Patents Assigned to Walsin Advanced Electronics Ltd.
  • Patent number: 6278182
    Abstract: A semiconductor package containing a silicon chip, a lead frame, a plurality of conductive wires, a heat sink and some packaging material. Both the silicon chip and the heat sink are mounted on the lead frame, and the silicon chip is located between the heat sink and the lead frame. The silicon chip is electrically connected to some contact points on the lead frame by a plurality of conductive wires, and the space between the heat sink and the lead frame is filled with packaging material. The heat sink has a narrow pinhole gate and a plurality of conical positioning holes. The pinhole gate is formed in the middle of the heat sink so that packaging material can enter the mold cavity in the middle through the roof of the package. Both the pinhole gate and the positioning holes are filled with packaging material.
    Type: Grant
    Filed: August 12, 1999
    Date of Patent: August 21, 2001
    Assignee: Walsin Advanced Electronics Ltd.
    Inventors: Wen-Chun Liu, Chien-Hung Lai
  • Patent number: 6262475
    Abstract: The addition of a heat slug to a lead frame establishes a heat conduction path from a silicon chip on the lead frame to the heat slug. Hence, when a semiconductor package that encloses the lead frame and the silicon chip is formed, heat produced by the silicon chip can still be channeled away through the radiating surface of the heat slug. Furthermore, the heat slug can be bent over to cover burrs outside the package.
    Type: Grant
    Filed: February 16, 1999
    Date of Patent: July 17, 2001
    Assignees: Walsin Advanced Electronics Ltd., Sitron Precision Co., Ltd.
    Inventors: Wen-Chun Liu, Chih-Kung Huang
  • Patent number: 6204553
    Abstract: A lead frame for a semiconductor package. The lead frame includes a die pad and a plurality of leads. One surface of the die pad supports a silicon chip while the other surface has a plurality of annular grooves all having the same geometric center. The inner lead portion of the leads surrounds the die pad, but the die pad and the leads are on different planar surfaces.
    Type: Grant
    Filed: August 10, 1999
    Date of Patent: March 20, 2001
    Assignee: Walsin Advanced Electronics Ltd.
    Inventors: Wen-Chun Liu, Hui-Ping Liu, Jung-Jie Liou, Yi-Hsiang Pan, Sheng-Tung Tsai
  • Patent number: 6078099
    Abstract: A lead frame structure can prevent the warping of a semiconductor package body. The lead frame has a downset die pad and upset internal leads so that packaging material can be evenly distributed both above and below the lead frame.
    Type: Grant
    Filed: February 16, 1999
    Date of Patent: June 20, 2000
    Assignee: Walsin Advanced Electronics LTD
    Inventors: Wen-Chun Liu, Jung-Jie Liou, Chih-Kung Huang