Abstract: A device and method, which are utilized in an optical apparatus, for protecting eyes are disclosed. The optical apparatus includes a scanning-mirror component and a visible light source which is optically coupled to the scanning-mirror component. The optical apparatus emits a visible light beam to the scanning-mirror component by using the visible light source. The scanning-mirror component then reflects the visible light beam to emit the visible light beam to a scanning region. The device and the method for protecting eyes can determine at least one eye region in the scanning region, and then make the optical apparatus stop emitting the visible light beam at least within the eye region.

Abstract: A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source.

Abstract: A die bonding apparatus and a die bonding method are provided, which are capable of simultaneously bonding a plurality of dies from a first placement area onto a substrate disposed on a second placement area. The die bonding apparatus includes a die sucking device which is movably located above the first placement area and a second placement area. The die sucking device includes a plurality of nozzles. The nozzles can suck the dies disposed on the first placement area, and then simultaneously bond the dies onto the substrate.

Abstract: A package structure and a manufacturing method for the same are provided. The package structure includes a chip, a substrate and at least one adhesive layer. The chip has at least one electrode portion. The substrate has at least one circuit portion. The adhesive layer is disposed between the electrode portion and the circuit portion to form an electrical connection therebetween. The adhesive layer is a material, which comprises a metal compound, with a Negative Coefficient of Thermal Expansion (Negative CTE). Because of the material with a Negative CTE, the alignment shift can be avoided after the chip and the substrate are adhered together.

Abstract: A micro-projector, a control signal for a micro-projector and a method for generating the same are disclosed. The micro-projector includes a scanning module and a control module. The scanning module includes a micro reflection mirror and at least one scan axis connected to the micro reflection mirror. The control module connected to the scanning module outputs at least one scan axis control signal to the scanning module. The scan axis control signal is a periodic signal and has a waveform which includes a substantially linear portion and a non-linear portion. The proportion of the substantially linear portion to the waveform is larger than that of the non-linear portion to the waveform. In this manner, the unwanted vibration occurring in the micro reflection mirror of the micro-projector can be prevented.

Abstract: A light emitting diode apparatus with enhanced luminous efficiency is disclosed in the present invention. The light emitting diode apparatus includes a light emitting diode chip for providing a first light beam; a substrate, having a cross-section of a trapezoid, for supporting the light emitting diode chip, which is transparent to the first light beam; and an encapsulating body, containing a phosphor and encapsulating the light emitting diode chip and the substrate, for fixing the light emitting diode chip and the substrate and providing a second light beam when the phosphor is excited by the first light beam. Due to the shape of the substrate, contact area of the substrate with the phosphor is enlarged. Luminous efficiency is enhanced as well.

Abstract: A light emitting diode (LED) is provided. The LED comprises a semiconductor composite layer stacked laterally and a phosphor substrate. The phosphor substrate covers a lateral surface of the semiconductor composite layer.

Abstract: A light guide plate with an adjustable illumination angle and an illumination device using the same are provided. The light guide plate has a first surface and a second surface opposite to the first surface. The second surface further has a plurality of deformable microstructures thereon. The deformable microstructures will be deformed when an external force is applied to the deformable microstructures. The illumination device has a light source and a light guide plate that is disposed next to the light source. A light beam emitted from the light source enters into the light guide plate and leaves the light guide plate via reflecting or refracting by the deformable microstructures. By applying a different external force to the light guide plate, the deformation of the deformable microstructures will be varied. Therefore, the illumination angle of the light beam could be changed according to the deformation of the deformable microstructures.

Abstract: A light emitting diode device is provided. The light emitting diode device comprises a light emitting diode element, an encapsulation layer, and a plurality of pillars. The encapsulation layer is disposed on the light emitting diode element, and the pillars are disposed on the encapsulation layer. The pillars are formed by a light transmissible material.

