Abstract: A system and associated method for aligning semiconductor wafers and wafer-like objects relative to a transport mechanism. An image of, for example, a wafer is acquired, digitized, and stored in a computer as an array of pixels, each pixel representing a point on the image. Data points along the edge of the wafer are extracted and used to geometrically estimate the center of the wafer object. The estimated wafer center is then compared to the position of a predetermined reference position to determine an offset. Using this information, the wafer transport mechanism can then be re-adjusted to pick up the wafer on the corrected center.

Abstract: A processing system and associated method for vacuum evaporation of material onto a substrate. The processing system includes a loading chamber, a transfer chamber, and a thermal processing chamber arranged together to form a cluster tool. The cluster tool arrangement provides the system a continuous processing capability. The system also includes an evacuation system arrangement for evacuating the processing system to adequate processing pressure levels. The evacuation system arrangement includes a series of pumps, which are capable of maintaining the selected processing pressure levels for continuous thermal evaporation processing without the need for lowering the pressure to deep vacuum pressure levels.

Abstract: A system and method for providing substantially defect free rapid thermal processing. The present invention includes a wafer processing system used to process semiconductor wafers into electronic devices. In accordance with the present invention, once the wafer is processed, a shield can be inserted into the reactor to a position between the reactor heating surface and the wafer. The shield causes the temperature of the wafer to be reduced. Once the temperature of the wafer has been reduced to below a predetermined critical temperature, the robot picks up the wafer and removes the wafer from the processing chamber.

Abstract: A wafer processing system occupies minimal floor space by using vertically mounted modules such as reactors, load locks, and cooling stations. Further saving in floor space is achieved by using a loading station which employs rotational motion to move a wafer carrier into a load lock. The wafer processing system includes a robot having extension, rotational, and vertical motion for accessing vertically mounted modules. The robot is internally cooled and has a heat resistant end-effector, making the robot compatible with high temperature semiconductor processing.

Abstract: A wafer processing system which requires no isolation between the operational areas within the processing system. The system of the present invention includes operational areas, such as a loading area, a transport area, and a reactor or thermal processing area. Advantageously, since there are no isolation devices or gate valves separating the areas, the processing system effectively has each operational area combined into a “single” chamber. Preferably, the single chamber has a single slit valve, hinge door, or other vacuum sealable door disposed proximate to the loading area to allow for the removal/insertion of the wafers into the loading area. Once the door to the loading area has been closed the internal pressure within the chamber can be kept uniform throughout each operational area.

Abstract: A wafer processing system occupies minimal floor space by using vertically mounted modules such as reactors, load locks, and cooling stations. Further saving in floor space is achieved by using a loading station which employs rotational motion to move a wafer carrier into a load lock. The wafer processing system includes a robot having extension, rotational, and vertical motion for accessing vertically mounted modules. The robot is internally cooled and has a heat resistant end-effector, making the robot compatible with high temperature semiconductor processing.

Abstract: A system and method for using a portable enclosure system for conducting on-site demonstrations of semiconductor processing operations or as a temporary clean room. A vehicle transports an environmentally-controlled enclosure including a semiconductor processing workspace, preparation area, and entrance area, from a first location to a second location. An air suspension device and trailer are included in one embodiment. Air suspension devices and an enclosed truck are included in another embodiment. In yet another embodiment, the environmentally-controlled enclosure system includes a viewing mechanism, which allows for visual inspection of the internal portion of the enclosure from outside of the controlled environment, especially advantageous during demonstrations.

Abstract: A wafer processing system which requires no isolation between the operational areas within the processing system. The system of the present invention includes operational areas, such as a loading area, a transport area, and a reactor or thermal processing area. Advantageously, since there are no isolation devices or gate valves separating the areas, the processing system effectively has each operational area combined into a “single” chamber. Preferably, the single chamber has a single slit valve, hinge door, or other vacuum sealable door disposed proximate to the loading area to allow for the removal/insertion of the wafers into the loading area. Once the door to the loading area has been closed the internal pressure within the chamber can be kept uniform throughout each operational area.

Abstract: A positionable arm composed of multiple member segments connected by an adjustable joint which may be fixedly positioned and repeatedly repositioned. The first member includes an end portion defining a first connector opening and an inner surface defining a chamber. A slideable piston provided in the first member includes a first end and a second end, the first end being adjacent the chamber and creating a seal along the inner surface of the first member. A rotatable connector is received in the first member between the second end of said piston and the end portion of the first member, and a second member is attached to the rotatable connector. To position the arm, a pressurized fluid source supplies compressed air to the chamber, which presses the piston against the rotatable connector, fixedly clamping the connector between the piston and the end portion of the first chamber.

