattern defining the resistive path between terminal pads. Copper leads can be spot-welded directly to these pads without damage to the junction. To that end, apertures are provided through the terminal pads, through which cement softened by the spot-welding heat can locally expand and gas evolved under pressure can escape, all without adversely affecting the junction and without substantial lifting of the terminal pads from the substrate.

Abstract: Improved resistive electrical components are disclosed comprising an insulating or insulated substrate, a resistive foil bonded to the substrate having photoetched therein a pair of terminal pads for making electrical connections to the component and a system of resistive paths interconnecting the terminal pads, said system including an unadjustable section or sections and a plurality of adjustable sections, each having an adjustment tab associated therewith, said tab being removable to modify said section resistance and thereby altering the total resistance presented by the component between its terminal pads, the configurations of the sections differing from each other in a modified geometric progression so that the total resistance of said component is altered by a differing amount depending on which of the sections is modified by removal of its associated adjustment tab, whereby the total resistance of the component may be systematically varied in a sequence of successive steps to achieve a desired ultima

Abstract: An electrical component, comprising an insulating substrate having conductive material applied to one side thereof and including terminal pad portions for attaching electrically connecting leads thereto, in which said leads are provided with relatively thick rigid portions adapted to extend externally of the component to provide means for making electrical connections thereto and have relatively thinner, less rigid portions mechanically bonded to the other side of said substrate and have end portions dressed around the edge of said substrate to said one side thereof and electrically connected to said terminal pad portions by brazing, welding or soldering. In a preferred form, said leads may be bonded to said substrate by epoxy or other suitable cement and the end portions thereof may be made even thinner than the remainder of said thinner portions to facilitate dressing them around the edge of said substrate into contact with said terminal pad portions.