Abstract: An alignment structure, a laser lighting source module and an optical alignment method are provided. The laser lighting source module includes a substrate and a laser carrier. The substrate includes a first body and a first surface structure. The first surface structure is disposed on a surface of the first body. The laser carrier is used for carrying a laser emitter which includes a second body and a second surface structure. The second surface structure is disposed on a surface of the second body. At least a portion of the second surface structure is correspondingly engaged with at least a portion of the first surface structure so that the laser carrier may be aligned on the substrate.

Abstract: A chip bonding process includes the following steps. At least one chip is transferred onto a carrier, and a negative pressure environment is provided. Heat is provided to the at least one chip and/or the carrier, and a positive pressure is applied onto the at least one chip.

Abstract: A chip bonding apparatus includes a chamber, a chip transportation device, a heating device and a ventilation device. The chip transportation device is used for transferring at least one chip onto a carrier within the chamber. The chip transportation device is used for transferring at least one chip onto a carrier within the chamber. The heating device is used for providing heat to the at least one chip and/or the carrier within the chamber. The ventilation device communicates gas to flow through the chamber to form a negative pressure environment therein. The negative pressure environment is provided when the chip transportation device transfers at least one chip onto the carrier within the chamber, and a positive pressure is applied onto the at least one chip when the heating device provides heat to the at least one chip and/or the carrier.

Abstract: A light emitting diode (LED) is provided. The LED includes a carrying substrate, a semiconductor composite layer and an electrode. The semiconductor composite layer is disposed on the carrying substrate, and an upper surface of the semiconductor composite layer includes a patterned surface and a flat surface. The electrode is disposed on the flat surface. A method for manufacturing the light emitting diode is provided as well.

Abstract: A vertical light emitting diodes (LEDs) with new construction for reducing the current crowding effect and increasing the light extraction efficiency (LEE) of the LEDs is provided. By providing at least one current blocking portion corresponded to an electrode, the current flows from the electrode may be diffused or distributed more laterally instead of straight downward directly under the electrode and the current crowding effect could be reduced thereby. By providing at least one current blocking portion covered by a mirror layer to form an omni-directional reflective (ODR) structure, the internal light of the LEDs may be reflected by the ODR structure and the LEE could be increased thereby.

Abstract: A method for enhancing light extraction efficiency of GaN light emitting diodes is disclosed. By cutting off a portion from each end of bottom of a sapphire substrate or forming depressions on the bottom of the substrate and forming a reflector, light beams emitted to side walls of the substrate can be guided to the light emitting diodes.

Abstract: A microminiaturized projection module for projecting an image onto an object is disclosed in the present invention. The module includes a number of light units each for providing red, green, and blue beams; an image processing unit for receiving the image, dividing the image into n×m image signals, and transforming each of the image signals into a modulating signal and a direction signal, where n and in are integrals not less than 2, respectively; a number of modulation units for modulating the beams from one light unit according to the modulating signal received from the image processing unit and sending out the modulated beams simultaneously; and an array of n×m mirrors for projecting the modulated beams to form the image onto the object according to the direction signal received from the image processing unit. The invention has advantages that can reduce modulation speed, undergo slight shock and be free from raster pinch effect.

Abstract: A vertical structure light emitting diode (LED) and a method of manufacturing the same are disclosed. The vertical structure LED includes a metal layer as an electrode; a number of luminescent layers formed on the metal layer for providing light beams; a spreading layer formed on the luminescent layers; a medium layer provided on the spreading layer, having an opening formed therethrough to expose the spreading layer and a roughed surface. The spreading layer facilitates diffusion of current produced by the electrode.

Abstract: A method for enhancing light extraction of a light emitting device is disclosed. The method includes the steps of: providing a site layer on the light emitting device; placing a protection layer on the site layer; forming an array of pores through the protection layer and the site layer; and growing on the site layer an oxide layer, having a plurality of rods, each of which is formed in one of the pores. The shapes of the rods can be well controlled by adjusting reactive temperature, time and N2/H2 concentration ratio of atmosphere such that the shape and light escape angle of the rods can be changed.