Abstract: A heat exchanger is used to transfer heat from water to liquid nitrogen. As heat is transferred from the water to the liquid nitrogen, the temperature of the water becomes lower and the liquid nitrogen converts to gaseous nitrogen. The cooled water and gaseous nitrogen are used by one or more semiconductor fabrication equipment in the semiconductor fabrication process. Thus, overall power consumption of the semiconductor fabrication process is lowered because water is cooled by passing the water by liquid nitrogen to convert the liquid nitrogen to gaseous nitrogen for use in the semiconductor fabrication process.

Abstract: A heating apparatus for isothermally distributing a temperature across a semiconductor device or wafer during processing. The invention includes a chamber configured to receive a single semiconductor wafer. Housed within the chamber is a heating member or heating plate. Disposed on a periphery of the heating member is a heat source. Heat energy radiating from the heat source conducts through the heating member to create an isothermal temperature distribution across the heating member. Wafer supports are included on the heating plate which support the wafer in close proximity to the heating plate, such that the temperature of the heating plate establishes the temperature of the wafer. Advantageously, this configuration permits the temperature to be uniformly and isothermally distributed over the wafer.

Abstract: An apparatus, system, and method for uniformly and controllably heating the active surface of a semiconductor wafer during processing. The present invention includes a scanner assembly, which is operable to scan over a single semiconductor wafer. A radiation energy source is provided enclosed within the main body of the scanner assembly. The radiation energy source may be surrounded by a reflective/absorptive surface, which reflects and absorbs the emitted radiation, such that the resultant energy output is substantially free of non-uniformities. The reflected energy is directed through a slit in the scanner assembly to the wafer. The narrow wavelength band of energy allowed to escape the scanner assembly is uniformly scanned over the wafer to heat only the active layer of the wafer surface.

Abstract: A heating apparatus and method for isothermally distributing a temperature across the surface of a semiconductor device during processing. Specifically, a chamber is provided defining a cavity, which is configured to receive a single semiconductor wafer. A plurality of resistive heating elements are provided and advantageously arranged in the cavity. The heating elements are disposed across the chamber and are aligned in close proximity to one another so as to provide an even heating temperature distribution. In accordance with the present invention, the cavity is divided into heating zones. The resistive heating elements are each individually assigned to a zone and are independently controllable. By individually varying the amount of energy emanating from each resistive heating element, an isothermal temperature distribution may be generated across each zone.

Abstract: A semiconductor processing system and method, which uses heat energy typically wasted in most common semiconductor processing systems, to generate power. The present invention includes a heat management system, which uses the waste heat and/or the excess heat generated by a thermal-processing chamber, to generate a current from a first thermoelectric device. The current from the first thermoelectric device is then delivered to a second thermoelectric device. The second thermoelectric device, driven by the current from the first thermoelectric device, can be used to remove heat from a cooling chamber or else add heat to another processing chamber.

Abstract: A heating apparatus, system, and method for isothermally distributing a temperature across a semiconductor device during processing. The present invention provides a furnace assembly, which includes a processing chamber configured to removably receive a plurality of semiconductor wafers. The invention includes a first heating circuit and a second heating circuit. In accordance with the present invention, the first heating circuit provides a variable temperature, which may be controlled during processing. The second heating circuit provides a constant temperature. The temperature of the first heating circuit can be adjusted to keep the process chamber temperature at the constant and uniform level provided by the second heating circuit. The wafer carrier is positioned vertically within the processing chamber using an actuation mechanism. After the wafers are processed, the actuation mechanism is used to remove the wafer carrier from the process chamber.

Abstract: An apparatus for converting thermal energy to mechanical motion including a frame mounted onto an axle above a heat source. A flow circuit including at least three elongate chambers connected by fluid conduits is mounted onto the frame, and one-way valves provided in the flow circuit permit one-way fluid flow within the flow circuit. The heat source heats a motive fluid contained within the chambers beyond its boiling point, which increases the vapor pressure within the heated chamber, thereby forcing fluid out of the chamber and into the chamber immediately downstream in the flow circuit. The increased weight of the downstream chamber creates a torque about the axle, rotating the frame in an upstream direction.

Abstract: An adapter used in conjunction with voltage modules to provide multiple and variable DC output voltages. The adapter may include a circuit for stepping down an AC input voltage to lower AC output voltages. A voltage module is provided having an interface bus, configured to be coupleable to a distribution bus on the voltage adapter. Preferably, the voltage module includes AC-DC conversion circuitry, such that the AC output voltages received from the adapter may be converted to DC voltages. Once the adapter and voltage module are coupled together, the voltage module allows the user to select among the multiple DC output voltages provided. In some embodiments, the adapter includes additional circuitry for converting the stepped-down AC voltages into DC output voltages. Additional separate voltage modules may be coupled to the first voltage module, in series, to form a modular stack of voltage modules. Like the first voltage module, the second voltage module may have a selectable output voltage, as well.