Abstract: The present invention relates to a composite data transmission interface and a judgment method thereof which is based on metal contacts shared by a smart card and a USB and comprise steps as follows: link a composite pin to a socket; electrical conductivity is completed with a socket linking a composite pin; a controller connected to the composite pin is activated by electricity; a smart card's or a USB's electrical conductivity mode is enabled by the controller by means of the smart card's or the USB's electrical connection mode.

Abstract: The present invention relates to a card-type composite interface structure comprising at least an integrated circuit module and a carrier: the carrier's height exactly matches a card reader's height and a composite connector's metal contacts are securely and electrically connected to a card reader when the carrier with the integrated circuit module mounted is inserted into a card reader; a support pad which is removed out of the carrier and toward the carrier's lower surface has its length exactly matching the height of a USB port in one computer in order to reliably sustain a supporting segment and make the composite connector's metal contacts electrically connected to the USB port when a driven structure is shifted to a default direction under effect of a user's force.

Abstract: The present invention relates to an application program execution method which allows information held in an image to be analyzed by means of a mobile device's image recognition function, depends on specific content of information held in the image to call a corresponding application program, and complete an execution. The information held in the image comprises the application program's exclusive username, password and connecting mode, for instance, a web hard drive, network video, or a decoding key.

Abstract: A multi-chip stacking method to reduce voids between stacked chips is revealed. A first chip is disposed on a substrate, and a plurality of first bonding wires are formed by wire bonding to electrically connect the first chip and the substrate. A second chip is disposed on an active surface of the first chip where a FOW (film over wire) adhesive is formed on a back surface of the second chip. The FOW adhesive partially encapsulates the first bonding wires and adheres to the active surface of the first chip. Then, the substrate is placed in a pressure oven to provide a positive pressure greater than one atm during thermally curing the FOW adhesive with exerted pressures. Accordingly, voids can be reduced inside the FOW adhesive during the multi-chip stacked processes where issues of poor adhesion and popcorn between chips can be avoided.

Abstract: The present invention provides a foldable USB connector comprising a first folding part, a second folding part and an elastic strap, facilitates effective use, saves more space to match demand for a compact design currently, and is integrated with other relevant products to create a composite product with diversified functions and advantages such as compact structure.

Abstract: The present invention is to provide a cascade data storage device comprising at least an integrated circuit module and a connecting structure wherein the integrated circuit module has a substrate, at least an electronic device, a package body and a USB metal contact and the connecting structure has at least a male connector and at least a female connector; the connecting structure is installed on a lateral edge of the package body and allows the male connector to couple with the female connector and then the integrated circuit modules freely connected, which are stacked high enough and keep the USB metal contact electrically contact with a USB port of a computer.

Abstract: The present invention provides a data sharing system with a digital key in order to deliver data sharing via Internet or a local area network by means of either at least one data storage device electrically connected to a digital box or a storage space inside a memory unit of the digital box which links a server. At the moment, a computer user could use one digital key only to link a server and further complete read-out, write-in, modification, deletion or addition of data/files in the data storage device or the storage space with the digital key's peer identification code and the digital box's peer authentication code belonging to the same group validated by the server.

Abstract: The present invention is to provide a screen storage device comprising at least an integrated circuit module and a carrier plate folded to be at least two folding sections in which the height of the integrated circuit module plus the heights of folding sections is not more than the height unit of a Universal Serial Bus (USB) male connector to embody the height of the integrated circuit module in the present invention effectively reduced and the present invention extensively employed, conveniently used, and properly accommodated with the folding section and the integrated circuit module oppositely stacked.

Abstract: A USB device structure has a memory module and at least one support element. A combined thickness of the memory module and the support element complies with a height of a male connector having at least one data transmission interface of USB, Mini USB, Micro USB and e-SATA. Accordingly, the USB device structure of the present invention can effectively reduce the thickness of a storage device and can be extensively applied to advertisement and promotion and properly stored.

Abstract: The present invention is to provide a thin data storage device with a support pad's length positioned at a USB port's height in a way for a supporting segment securely supported and a USB metal contact effectively and electrically connected to a female connector of the USB port without problems such as invalid electrical connection or poor contact between a USB metal contact and a female connector of a computer's USB port affected by the integrated circuit module's thinned thickness. Relying on the lowered thickness of the integrated circuit module, the present invention is effective in extensive applications to other products.

Abstract: The present invention relates to a folding structure comprising a storage device with an electronic component at least and a plurality of metal contacts and is configured with electronic component(s), metal contacts, and a plug board or a folding kit to embody the present invention's space effectively used and saved, match the present product's design requirements for lightness, thinness, shortness, and smallness, and integrate with other relevant products to become a combinational product with both multiple functions and its shape advantageous to lightness, thinness, shortness, and smallness.

Abstract: The present invention provides a USB port comprising a support pad for the support pad's both first surface and second surface compatible to the data transfer interface of the USB Series A male connector and plugged into a female socket for fewer costs spent in purchasing any device attributed to any damaged USB port or female socket in the past and a USB port plugged along a restricted direction.

Abstract: Disclosed is a mold array process (MAP) method to encapsulate cut edges of substrate units. A substrate strip includes a plurality of substrate units arranged in a matrix. Scribe lines are defined between adjacent substrate units and at the peripheries of the matrix where pre-cut grooves are formed along the scribe lines with a width greater than the width of the scribe lines. An encapsulant is formed on the matrix of the substrate strip to continuously encapsulate the substrate units and the scribe lines to enable the encapsulant to fill into the pre-cut grooves to further encapsulate the cut edges of the substrate units. The cut edges of the substrate units are still encapsulated by the encapsulant even after singulation processes where substrate units are singulated into individual semiconductor packages to prevent the exposure of the plated traces of the substrate units to enhance the moisture resistance capability of the semiconductor packages.

Abstract: A multi-chip stacking method to reduce voids between stacked chips is revealed. A first chip is disposed on a substrate, and a plurality of first bonding wires are formed by wire bonding to electrically connect the first chip and the substrate. A second chip is disposed on an active surface of the first chip where a FOW (film over wire) adhesive is formed on a back surface of the second chip. The FOW adhesive partially encapsulates the first bonding wires and adheres to the active surface of the first chip. Then, the substrate is placed in a pressure oven to provide a positive pressure greater than one atm during thermally curing the FOW adhesive with exerted pressures. Accordingly, voids can be reduced inside the FOW adhesive during the multi-chip stacked processes where issues of poor adhesion and popcorn between chips can be avoided.

Abstract: A high-density integrated circuit module structure comprises a substrate and a heat sink at least wherein the substrates form a reversely-staggered contacting stack structure by electrically contacting heat sinks and heat conductors on the heat sink have a non-flat structure at least to realize the present invention which extends the product's functions within an electronic product's restricted height and has a better vibration resistance capability, heat dissipation effect, and no steps involving junctions between solder balls and a carrier in an assembling procedure to simply an assembling procedure with improved functions, increased capacity, and reduced manufacturing costs.

Abstract: A multi-chip stacking method to reduce voids between stacked chips is revealed. A first chip is disposed on a substrate, and a plurality of first bonding wires are formed by wire bonding to electrically connect the first chip and the substrate. A second chip is disposed on an active surface of the first chip where a dielectric layer and a FOW adhesive (film over wire) adhesive are attached onto a back surface of the second chip. The FOW adhesive partially encapsulates the first bonding wires and adheres to the active surface of the first chip. Then, the substrate is placed in a pressure oven to provide a positive pressure greater than one atm during thermally curing the FOW adhesive with exerted pressures. Accordingly, voids can be reduced inside the FOW adhesive during the multi-chip stacked processes where issues of poor adhesion and popcorn between chips can be avoided.

Abstract: The present invention relates to an attached-type memory device, which includes a support seat, a connection part. The support seat has an accommodation room for housing a flash memory; the connection part contains at least an elastic sleeve member and at least a fitting member, in which the fitting member is integrated with the support seat, and two sides of the elastic sleeve member are disposed on two side edges of an end face of the fitting member.

Abstract: A heat dissipation device of electronic circuit modules has a substrate, a heat dissipation element and a housing. The housing is hollow and has an airflow passage therein. Heat generated when electronic components of the substrate is operated is conducted to the heat dissipation element and is guided out of the device by heat convection generated inside the housing by the design of the airflow passage.

Abstract: A structure having an USB memory module has a housing and a storage device. The housing is hollow and has a chamber defined therein. The memory module of the data storage device is partially received in the chamber of the housing and partially exposed beyond the housing.

Abstract: An inversely alternate stacked structure of integrated circuit (IC) modules includes at least one IC module, and at least a spring strip set. The IC module contains a substrate, at least an IC chip and a molding body, in which the substrate has an inner surface and an outer surface, at least an external contact pad is provided on one end of the outer surface, and at least a switch contact pad is provided on the other end of the outer surface, the external contact pad and the switch contact pad are disposed in an inversely symmetrical manner. The spring strip set has at least a non-flat structure. The external contact pad of an IC module is electrically connected with the switch contact pad of another IC module via the electrical contact of the non-flat structure so that the IC modules are integrated to form an inversely alternate stacked structure.